A circuit board that includes a substrate that has an upper surface on which a circuit pattern is formed, and a lower surface to which a plurality of bus bars that are spaced apart are fixed; a placement through hole that extends through the upper surface and the lower surface and faces a bus bar of the plurality of bus bars and in which an electronic component is placed; and a terminal conductor foil that protrudes inward into the placement through hole from the lower surface and to which a terminal of the electronic component is connected.

A method for producing a circuit board includes a first step of arranging a circuit alignment jig having a pierced portion for receiving a circuit conductor corresponding to a circuit pattern on an insulating layer formed on a metal substrate, a second step is inserting the circuit conductor into the pierced portion, and a third step is pressing the circuit conductor to the insulating layer together with the circuit alignment jig.

An apparatus includes a laminated bus bar assembly with first and second bus bars and an intervening insulator layer. A surge arrestor (e.g., a metal oxide varistor) has a body mounted on the bus bar assembly and first and second terminals on first and second opposite sides of the body. In some embodiments, the body may be at least partially disposed in an opening in the first bus bar and the second terminal may be conductively bonded to a surface of the second bus bar that faces the insulator layer. In some embodiments, the second terminal may include a conductive stud passing through an opening in the second bus bar. The apparatus may include a spring clamp attached to the first bus bar and contacting the first side of the body to retain the body.

An apparatus includes a laminated bus bar assembly with first and second bus bars and an intervening insulator layer. A surge arrestor (e.g., a metal oxide varistor) has a body mounted on the bus bar assembly and first and second terminals on first and second opposite sides of the body. In some embodiments, the body may be at least partially disposed in an opening in the first bus bar and the second terminal may be conductively bonded to a surface of the second bus bar that faces the insulator layer. In some embodiments, the second terminal may include a conductive stud passing through an opening in the second bus bar. The apparatus may include a spring clamp attached to the first bus bar and contacting the first side of the body to retain the body.

A printed circuit board and a method for the production thereof. The printed circuit board can include a shaped part made of an electrically conducting material and can be used to manage the currents and heat volumes that occur in the field of power electronics.

A controller for an electric heating device comprising a support element and a busbar which is secured on the support element and which is connected to an SMD component in an electrically conductive manner. The busbar is part of an initially single-part stamped metal plate with a severed connecting piece, which separates the metal plate into a supply element and a discharge element, the elements being connected together in an electrically conductive manner solely via the SMD component. Also disclosed is a method of producing an electric heating device generally as described above such that the supply element and the discharge element are produced from the supply element region and the discharge element region on the stamped metal plate, respectively.

A printed circuit board according to one embodiment of the present invention comprises an insulation board and a plurality of metal electrodes disposed on the insulation board, wherein: the plurality of metal electrodes include a first electrode and a second electrode; the first electrode includes a first surface parallel to an upper surface of the insulation board, a second surface facing the first surface, a first side surface disposed between the first surface and the second surface, and a second side surface facing the first side surface; a part of the first side surface and a part of the second side surface protrude toward the outside of the first electrode in the direction parallel to the upper surface of the insulation board; the first side surface protrudes farther in an area adjacent to the first surface than in an area adjacent to the second surface; and the second side surface protrudes farther in the area adjacent to the second surface than in the area adjacent to the first surface.

An insulated metal substrate (IMS) includes a metal substrate, an insulating layer, a plastic frame, and a plurality of conductive metal pads. The insulating layer is located on the metal substrate. The plastic frame is located on the insulating layer and has a plurality of aperture areas. The conductive metal pads are located on the insulating layer and are respectively located in the aperture areas, and the conductive metal pads have sidewalls are in contact with the plastic frame.

A LED module for use in a LED light, preferably a LED retrofit lamp, has a leadframe and one or more LEDs which are electrically and mechanically connected to the leadframe. The LED module has one or more stabilizing sections made from an insulating material which are introduced locally, preferably in a punctiform and/or linear manner, into intermediate spaces of the leadframe in order to fasten sections of the leadframe to one another and, preferably, to space them apart from one another.

A manufacturing method of transformer circuit board includes following steps: plate stamping, forming a plurality of metal plates with a stamping mold; primary layering, layering the metal plates that are in alignment with each other between two outer insulation layers, with an inner insulation layer disposed between the two metal plates; primary pressing, hot pressing the metal plates to fix the metal plates between the two outer insulation layers; secondary layering, layering another metal plate on the outer side of the two outer insulation layers, respectively, corresponding to the positions of the previously layered metal plates; secondary pressing, hot pressing the metal plates on the outer side of the outer insulation layers, and printing to form a solder mask layer on the outer insulation layers. Finally, cutting to form a transformer circuit board with low leakage inductance and high EMI shield.