A connector includes lead parts and terminal parts to be connected to lands of a substrate, respectively. An anisotropic conductive joining member (ACJM) is mounted in a region where the lead parts are located. The ACJM is a resin in which solder particles are dispersed. The resin can melt at a temperature lower than the melting point of the solder particles. Cream solder is placed on the lands to be connected to the terminal parts. The substrate on which the connector is mounted is passed through a reflow oven to heat both the substrate and the connector. The connection between the terminal parts and the lands by reflow soldering and the connection between the lead parts and the lands via the ACJM 40 are performed simultaneously with each other.

In systems for printing a viscous material, the printing and post processing of the viscous material are performed sequentially one after another. In an initial step, a viscous material is printed on a sample mounted on a receiver substrate using a donor module and a laser scanner, and then the donor module is replaced with a post processing system for performing a post processing operation (and vice versa). Multiple post processing operations can be performed, and multiple different materials can be printed on the same layer. The systems can increase the speed, resolution and diversity of materials printed on the same sample, and opens the possibilities for new designs.

Provided are a transparent electrode and a production method thereof, the transparent electrode using metal nanowires and/or metal nanotubes as conductive components, and showing favorable surface flatness, conductivity, and light transmittance. A transparent conductive ink is prepared by dispersing metal nanowires and/or metal nanotubes in a solution formed by dissolving a thermoset or thermoplastic binder resin having no fluidity within the range of 5 to 40° C. to a solvent, the content of the binder resin being 100 to 2500 parts by mass relative to 100 parts by mass of the metal nanowires and/or metal nanotubes. An electrode pattern having a desired shape is printed on a substrate with the transparent conductive ink, and pulsed light is irradiated to the printed electrode pattern, to thereby obtain a transparent electrode having a surface resistance of 0.1 to 500Ω/□ and a surface arithmetic average roughness Ra satisfying Ra≦5 nm.

A circuit forming method for forming a circuit with a curable resin and a conductive fluid, the method including a setting step of setting errors that occur during a circuit forming work to an automatic release error and a non-release error for each type of error, the automatic release error being to be automatically released, and the non-release error being not to be automatically released, a determination step of determining whether an error has occurred in work when the circuit is formed, and a re-execution step of automatically re-executing work determined that the error has occurred in the determination step, in a case where the error of the work is set to the automatic release error in the setting step.

A device for manufacturing a stretchable substrate structure according to an embodiment includes a carrier substrate receiving portion configured to receive a carrier substrate therein, a stretchable substrate receiving portion configured to receive a stretchable substrate in a direction facing the carrier substrate, and a diaphragm configured to be deformed by air pressure provided on one surface, wherein the diaphragm comes in contact with an entire surface of the stretchable substrate in a plane direction when deformed, such that the stretchable substrate is combined to the carrier substrate by deforming according to the deformed shape of the diaphragm.

An object is to provide a substrate for a printed wiring board that has good circuit formability while maintaining adhesion strength between a conductive layer (2) and a base film (1). The substrate includes a base film having an insulating property (1) and a conductive layer (2) formed on at least one surface of the base film (1). The maximum height Sz, which is defined in ISO25178, of the surface of the base film (1) is 0.05 μm or more and less than 0.9 μm.

Provided is an ink for use in electronic component production making use of screen printing, which is suitable for actually allowing fine lines with high precision to be drawn in screen printing, and for actually allowing successive screen printing operations to be performed. The ink for screen printing of the present invention includes surface-modified silver nanoparticles (A) and a solvent (B), and has a viscosity at a shear rate of 10 (1/s) and 25° C. of 60 Pa.Math.s or more. The surface-modified silver nanoparticles (A) each include a silver nanoparticle and an amine-containing protective agent coating the silver nanoparticle. The solvent (B) includes at least a terpene solvent. In solvent (B), a content of solvents having a boiling point of less than 130° C. is 20 wt % or less based on the total amount of solvents.

An electrical device, comprising a softening polymer layer, an electrode layer on a surface of the softening polymer layer and a cover polymer layer on the surface of the softening polymer layer. An opening in the polymer cover layer is filled with a reflowed solder, one end of the reflowed solder, located inside the opening, contacts a contact pad site portion of the electrode layer, and another end of the reflowed solder contacts an electrical connector electrode of the device.

The present application provides a conductive paste and an electronic device, and relates to the technical field of function materials. The conductive paste according to the present application includes: a base resin, a solvent, a conductive filler, a curing agent, and an auxiliary agent. The base resin is a mixture of epoxy resin and polyurethane, a weight percentage of the epoxy resin in the base resin is greater than or equal to 50%, and the epoxy resin limits the polyurethane in a structure formed by curing of the base resin. According to the technical solution of the present application, soldering can be performed directly by solder paste, and good flexibility is brought.

To form wiring on circuit board and conductor body, metal ink containing metal particles is dispensed by inkjet head straddling the circuit board and the conductor body. Then, a laser is applied by laser emitting device to the dispensed metal ink. The metal ink to which the laser is applied is baked and wiring is formed. A laser corresponding to the laser emission amount per unit of area based on the material of the circuit board, which is resin, is applied to the metal ink on the circuit board, and a laser corresponding to the laser emission amount per unit of area based on the conductor body is applied to the metal ink on the conductor body. The metal ink on the circuit board and the metal ink on the conductor body is baked appropriately, and wiring is formed appropriately straddling the circuit board and the conductor body.