A method for equipping a film material with at least one electrically conductive conductor structure, wherein a dispersion containing metallic nanoparticles in the form of a conductor structure is applied to a thermostable transfer material and the metallic nanoparticles are sintered to form an electrically conductive conductor structure. The electrically conductive conductor structure of sintered metallic nanoparticles is then transferred from the thermostable transfer material to the non-thermostable film material. A method for producing a laminate material using the film material using at least one electrically conductive conductor structure, and to the corresponding film material and laminate material are described.

A sensing decal (400) for use in the production of a sensor, includes a flexible release layer (401), a conductive ink layer (402) and an adhesive layer (403). The conductive ink layer is printed onto a first surface (404) of the flexible release layer and the adhesive layer is printed onto the conductive ink layer. The first surface includes a substantially non-uniform surface (405) and the conductive ink layer includes at least one patterned element (503-509) providing a predetermined set of electrical properties for formation of a sensor.

A honeycomb core includes a honeycomb substrate comprised of a number of sheets. A number of traces are printed onto the sheets of the honeycomb substrate. A number of integrated electronic devices are disposed within the honeycomb substrate. The integrated electronic devices are electrically coupled to the traces.

A wiring structure that includes first wiring parts which are formed of conductive wires and second wiring parts which are formed of thicker conductive wires than the conductive wires of the first wiring parts and are connected to the first wiring parts is formed by offset printing which includes the following processes. First printing process: First conductive ink for forming the first wiring parts is transferred from a first blanket to a base. Second printing process: Second conductive ink for forming the second wiring parts is transferred from a second blanket, which is different from the first blanket, to the base.

Embodiments may relate to a microelectronic package or a die thereof which includes a die, logic, or subsystem coupled with a face of the substrate. An inductor may be positioned in the substrate. Electromagnetic interference (EMI) shield elements may be positioned within the substrate and surrounding the inductor. Other embodiments may be described or claimed.

Methods for forming electrical circuitries on three-dimensional (3D) structures and devices made using the methods. A method includes forming selectively shaped 3D structures using additive manufacturing. The method includes forming undercuts on upper-level pedestals of the 3D structures that effectively act as overhanging deposition masks for selectively preventing deposition of a selected material on a corresponding portions of lower levels. The method includes simultaneously forming and electrically isolating materials directionally deposited on the 3D structure.

The present invention provides methods for fabricating graphene workpieces. The present invention also provides for products produced by the methods of the present invention and for apparatuses used to perform the methods of the present invention.

In printed wiring that is formed, on a surface of a base member, by a film of cured electrically conductive ink and that includes: a wavy line; a first wiring element located at one side of both sides sandwiching the wavy line in a width direction; and a second wiring element located at the other side of the both sides and adjacently to the wavy line; a surplus wavy line is provided which is another wavy line, which extends along the wavy line adjacently to the wavy line between the wavy line and the first wiring element, and which is connected to the wavy line to have the same potential.

A component carrier includes a stack having a first electrically insulating layer structure and a first electrically conductive layer structure arranged on the first electrically insulating layer structure. The first electrically insulating layer structure has at least one first covered portion, which is covered by the first electrically conductive layer structure, and at least one first non-covered portion, which is not covered by the first electrically conductive layer structure. The first electrically insulating layer structure defines a recess at the at least one first non-covered portion.

The present application relates to overmoulded printed electronic parts as well as to methods for preparing overmoulded printed electronic parts using conductive trace inks such as molecular inks, thermoset resins, and reinforcing materials such as glass microspheres and glass fabric.