Patent classifications
H05K3/1241
Solvo-dynamic printing
The invention provides a process for producing a printed article wherein a deposit liquid is provided to a substrate together with a carrier liquid. Also provided is a printed article obtained or obtainable by the process of the invention, such as a printed article. The invention further provides an apparatus suitable for carrying out the process of the invention, comprising devices configured to provide a flow of each of the deposit liquid and carrier liquid to a substrate, a flow channel for carrying each of the said liquids and an aperture through which at least the deposit liquid must pass. In some embodiments, the process of the invention is performed using the apparatus of the invention. The invention therefore also provides the use of the apparatus of the invention to perform the process of the invention.
Component carrier having a three dimensionally printed wiring structure
A component carrier and a method for manufacturing a component carrier is described wherein the component carrier includes a carrier body with a plurality of electrically conductive layer structures and/or electrically insulating layer structures and a wiring structure on and/or in the layer structures where the wiring structure is at least partially formed as a three-dimensionally printed structure.
DIRECT-INK-WRITING METHOD FOR PRINTING STRAIN GAUGE ARRAY CIRCUIT BASED ON INSULATING STRIPS
In a direct-ink-writing (DIW) method for printing a strain gauge array circuit, several insulating strips are printed on the upper layer of the first circuit layer after the first circuit layer has been printed and cured, and the second circuit layer is then printed at the insulating strips. The functional layer of a strain gauge is printed and covered thereon without contacting the insulating strips; the head and tail electrodes of the functional layer are respectively connected to two layers of circuit layers; and finally, a layer of insulating material is printed for encapsulation. DIW is used to complete the whole printing. A new insulating method is used in a cross part of two silver lines of a row-column compound circuit. The local glue dispensing is changed to printing the insulating strips in routing regions, and ensures the strain transmission efficiency from the strain gauge substrate to the functional layer.
ADDITIVE METHOD OF FORMING A METALLIC NANOPARTICLE MICRODOT ON A SUBSTRATE, A METALLIC NANOPARTICLE MICRODOT, AND AN ELONGATE METALLIC NANOPARTICLE FEATURE
An additive method of forming a metallic nanoparticle microdot on a substrate is disclosed. The method includes: (A) estimating or obtaining a position of an outlet of a capillary tube at zero height above the substrate (zero-height position); (B) extruding a metallic nanoparticle composition from the outlet at a first height h.sub.1 above the zero-height position, including forming a fluid bridge between the outlet and the substrate; (C) optionally lifting the capillary tube relative to the substrate by a height increment of Dh while continuing to extrude the metallic nanoparticle composition from the outlet; and (D) rapidly lifting the capillary tube to separate the outlet from the fluid bridge.
Method and apparatus for printing electrical circuit directly on target surface having 3-dimensional shape, 3D printer used for the same and electrical device having electrical circuit printed by the same
A method and apparatus for printing an electric circuit directly on a target surface having a three-dimensional shape are provided. In this method, a 3D printing apparatus that can be attached to a target surface is used. In this printing method, two-dimensional information about the shape of the electric circuit to be printed and information about the three-dimensional shape of the target surface are input. Two-dimensional information about the shape of the electric circuit to be printed is adjusted based on the information about the three-dimensional shape of the target surface to generate three-dimensional information about the electric circuit to be printed. Based on this, a tool path for controlling the 3D printing apparatus is generated.
An electric circuit can be directly fabricated on a target surface having a three-dimensional shape by the method and apparatus. In addition, an electronic device having a three-dimensional electric circuit manufactured by the present method can be applied in various ways.
Methods related to metallization of ceramic substrates for shielding applications
Devices and methods related to metallization of ceramic substrates for shielding applications. In some embodiments, a method for fabricating a ceramic device can include forming a plurality of conductive features on or through a selected layer along a boundary between a first region and a second region, each conductive feature extending into the first region and the second region. The method can also include forming an assembly that includes the selected layer and one or more other layers. The method can further include separating the first region and the second region along the boundary such that each of the first region and the second region forms a side wall, the side wall including exposed portions of the conductive features, the exposed portions capable of forming electrical connection with a conductive shielding layer.
Three-dimensional printing
According to examples, a method of making a three-dimensional conductive printed part, including forming a layer of polymeric build material; selectively applying a fusing agent on a first selected area of the formed polymeric build material; selectively applying a conductive agent on a second selected area of the formed polymeric build material; and applying a solder receiving material to a portion of the first selected area and a portion of the second selected area; in which the solder receiving material is present on a surface of the conductive three-dimensional printed part is disclosed.
METHOD FOR PRINTING SILVER NANOWIRE HARNESS NETWORK STRUCTURE BY USING GLUE DISPENSER
Disclosed is a method for printing a silver nanowire harness network structure by using a glue dispenser, including the following: 1) constructing an induced PET substrate: modifying a PET substrate by a surface hydrophobic treatment method to enhance the binding force between nanowires and the PET substrate and enhance the conductivity of a nanowire network structure; 2) constructing a glue dispensing printing system and printing the nanowire harness network structure: fixing the glue dispenser to a worktable, fixing a printed PET substrate to a ufab three-dimensional moving platform for controlling the movement of the PET substrate, adjusting the moving speed of the ufab three-dimensional moving platform and the distance between a needle head and the PET substrate, controlling the glue dispensing air pressure and the glue dispensing amount of silver nanowire glue by the glue dispenser, and obtaining the nanowire harness network structure on the PET substrate.
TILT AND ROTATE DISPENSER HAVING STRAIN WAVE GEAR SYSTEM
A dispensing system includes a dispensing unit assembly configured to dispense viscous material and a gantry coupled to the frame. The gantry is configured to support the dispensing unit assembly and to move the dispensing unit assembly in x-axis and y-axis directions. The dispensing unit assembly includes a support bracket secured to the gantry and a movable bracket rotatably coupled to the support bracket by a first strain wave gear system configured to enable the rotation of the movable bracket with respect to the support bracket about a first axis. The dispensing unit assembly further includes a dispensing unit rotatably coupled to the movable bracket by a second strain wave gear system configured to enable the rotation of the dispensing unit with respect to the movable bracket about a second axis generally perpendicular to the first axis.
Lighting unit with data lines and line ends thereof for a vehicle and method for producing same
A lighting unit for a vehicle has a light source carrier with an arrangement of data lines. The lighting unit also has a plurality of light sources positioned on the light source carrier, each of which has an integrated control unit and which are interconnected via the arrangement of data lines in order to exchange data according to a predefined protocol. The rear face of the light source carrier has a plurality of cavities. The front face of the light source carrier is light-conductive, at least in the region of the cavities. The arrangement of data lines is on the rear face of the light source carrier and the line ends of the data lines lead up to or into the number of cavities. At least one light source is fitted into each of the plurality of cavities, such that each light emission surface is oriented towards the floor of the cavity and the light source is electrically contacted and held in the cavity by electrical and mechanical contact with the line ends of the data lines.