Disclosed is an optical film of a double-sided structure, comprising: a body which comprises a polymer, having a first surface and a second surface opposite to each other; an accommodation mechanism provided on the first surface and the second surface; and a filler filled in the accommodation mechanism for forming a graphic structure, wherein the upper surface of the filler is just flush with the first surface and the second surface respectively to form a plane structure; or, the upper surface of the filler is lower than the first surface and the second surface respectively to form a sag structure; the body comprising the accommodation mechanism is an integral structure; the polymer comprises a thermosetting resin, a photocurable resin or a mixture of the thermosetting resin and the photocurable resin. The present application provides the optical film, so as to advantageously reduce a thickness of a film.

A method and structure for forming conductive structure such as an electric circuit, or a portion of an electric circuit, can include the use of a thermal print head and a ribbon including a carrier and a metal layer. The thermal print head is used to print a first portion of the metal layer onto a sacrificial print medium. The first portion printed has a first pattern, where a second portion having a second pattern remains on the carrier. The first pattern is a reverse image at least a portion of the electric circuit, while the second pattern includes at least a portion of the electric circuit. The second portion having the second pattern can be transferred to a circuit substrate, then used as an electric circuit.

A component-containing substrate includes a substrate base. The substrate base includes one or more wiring layers and one or more insulating layers and includes a cavity. The component-containing substrate further includes a pad at the bottom of the cavity and an electronic component bonded to a surface of the pad exposed in the cavity. A trench is formed in the surface of the pad, the trench continuing from the inside to the outside of the perimeter of the electronic component in a plan view.

A method of manufacturing a sensing decal (400), a sensing decal and a method of providing a sensing decal to a device (702), in which the method of manufacture includes providing a flexible release layer (401) having a substantially non-uniform surface (405) and printing a conductive ink layer (402) onto the non-uniform surface. An adhesive layer (403) is printed onto the conductive ink layer to produce the sensing decal. The decal can then be applied to a surface (701) of a device and the flexible release layer is removed.

According to one embodiment is a flexible circuit comprising a flexible base, a conductive polymer supported by the base, and an integrated circuit component having an elongated electrical contact, wherein the elongated electrical contact penetrates into the conductive polymer, thereby providing a robust electrical connection. According to methods of certain embodiments, the flexible circuit is manufactured using a molding process, where a conductive polymer is deposited into recesses in a mold, integrated circuit components are placed in contact with the conductive polymer, and a flexible polymer base is poured over the mold prior to curing. In an alternative embodiment, a multiple-layer flexible circuit is manufacturing using a plurality of molds.

Described herein are methods for printing conductive ink on a substrate. In one embodiment, the method for printing a conductive ink on a substrate, comprises (a) printing, using a printer, one or more layers of a non-conductive material on a surface of the substrate such that one or more channels are formed to produce a template on the surface of the substrate; and (b) printing one or more layers of the conductive ink within the one or more channels In another embodiment, substrates produced by the methods described herein are provided. In another embodiment, systems for implementing the procedures described herein are provided.

An electroconductive substrate including a base material and a metal wiring made of at least either of silver and copper, and the electroconductive substrate has an antireflection region formed on part or all of the metal wiring surface. This antireflection region is composed of roughened particles made of at least either of silver and copper and blackened particles finer than the roughened particles and embedded between the roughened particles. The blackened particles are made of silver or a silver compound, copper or a copper compound, or carbon or an organic substance having a carbon content of 25 wt % or more. The antireflection region has a surface with a center line average roughness of 15 nm or more and 70 nm or less. The electroconductive substrate is formed from metal wiring from a metal ink that forms roughened particles, followed by application of a blackening ink containing blackened particles.

The conductive device includes a substrate and an electrically conductive portion. The electrically conductive portion is provided on the substrate. The electrically conductive portion includes an electrically conductive part and a low resistance conductive layer. The electrically conductive part is provided on the substrate and includes an electrically conductive particle and an organic binder. The low resistance conductive layer covers at least part of a surface of the electrically conductive part and has lower resistivity than the electrically conductive part.

A conductive adhesive and a bonding method of circuit board are provided. The conductive adhesive includes a substrate and an insulating region formed on a surface of the substrate and a conductive region. The insulating region includes a plurality of insulating retaining walls arranged along a same direction and in intervals. The conductive region includes a plurality of conductive adhesive bodies and the conductive adhesive bodies are filled in gaps between the adjacent insulating retaining walls.

Methods for forming electrical circuitries on three-dimensional (3D) structures and devices made using the methods. A method includes forming selectively shaped 3D structures using additive manufacturing. The method includes forming undercuts on upper-level pedestals of the 3D structures that effectively act as overhanging deposition masks for selectively preventing deposition of a selected material on a corresponding portions of lower levels. The method includes simultaneously forming and electrically isolating materials directionally deposited on the 3D structure.