A method for forming a thermal and electrical path in a PCB may include forming a first removable layer over a top surface of a PCB and a second removable layer over a bottom surface of the PCB. The method may also include milling or laser drilling the PCB from the top surface to form a first cavity extending into the PCB, plating the first side panel plating the first side with a second metal to partially fill the first cavity; and milling or laser drilling from the bottom surface to form a second cavity extending into the PCB, the first cavity in a thermal communication and/or an electrical communication with the second cavity. The method may also include panel plating the first side with a second metal to fill the first cavity and the second side with the second metal to fill the second cavity, and removing the first and second removable layers from the PCB to form the PCB with a thermal and/or an electrical path comprising the first cavity and the second cavity filled with the second metal.

The invention relates to thin metal electrode films for use in high-performance device systems comprising: a substrate; an underlayer; and a primer layer coated with metal coating. The thin metal electrode film has metal wiring with high resolution on a substrate and thus has excellent electrical properties. The invention also relates to a method for manufacturing thin metal electrode film.

In one example, an electronic device housing may include a substrate, an insulating adhesive layer formed on a surface of the substrate, a patterned electroless plating layer formed on the insulating adhesive layer, and a patterned electrolytic plating layer formed on the patterned electroless plating layer.

A process of manufacturing a multilayer sheet having electrically conductive patterns comprises feeding a first polymer layer and a second polymer composition to a calendering stack, the first polymer layer having an inner electrically conductive pattern disposed thereon, the first polymer layer comprising a first polymer composition, which contains a first polymer having a first glass transition temperature, and the second polymer composition comprising a second polymer and a laser direct structure additive (LDS), the second polymer having a second glass transition temperature that is 50 to 100° C. lower than the first glass transition temperature; pressing the first polymer layer and the second polymer composition together to laminate a second polymer layer which comprises the second polymer composition to the first polymer layer, the second polymer layer having an inner surface facing the inner electrically conductive pattern of the first polymer layer and an opposing outer surface; forming an activated surface pattern on the outer surface of the second polymer layer; and applying a conductive metal on the activated surface pattern, wherein the first polymer layer is in direct physical contact with the second polymer layer.

[Object]

To provide a copper clad laminate that is capable of achieving a good volume resistivity at an electroless copper plating layer of a low dielectric resin film while suppressing a transmission loss when being applied to a flexible circuit board, and a method for producing the copper clad laminate.

[Solving Means]

A copper clad laminate of the present invention includes a low dielectric resin film having a relative permittivity of 3.5 or lower and a dissipation factor of 0.008 or lower at a frequency of 10 GHz, and an electroless copper plating layer laminated on at least one surface of the low dielectric resin film. An Ni content in the electroless copper plating layer is 0.01 to 1.2 wt %, and the electroless copper plating layer has a volume resistivity of 6.0 μΩ.Math.cm or lower.

The invention relates to an electronic board comprising: —a printed circuit board (10) comprising a first insulating layer (11), a second insulating layer (13) attached to the first insulating layer (11) and in which a through cavity (5) is formed, and at least a second conductive layer attached to the second insulating layer (13), said second conductive layer being processed so as to form at least one surface solder pad (14, 16), and —at least one first electronic component (2) and at least one second electronic component (3), the first electronic component (2) being housed in the cavity (5) of the second insulating layer (13), the second electronic component (3) being placed on the second insulating layer (13), the first electronic component (2) and the second electronic component (3) each comprising a terminal (2a, 3a) soldered to the surface solder pad (14).

A molded interconnect device that comprises a substrate and conductive elements disposed on the substrate is provided. The substrate comprising a polymer composition containing a polymer matrix that includes a thermotropic liquid crystalline polymer and from about 10 parts to about 80 parts by weight of a mineral filler per 100 parts by weight of the polymer matrix. The mineral filler has an average diameter of about 25 micrometers or less. The polymer composition contains copper in an amount of about 1,000 parts per million or less and chromium in an amount of about 2,000 parts per million or less, and further exhibits a surface resistivity of about 1×1014 ohm or more.

Provided is a method of manufacturing a printed circuit nano-fiber web. A method of manufacturing a printed circuit nano-fiber web according to an embodiment of the present invention includes (1) a step of electrospinning a spinning solution including a fiber-forming ingredient to manufacture a nano-fiber web; and (2) a step of forming a circuit pattern to coat an outer surface of nano-fiber included in a predetermined region on the nano-fiber web using an electroless plating method. According to the present invention, a circuit pattern-printed nano-fiber web having flexibility and resilience suitable for future smart devices may be realized. In addition, a circuit pattern may be densely formed to a uniform thickness on a flexible nano-fiber web using an electroless plating method, and the flexible nano-fiber web may include a plurality of pores. Accordingly, since the printed circuit nano-fiber web may satisfy waterproofness and air permeability characteristics, it can be used in various future industrial fields including medical devices, such as biopatches, and an electronic device, such as smart devices.

A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Provided is a method for manufacturing a board with a roughened surface and a method for manufacturing a board having a plated layer that allow easily manufacturing the board having a plated layer. One of embodiments is a method for manufacturing a board with a surface roughened for wiring formation. The method for manufacturing a board includes performing laser ablation on a board containing a resin at least on a surface of the board. A laser light irradiated in the laser ablation is a laser light having a pulse width of 1 ps or less, a wavelength of 320 nm or more, and an output of 1 W or less.