An object of the present invention is to provide a conductive film that is excellent in flexibility while maintaining its sufficient transparency and conductivity, and a conductive film roll, an electronic paper, a touch panel, and a flat-panel display having the same.

A conductive film having a transparent substrate and a conductive part having a fine metal wire pattern disposed on one side or both sides of the transparent substrate, wherein the fine metal wire pattern is constituted by a fine metal wire, and the conductive film satisfies the following condition (i) or (ii): (i) the fine metal wire has voids, and when the cross-sectional area of the fine metal wire is defined as S.sub.M and the total cross-sectional area of the voids included in the cross-section of the fine metal wire is defined as S.sub.Vtotal on the cross-section of the fine metal wire perpendicular to the direction of drawing of the fine metal wire, S.sub.Vtotal/S.sub.M is 0.10 or more and 0.40 or less; and (ii) when the maximum thickness of the fine metal wire on the cross-section of the fine metal wire perpendicular to the direction of drawing of the fine metal wire is defined as T, the width of the fine metal wire at a height of 0.90T from the fine metal wire interface on the transparent substrate side is defined as W.sub.0.90 and the width of the fine metal wire on the fine metal wire interface on the transparent substrate side is defined as W.sub.0, W.sub.0.90/W.sub.0 is 0.40 or more and 0.90 or less.

Described are processes for developing laminated circuit boards, as well as the resulting circuit boards themselves. Accordingly, at least two circuit boards at least partially overlap each other, and at least one through-hole is formed in an overlapping region thereof. The through-hole is filled with an electrically-conductive material, forming a through-via that enables the circuit boards to be electrically connected. When a circuit on each circuit board is laid out so that a part thereof reaches a region in which the through-via is to be formed, then that part of the circuit can be electrically connected to the through-via. Thus, portions of the circuits on the circuit boards can be electrically connected to each other via common through-vias to realize an integrated device in which the circuits on the laminated circuit boards function.

Provided is a printed circuit board using thermally and electrically conductive layer, and a manufacturing method thereof The manufacturing method for mounting a plurality of elements includes forming an electrode layer on a substrate of a PCB, forming a photo solder resist (PSR) layer in a patterned manner on a first area of the electrode layer; forming a conductive layer on the PSR layer in the patterned manner, the conductive layer being configured to conduct heat and static electricity; and mounting a plurality of elements on a second area of the side of the PCB, the second area being different from the first area.

A metal strip and a coil coating process for multilayer coating of an endless metal strip are disclosed in which a curable polymer primer is applied to a flat side of the metal strip with the aid of a roller application in order to form an electrically insulating primer layer, a curable polymer varnish is applied to this primer layer with the aid of a roller application and cured in order to form an electrically insulating varnish layer, and at least one electric conductor layer is printed at least in some areas between the primer layer and the varnish layer. In order to enable a stable and inexpensive electrical functionalization of a metal strip, it is proposed that an electrically polarizable layer be applied to at least some regions of the electric conductor layer and that the electric conductor layer and electrically polarizable layer be applied by means of a wet-on-wet process.

A method for depositing a functional material on a substrate is disclosed. An optically transparent plate having a first surface and a second surface with one or more wells is provided. After coating the second surface with a thin layer of light-absorbing material, the wells are filled with a functional material. The plate is then irradiated with a pulsed light to heat the layer of light-absorbing material in order to generate gas at an interface between the layer of light-absorbing material and the functional material to release the functional material from the wells onto a receiving substrate located adjacent to the plate.

The disclosure relates to a microcircuit forming method. The microcircuit forming method according to the disclosure comprises: a seed-layer forming step for forming a high-reflectivity seed layer on a substrate material by using a conductive material; a pattern-layer forming step for forming a pattern layer on the seed layer, the pattern layer having a pattern hole arranged thereon to allow the seed layer to be selectively exposed therethrough; a plating step for filling the pattern hole with a conductive material; a pattern-layer removing step for removing the pattern layer; and a seed-layer patterning step for removing a part of the seed layer which does not overlap the conductive material in the plating step, wherein the high-reflectivity seed layer has a specular reflection property.

A wiring structure that includes first wiring parts which are formed of conductive wires and second wiring parts which are formed of thicker conductive wires than the conductive wires of the first wiring parts and are connected to the first wiring parts is formed by offset printing which includes the following processes. First printing process: First conductive ink for forming the first wiring parts is transferred from a first blanket to a base. Second printing process: Second conductive ink for forming the second wiring parts is transferred from a second blanket, which is different from the first blanket, to the base.

A wiring structure that includes first wiring parts which are formed of conductive wires and second wiring parts which are formed of thicker conductive wires than the conductive wires of the first wiring parts and are connected to the first wiring parts is formed by offset printing which includes the following processes. First printing process: First conductive ink for forming the first wiring parts is transferred from a first blanket to a base. Second printing process: Second conductive ink for forming the second wiring parts is transferred from a second blanket, which is different from the first blanket, to the base.

Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.

A system for forming a conductive tape trace on a substrate includes a segment feeder arm configured to feed segments of conductive tape to the substrate and a segment placement armature configured to grasp and position the conductive tape segments in a predetermined pattern on the substrate. The conductive tape segments include a plurality of conductive tape bend segments and at least one conductive tape branch segment. The segment placement armature is configured to position and overlap the plurality of conductive tape bend segments on the substrate to form a conductive tape bend and position the at least one conductive tape branch segment in contact with and extending from the conductive tape bend. A roller can be included and be configured to apply a force onto the conductive tape segments positioned on the substrate. A welder that welds the conductive tape segments together can also be included.