The embodiments of the present disclosure disclose a stretchable substrate and a fabricating method therefor. The stretchable substrate includes at least two regions having different stretch ratios. Any two adjacent regions having different stretch ratios include at least one same material. In the stretchable substrate of the present disclosure, because any two adjacent regions include at least one same material, a mechanical property difference between the adjacent regions is reduced, and stretch notches, shifts and other problems do not easily occur.

An array includes a support structure configured to support columns of beamformer assemblies, and a plurality of beamformer assemblies supported by the support structure. Each beamformer assembly includes at least one beamformer having at least one first beamformer segment and at least one second beamformer segment configured to interconnect with the first beamformer segment.

A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

There is provided an automated lamination system for embedding printed electronic element(s) in a composite structure. The automated lamination system includes a supply of composite prepreg material, a layup tool assembly, and a modified automated lamination apparatus laying up layer(s) of the composite prepreg material on the layup tool assembly, to form the composite structure. The modified automated lamination apparatus includes a section preparation pre-printing apparatus preparing section(s) on a top surface of a top layer of the layer(s), to obtain prepared section(s), and includes a non-contact direct write printing apparatus mechanically coupled to the section preparation pre-printing apparatus, and includes one or more supplies of electronic element materials, printed with the non-contact direct write printing apparatus, on each of the prepared section(s), to obtain the printed electronic element(s), that are embedded in the composite structure. The automated lamination system further includes a control system and a power system.

A radiation curable inkjet ink including an adhesion promoter including (1) at least one a free radical polymerizable group selected from the group consisting of an acrylate, a methacrylate, an acryl amide and a methacryl amide; (2) at least one aliphatic tertiary amine; and (3) at least one carboxylic acid or salt thereof with the proviso that the carboxylic acid is linked to an aliphatic tertiary amine via a divalent linking group selected from the group consisting of an optionally substituted methylene group and an optionally substituted ethylene group.

A method of forming a structure upon a substrate is disclosed. The method comprises: providing a substrate upon a surface of which a plurality of electrically conductive pads are disposed; depositing fluid containing a dispersion of electrically polarizable nanoparticles onto the substrate such that at least a portion of a first one of the plurality of pads is in contact with the fluid; applying an alternating electric field to the fluid using a first electrode and a second electrode, the first electrode being positioned so as to provide an effective first electrode end position from which the electric field is applied, coincident with the deposited fluid, and spaced apart from the first pad by a distance, and the second electrode being in contact with the first pad, such that a plurality of the nanoparticles are assembled to form a first elongate structure extending along at least part of the distance between the effective first electrode end position and the portion of the first pad.

According to examples, a method of making a three-dimensional conductive printed part, including forming a layer of polymeric build material; selectively applying a fusing agent on a first selected area of the formed polymeric build material; selectively applying a conductive agent on a second selected area of the formed polymeric build material; and applying a solder receiving material to a portion of the first selected area and a portion of the second selected area; in which the solder receiving material is present on a surface of the conductive three-dimensional printed part is disclosed.

A conductive tape formed by laying a conductive pathway on a tape layer is disclosed. Various apparatus and methods for laying conductive pathways to form conductive tape are disclosed. The conductive pathways may be laid by varying the lateral position of the conductive pathway on the tape substrate. Such patterns all stretchable conductive tape to be realized. Multiple conductive pathways may be laid in the tape and the lateral separation of the pathways in the tape may vary. In some embodiments the pathways are formed from conductive yarn or by printing or laying conductive ink.

The invention relates to a process of fabricating a beaded path on the surface of a substrate, the process comprising: preparing a dispersion of particles in a liquid; supplying the prepared dispersion to at least one electrically conductive microcapillary in a continuous manner; forming and maintaining a convex meniscus of the dispersion at the outlet end of the microcapillary positioned above and/or below the surface of a substrate; applying alternating voltage to the microcapillary so that a beaded structure is formed between the dispersion meniscus and the surface of the substrate; and moving the microcapillary relative to the substrate and/or the substrate relative to the microcapillary so as to deposit the particles of the formed beaded structure on the surface of the substrate and simultaneously rebuild the beaded structure formed between the dispersion meniscus and the surface of a substrate. The invention also relates to a system for realizing this process and the use of the beaded path fabricated in accordance with the process of the invention for the production of electrodes in photovoltaic cells, new generation clothing, electronic components, including flexible electronics, artificial flagella, photonic and optomechanical materials, as well as for the regeneration of damaged paths on the surface of a substrate. The present invention also relates to a kit comprising a substrate and a beaded path fabricated on the surface of that substrate according to this process. The invented process is simple, efficient, hence economical, and enables fabricating beaded paths that retain their properties after turning off the voltage initially used to form a beaded structure. Moreover, the process occurs outside a liquid environment and enables fabricating of paths in a continuous manner, that is, through the formation of the beaded structure and its simultaneous depositing on the surface of a substrate allowing the fabrication of beaded paths of arbitrary length.

In a method and system for laser induced forward transfer (LIFT), energy (E1,E2) is deposited according to a non-Gaussian intensity profile (Ixy) which is spatially tuned across an interface (11xy) of the donor material (11m) to cause the donor material (11m) to be ejected from the donor substrate as an extended jet (Je) momentarily bridging the transfer distance (Zt) between the donor substrate (11) and the acceptor substrate (12) during a transfer period (Tt). A locally increased intensity spike (Is) at a center of the intensity profile (Ixy) causes a relatively thick jet (J1) of donor material to branch into a relatively thin jet (J2) at a branching position (J12) between the donor substrate (11) and acceptor substrate (12). The thick jet (J1) allows a relatively large transfer (Zt) distance while the thin jet (J2) deposits a relatively small droplet (Jd) of donor material (11m).