An object of the present disclosure is to provide a conductive ink that is excellent in applicability and dispersibility of metal nanoparticles, and forms, through sintering, a sintered body which is excellent in substrate steady contact and conductivity. The conductive ink according to an embodiment of the present disclosure contains components (A), (B), and (C) below, wherein a content of the component (C) is from 0.1 to 5.0 parts by weight relative to 100 parts by weight of the component (A), and a viscosity at 25° C. is 100 mPa.Math.s or less: Component (A): surface-modified metal nanoparticles having a configuration in which surfaces of metal nanoparticles are coated with an organic protective agent; Component (B): a dispersion medium containing an alcohol (b-1) and a hydrocarbon (b-2); and Component (C): a polyvinyl acetal resin.

The method for manufacturing a number of electrical nodes, wherein the method includes providing a number of electronic circuits onto a first substrate, such as on a printed circuit board or other electronics substrate, optionally, a low-temperature co-fired ceramic substrate, wherein each one of the electronic circuits includes a circuit pattern and at least one electronics component in connection with the circuit pattern, wherein the electronic circuits are spaced from each other on the first substrate, thereby defining a blank area surrounding each one of the number of electronic circuits, respectively, and providing potting or casting material to embed each one of the number of electronic circuits in the potting or casting material, and, subsequently, hardening, optionally including curing, the potting or casting material to form a filler material layer of the number of electrical nodes.

Metal nanowires with uniform noble metal coatings are described. Two methods, galvanic exchange and direct deposition, are disclosed for the successful formation of the uniform noble metal coatings. Both the galvanic exchange reaction and the direct deposition method benefit from the inclusion of appropriately strong binding ligands to control or mediate the coating process to provide for the formation of a uniform coating. The noble metal coated nanowires are effective for the production of stable transparent conductive films, which may comprise a fused metal nanostructured network.

An object of the present disclosure is to provide a method for manufacturing a conductive laminate having an excellent steady contact between a conductive layer and an overcoat layer. The present disclosure provides a method for manufacturing a conductive laminate 10 including a substrate 11, a conductive layer 12, and an overcoat layer 13 being laminated, the method including the following Steps: Step A: forming the conductive layer 12 on the substrate 11 using a conductive ink containing a metal nanoparticle and a first ink resin; and Step B: forming the overcoat layer 13 on the conductive layer 12 using an overcoat layer-forming composition, the overcoat layer-forming composition containing an overcoat layer resin and an overcoat layer solvent, the overcoat layer solvent having an SP value, where a difference between the SP value and an SP value of the first ink resin is 1.0 or less in absolute value.

According to embodiments of the present invention, an ink composition is provided. The ink composition includes a plurality of nanostructures distributed in at least two cross-sectional dimension ranges, wherein each nanostructure of the plurality of nanostructures is free of a cross-sectional dimension of more than 200 nm. According to further embodiments of the present invention, a method for forming a conductive member and a conductive device are also provided.

The method for manufacturing a number of electrical nodes, wherein the method includes providing a number of electronic circuits onto a first substrate, such as on a printed circuit board or other electronics substrate, optionally, a low-temperature co-fired ceramic substrate, wherein each one of the electronic circuits includes a circuit pattern and at least one electronics component in connection with the circuit pattern, wherein the electronic circuits are spaced from each other on the first substrate, thereby defining a blank area surrounding each one of the number of electronic circuits, respectively, and providing potting or casting material to embed each one of the number of electronic circuits in the potting or casting material, and, subsequently, hardening, optionally including curing, the potting or casting material to form a filler material layer of the number of electrical nodes.

A method of forming electronic substrates and assemblies is provided. The method includes depositing a material. The material is deposited as a powder or slurry. The method includes sintering the material, and retrieving an article, including a solid electronic substrate. Also provided are electronic substrates formed by additive manufacturing, and methods of deploying the same.

A radiation curable inkjet ink comprising a polymerizable compound and a photoinitiator, characterized in that the photoinitiator comprises a functional group selected from the group consisting of an aliphatic thio-ether and an aliphatic or a (hetero)aromatic disulfide.

A method of manufacturing a conductive element is disclosed. The method being executed by an additive manufacturing system and comprises: dispensing a modeling material on a receiving medium to form a layer, and dispensing a conductive ink on the layer of modeling material to form a conductive element. In some embodiments of the invention the modeling material comprises a sintering inducing agent, and in some embodiments of the present invention a sintering inducing composition is dispensed separately from the modeling material and separately from the conductive ink.

A stretchable substrate according to an embodiment of the present invention comprises a first modulus region which has a first modulus, a second modulus region which is located in a plane direction with respect to the first modulus region and has a second modulus higher than the first modulus, and a third modulus region which is located between the first modulus region and the second modulus region and has an interface modulus which gradually changes between the first modulus and the second modulus, wherein the interface modulus of the third modulus region may be constant in the thickness direction thereof.