Systems and methods for producing electromagnetic devices are provided. The systems and methods allow for an electromagnetic device having both a substrate (e.g., polymer) and conductive material (e.g., metal) to be manufactured without using masks or other outside objects disposed over a surface (e.g., the substrate) onto which the conductive material is deposited. In one exemplary embodiment, the method includes performing additive manufacturing using a polymer to produce a device having a plurality of interconnected walls and a plurality of frequency selective surface elements, and then coating portions of the device with a conductive material. A plurality of shadowing features are formed as part of one or more of the walls to protect the frequency selective surface elements from being coated by the conductive material. Other methods, and a variety of systems that can result from the disclosed methods, are also provided.

An item may include fabric or other materials formed from intertwined strands of material. The item may include circuitry that produces signals. The strands of material may include non-conductive strands and conductive strands. The conductive strands may carry the signals produced by the circuitry. Each conductive strand may have a strand core, a conductive coating on the strand core, and an insulating layer on the conductive coating. The strand cores may be strands formed from polymer. The conductive coating may be formed from metal. Electrical connections may be made between intertwined conductive strands by selectively removing portions of the outer insulating layer to expose the conductive cores of overlapping conductive strands. A conductive material such as solder or conductive epoxy may be applied to the exposed portions of the conductive cores to electrically and mechanically connect the overlapping conductive strands.

A system and method (referred to as a method) to fabricate sensors and electronic circuits. The method prints a first thin-film having an electronic conductivity of about less than a millionth of a Siemens per meter and a permalloy directly onto the first thin-film. The permalloy has a magnetic permeability greater than a predetermined level and has a thickness within a range of about 1 to 20 microns. The system prints a second thin-film directly onto the permalloy to encapsulate the permalloy onto the first thin-film and prints conductive traces directly onto the surfaces of the first-thin-film, the permalloy, and the second thin-film. In some applications, a sensor is packaged in an additively manufactured three-dimensional cylindrical shape that can be mounted on or is a unitary part of a current carrying conductor without incising, sharing, or severing (e.g., cutting) the current carrying conductor or its insulation.

An evaporation apparatus (100) for depositing material on a flexible substrate (160) supported by a processing drum (170) is provided. The evaporation apparatus includes: a first set (110) of evaporation crucibles aligned in a first line (120) along a first direction for generating a cloud (151) of evaporated material to be deposited on the flexible substrate (160); and a gas supply pipe (130) extending in the first direction and being arranged between an evaporation crucible of the first set (110) of evaporation crucibles and the processing drum (170), wherein the gas supply pipe (130) includes a plurality of outlets (133) for providing a gas supply directed into the cloud of evaporated material, and wherein a position of the plurality of outlets is adjustable for changing a position of the gas supply directed into the cloud of evaporated material.

Water-based nanoparticle inks may be formulated to be compatible with printed electronic direct-write methods. The water-based nanoparticle inks may include a functional material (nanoparticle) in combination with an appropriate solvent system. A method may include dispersing nanoparticles in a solvent and printing a circuit in an aerosol jet process or plasma jet process.

A display panel includes a flexible base, and a circuit layer, an insulating layer, and a conductive layer that are sequentially stacked on the flexible base. The circuit layer is configured to be bonded to an external circuit structure. The conductive layer is configured such that electrical signals transmitted between the conductive layer and the circuit layer. At least one via is provided in the insulating layer, and the conductive layer is electrically connected to the circuit layer through the at least one via. At least one opening corresponding to at least partial region of the circuit layer is provided in the flexible base, and the at least one opening is configured to receive at least part of the circuit structure.

A mask frame assembly includes: a mask including a deposition pattern through which a deposition material is deposited to a deposition target; a frame to which the mask comprising the deposition pattern is combined; and a pattern position adjusting mechanism which is coupled to the frame and configured to apply a force to the frame such that a position of the deposition pattern of the mask combined to the frame is changed.

Provided is a bidirectional neural interface having excellent elasticity and electrical conductivity improved by deformation, and further having self-healability and a method of manufacturing the same. The bidirectional neural interface includes a first elastic substrate, a neural electrode disposed on the first elastic substrate and including a conductive polymer composite, and a second elastic substrate disposed on the neural electrode, wherein the conductive polymer composite includes a matrix formed of a self-healing polymer material, and a plurality of electrical conductor clusters distributed in the matrix, wherein each of the electrical conductor clusters includes particles of a first electrical conductor, and a plurality of particles of a second electrical conductor formed of the same material as that of the first electrical conductor, distributed around each of the particles of the first electrical conductor and having smaller sizes than sizes of the particles of the first electrical conductor.

A glass wiring substrate includes a glass substrate, a first wiring portion being formed on a first surface of the glass substrate, a second wiring portion being formed on a second surface opposite to the first surface, a through-hole formed in a region of the glass substrate in which the first wiring portion and the second wiring portion are not formed, the through-hole having a diameter on a second surface side larger than a diameter on a first surface side, and a through-hole portion formed in the through-hole, one end portion of the through-hole portion extending to the first wiring portion, the other end portion of the through-hole portion extending to the second wiring portion, in which a wiring pitch P.sub.1 of the first wiring portion in the vicinity of the through-hole portion is narrower than a wiring pitch P.sub.2 of the second wiring portion in the vicinity of the through-hole portion.

A light emitting diode (LED) module may include a direct current (DC) voltage node formed on a first layer. The DC voltage node may be configured to sink a first current. One or more devices may be formed on the first layer configured to provide a second current to one or more LEDs. A device of the one or more devices may carry a steep slope voltage waveform. A local shielding area may be formed in a second layer directly below the DC voltage node and the one or more devices. The local shielding area may include a substantially continuous area of conductive material. A conductive via may extend through one or more layers. The conductive via may electrically connect the DC voltage node and the local shielding area.