Patent classifications
H05K3/1241
PRINTED CIRCUIT BOARD, METHOD, AND SYSTEM
A printed circuit board (PCB) including a rigid dielectric layer having a curved geometry, and a conductive layer attached to the dielectric layer. A method for making a printed circuit board (PCB) including depositing a layer of dielectric material onto a surface, curing and sintering the material on the surface, depositing a first layer of conductive material on the layer of dielectric material, and depositing a second layer of conductive material on the first layer of conductive material, the second layer being thinner in cross section than the first layer. A system for producing a curved rigid PCB including a housing, a build platform disposed in the housing, a mobile robotic depositor disposed upon the build platform, and a print head disposed in the housing and in printing proximity to the build platform, the head having a plurality of deposition nozzles and a laser.
LIQUID METAL-BASED FLEXIBLE ELECTRONIC DEVICE AND PREPARATION METHOD AND USE THEREOF
A liquid metal-based flexible electron device and a preparation method are disclosed. In the method, 3D printing and the characteristic that ABS plastic can be dissolved by acetone are utilized, and a microchannel is quickly constructed in the flexible substrate of Ecoflex, and liquid metal is then injected into the microchannel to complete the manufacturing of a flexible electronic device. The gold film on the surface of ABS is transferred to the surface of the flexible Ecoflex substrate.
Additive manufactured 3D electronic substrate
A method of forming electronic substrates and assemblies is provided. The method includes depositing a material. The material is deposited as a powder or slurry. The method includes sintering the material, and retrieving an article, including a solid electronic substrate. Also provided are electronic substrates formed by additive manufacturing, and methods of deploying the same.
Electrohydrodynamic printing of nanomaterials for flexible and stretchable electronics
Disclosed are examples for printing a one-dimensional (1D) nanomaterial for use in stretchable electronic devices. An ink comprising a nanomaterial solution is dispersed from a pneumatic dispensing system of a printing device. The 1D nanomaterial is printed in a predefined pattern on an underlying substrate positioned on a ground electrode. A voltage is applied between the printing nozzle and the ground electrode to cause the ink to form into a cone during the printing. The substrate can be modified to increase the wettability of the substrate to enhance adhesion of the ink to the substrate.
NOZZLE
The present invention provides a nozzle (201), which comprises a nozzle passage (512) and a fluid passage (511), wherein the nozzle passage has an airflow inlet (515) and an airflow outlet (516). The fluid passage has a fluid passage inlet (518) and a fluid passage outlet (514), wherein the fluid passage inlet communicates with a fluid source so that a fluid can enter the fluid passage, and the fluid passage outlet communicates with the nozzle passage so that the fluid can enter the nozzle passage, and the airflow exerted from the airflow inlet can press the fluid in the nozzle passage out of the airflow outlet. The nozzle provided by the present application can distribute a small volume of a viscous fluid and is not apt to get blocked.
ADDITIVELY MANUFACTURING FLUORINE-CONTAINING POLYMERS
A system and method of additively manufacturing a part including electrically conductive or static dissipating fluorine-containing polymers. The method includes depositing fluorine-containing polymer additive manufacturing material onto a build platform, selectively cross-linking portions of the deposited additive manufacturing material, and curing the selectively cross-linked portions such that the part is at least one of electrically conductive and static dissipating.
HIGH RESOLUTION LASER INDUCED FORWARD TRANSFER
In a method and system for laser induced forward transfer (LIFT), energy (E1,E2) is deposited according to a non-Gaussian intensity profile (Ixy) which is spatially tuned across an interface (11xy) of the donor material (11m) to cause the donor material (11m) to be ejected from the donor substrate as an extended jet (Je) momentarily bridging the transfer distance (Zt) between the donor substrate (11) and the acceptor substrate (12) during a transfer period (Tt). A locally increased intensity spike (Is) at a center of the intensity profile (Ixy) causes a relatively thick jet (J1) of donor material to branch into a relatively thin jet (J2) at a branching position (J12) between the donor substrate (11) and acceptor substrate (12). The thick jet (J1) allows a relatively large transfer (Zt) distance while the thin jet (J2) deposits a relatively small droplet (Jd) of donor material (11m).
Stretchable Interconnects for Flexible Electronic Surfaces
A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.
METHOD AND SYSTEM FOR FABRICATING FLEXIBLE ELECTRONICS
A method of fabricating at least one electronic circuit component comprises: patterning a conductive material on a fibrous substrate by aerosol jet printing in a pattern corresponding to said at least one electronic circuit component; and sintering the conductive material by hot air sintering. The fibrous substrate may be paper, for example cellulose fibre paper.
Component carrier with integrated thermally conductive cooling structures
A component carrier having a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure and an array of exposed highly thermally conductive cooling structures integrally formed with the stack and defining cooling channels in between is disclosed.