H05K3/1266

PRINTING APPARATUS FOR PRINTED ELECTRONICS

A printing apparatus for printed electronics according to the present invention may include: ejection head units which each have at least one nozzle for ejecting ink droplets to perform drop-on-demand or continuous printing; a jetting observation unit which is provided at one side of the nozzle and configured to observe the ink droplet ejected from the nozzle; a lighting unit which is provided at the other side of the nozzle and configured to provide light to the jetting observation unit; an alignment observation unit which is configured to observe an aligned state between the nozzle and a substrate; and a fluid supply unit which is configured to supply the ink to the nozzle, in which the ejection head units include a single-nozzle head unit, and a multi-nozzle head unit provided separately from the single-nozzle head unit.

Implementing customized PCB via creation through use of magnetic pads

A method and apparatus for implementing customized printed circuit board (PCB) via creation through use of magnetic capture pads. At least one magnetic capture pad is rendered before aqueous seed and plate processing in the PCB manufacture. The magnetic capture pad selectively provides seed material rendering copper in at least one selected region of the via.

METHOD OF PRODUCING FOIL FORMED MEMBER, METHOD OF PRODUCING WIRING SUBSTRATE, AND METHOD OF PRODUCING INTEGRATED CIRCUIT

A method of producing a foil formed member, includes: preparing a formed member on which a plastic toner image having plasticity is formed; and pressing foil against the formed member at a temperature of 70 C. or lower to form a foil image on the plastic toner image of the formed member, and a method of producing a wiring substrate, includes: preparing a substrate on which a toner image of a toner, in which a volume fraction of particles having a particle diameter of 16 m or more is less than 1%, is formed; and forming a foil image on the toner image of the substrate.

IMPLEMENTING CUSTOMIZED PCB VIA CREATION THROUGH USE OF MAGNETIC PADS

A method and apparatus for implementing customized printed circuit board (PCB) via creation through use of magnetic capture pads. At least one magnetic capture pad is rendered before aqueous seed and plate processing in the PCB manufacture. The magnetic capture pad selectively provides seed material rendering copper in at least one selected region of the via.

Implementing customized PCB via creation through use of magnetic pads

A method and apparatus are provided for implementing customized printed circuit board (PCB) via creation through use of magnetic capture pads. At least one magnetic capture pad is rendered before aqueous seed and plate processing in the PCB manufacture. The magnetic capture pad selectively provides seed material rendering copper in at least one selected region of the via.

METHOD AND SYSTEM FOR LOW TEMPERATURE PRINTING OF CONDUCTIVE METAL ALLOYS
20190132958 · 2019-05-02 ·

System and method of producing on-demand three-dimensional (3D) printed devices on flexible substrates such as paper, plastic, or polymer using metal alloy nanopowders at low temperatures of printing in the range of 150 degrees Celsius (C) to 300 degrees C. The printer disclosed herein may employ a computer-aided design graphics file given as an input to the printer. The printer will selectively release and print the metal alloy nanopowders on select areas on the substrate to form a conductive pattern.

METHOD FOR SOLVENT-FREE PRINTING CONDUCTORS ON SUBSTRATE
20190104618 · 2019-04-04 ·

A solvent-free method for fabricating conductors is disclosed. A thick patterned layer up to 13 microns containing metal precursor and reducing agent precursor are initially deposited onto a substrate using laser printing technology. The deposited patterned precursor materials are then irradiated with a newly developed high energy intense pulsed light (IPL) system in order to transform the deposited materials to thick conductive metal patterns. The easy metallization of printed patterns makes this invention an especially effective method for massive production of flexible printed circuits.

IMPLEMENTING CUSTOMIZED PCB VIA CREATION THROUGH USE OF MAGNETIC PADS

A method and apparatus are provided for implementing customized printed circuit board (PCB) via creation through use of magnetic capture pads. At least one magnetic capture pad is rendered before aqueous seed and plate processing in the PCB manufacture. The magnetic capture pad selectively provides seed material rendering copper in at least one selected region of the via.

Circuit board producing apparatus

A method for producing a circuit board includes providing a substrate on which a toner image formed of a thermoplastic toner has been formed and forming a conductive foil layer having a thickness of 0.1 ?m to 2 ?m on the toner image that has been formed on the substrate and then applying heat to the toner image and the conductive foil layer to form a wire constituted by conductive foil.

Liquid developer, circuit board, and conductive pattern forming apparatus

A liquid developer includes metallic particles that may be surface-treated using an insulating material, and a carrier liquid.