A substrate for mounting a semiconductor element thereon includes a metal plate and columnar terminal portions composed only of plating layers and formed on one-side surface of the metal plate. The columnar terminal portions include, as an outermost plating layer, a roughened silver plating layer having acicular projections. The roughened silver plating layer has a crystal structure in which the crystal direction <101> occupies a largest proportion among the crystal directions <001>, <111> and <101>. The substrate for mounting a semiconductor element thereon can be manufactured with improved productivity owing to reduction in cost and operation time, and achieves remarkably high adhesion to sealing resin while keeping the total thickness of plating layers including the silver plating layer, which are to serve as terminals and the like, to be thin.

A multilayer board insulating sheet contains a reducing agent.

A substrate for mounting a semiconductor element thereon includes a metal plate and columnar terminal portions composed only of plating layers and formed on one-side surface of the metal plate. The columnar terminal portions include, as an outermost plating layer, a roughened silver plating layer having acicular projections. The roughened silver plating layer has a crystal structure in which the crystal direction <101> occupies a largest proportion among the crystal directions <001>, <111> and <101>. The substrate for mounting a semiconductor element thereon can be manufactured with improved productivity owing to reduction in cost and operation time, and achieves remarkably high adhesion to sealing resin while keeping the total thickness of plating layers including the silver plating layer, which are to serve as terminals and the like, to be thin.

A wiring board includes: a first insulating layer; a second insulating layer that is formed on an upper face of the first insulating layer; a first metal layer that is formed on an upper face of the second insulating layer; a third insulating layer that is formed on the upper face of the second insulating layer so as to cover the first metal layer; an opening portion that penetrates at least the second insulating layer, the first metal layer and the third insulating layer in a thickness direction of the wiring board; an electronic component that is provided in the opening portion; a filling insulating layer that fills the opening portion and covers the electronic component; and a wiring layer that is formed on an upper face of the filling insulating layer. A first step portion is formed by a side face of the second insulating layer constituting an inner side face of the opening portion and a side face of the first metal layer constituting the inner side face of the opening portion.

Cured products that are formed of a cured material obtained by curing a resin composition including (A) at least one epoxy resin, (B) at least one curing agent, and (C) at least one inorganic filler, and have a ground surface, in which the maximum depth of a depressed portion present on the ground surface is less than 10 m are useful for making printed wiring boards.

A wiring board includes: a first insulating layer; a second insulating layer that is formed on an upper face of the first insulating layer; a first metal layer that is formed on an upper face of the second insulating layer; a third insulating layer that is formed on the upper face of the second insulating layer so as to cover the first metal layer; an opening portion that penetrates at least the second insulating layer, the first metal layer and the third insulating layer in a thickness direction of the wiring board; an electronic component that is provided in the opening portion; a filling insulating layer that fills the opening portion and covers the electronic component; and a wiring layer that is formed on an upper face of the filling insulating layer. A first step portion is formed by a side face of the second insulating layer constituting an inner side face of the opening portion and a side face of the first metal layer constituting the inner side face of the opening portion.

The present invention relates to a method for forming a circuit using a seed layer. The method for forming a circuit using a seed layer according to the present invention, may realize a fine pitch, increase the adhesion of the circuit, and prevent the migration phenomenon.

A display device includes a display substrate including a display area and a pad region, a first pad portion including a plurality of first pad terminals, the plurality of first pad terminals being arranged in a first direction, and a printed circuit board (PCB) including a base film and a second pad portion. The second pad is electrically connected to the first pad portion. The second pad portion includes a plurality of second pad terminals electrically connected to the plurality of first pad terminals, and a plurality of first test lines. The plurality of second pad terminals includes a plurality of sub-pad terminals. One of the plurality of first lines is connected to a first sub-pad terminal of the plurality of sub-pad terminals, and a second sub-pad terminal of the plurality of sub-pad terminals is not connected to any of the plurality of first lines.

A printed wiring board includes a multilayer body, a first wiring layer formed on first surface of the body and including first pads, a second wiring layer embedded into second surface of the body and including second and third pads, conductor posts formed on the third pads, and via conductors formed in the body and having diameter reducing toward the second surface of the body. Each third pad has metal foil formed thereon such that each post is formed on the foil, the second wiring layer is formed such that the second pads are positioned to connect an electronic component in central portion of the second surface of the body and the third pads are positioned to connect another board in outer edge portion of the second surface of the body, and the second pads are formed such that each second pad has exposed surface recessed from the second surface.

A display device includes a display substrate including a display area and a pad region, a first pad portion including a plurality of first pad terminals, the plurality of first pad terminals being arranged in a first direction, and a printed circuit board (PCB) including a base film and a second pad portion. The second pad is electrically connected to the first pad portion. The second pad portion includes a plurality of second pad terminals electrically connected to the plurality of first pad terminals, and a plurality of first test lines. The plurality of second pad terminals includes a plurality of sub-pad terminals. One of the plurality of first lines is connected to a first sub-pad terminal of the plurality of sub-pad terminals, and a second sub-pad terminal of the plurality of sub-pad terminals is not connected to any of the plurality of first lines.