A power management module, provides an inductor including one or more electrical conductors disposed around a ferromagnetic ceramic element including one or more metal oxides having fluctuations in metal-oxide compositional uniformity less than or equal to 1.50 mol % throughout the ceramic element.

In some embodiments, the present invention is directed to an actuator which includes at least the following: a pre-stretched electro-active polymer film being pre-stretched in a single or biaxial planar directions; at least one first semi-stiff conductor attached to a first surface of the pre-stretched electro-active polymer film, wherein the first surface is parallel to the single or biaxial planar stretch directions; at least one second semi-stiff conductor attached to a second surface of the pre-stretched electro-active polymer film, wherein the second surface is opposite to the first surface; where the semi-stiff conductors are configured to: fix the pre-stretched electro-active polymer film in a pre-stretched state and allow the pre-stretched electro-active polymer film to expand; a pair of mechanical connectors coupled to each end of an active region of the pre-stretched electro-active polymer film.

There is provided a method for forming an electrically conductive ultrafine pattern which has an excellent pattern cross-sectional shape is provided by a composite technique including a printing process and a plating process, and furthermore, by imparting excellent adhesion to each interface of a laminate including a plating core pattern, an electrically conductive ultrafine pattern which can be preferably used as a highly accurate electric circuit and a method for manufacturing the same are also provided. The method includes (1) a step of applying a resin composition to form a receiving layer on a substrate; (2) a step of printing an ink containing plating core particles by a reverse offset printing method to form a plating core pattern on the receiving layer; and (3) a step of depositing a metal on the plating core pattern formed in the step (2) by an electrolytic plating method.

A stretchable board includes: a substrate having a stretching property; and a conductor portion provided on the substrate, wherein the conductor portion comprises: conductor wires intersecting with each other; and an opening surrounded by the conductor wires.

A method for producing a printed circuit board (10) having at least one embedded sensor chip (3), in which at least one sensor face (5) and terminals (4) are arranged on a face of the chip, said method comprising the following steps: a) providing an adhesive film (1), b) printing a conductor structure (2) formed from a conductive paste onto a surface of the adhesive film, c) placing the at least one sensor chip (3) with the face comprising the at least one sensor face (5) and the terminals (4) onto the conductor structure (2) formed from a conductive paste, in an indexed manner, d) curing the conductive paste, e) applying an insulation layer (6) having a conductor layer (7) arranged thereabove to the surface of the structure, created in the previous steps, comprising the chip (3), f) laminating the structure created in the previous steps, g) structuring the conductor layer (7) and forming vias (9) from the conductor layer to conductive tracks (7b, 7c) of the conductor structure on the surface of the adhesive film, and h) removing the adhesive film (1).

A wiring board includes recesses recessed to an inside of the wiring board, in a plan view, in portions connecting a far end surface to side surfaces, and an outer peripheral electroconductive layer disposed over a surface extending from the far end surface to the recesses. To electrically connect an electroconductive member to the outer peripheral electroconductive layer of the wiring board by, for example, joining such as soldering, the electroconductive member can be disposed in the recesses to be connected to the outer peripheral electroconductive layer. This structure prevents the electroconductive member from excessively protruding outward from the surface of the wiring board. Thus, a device having the wiring board installed therein can be made compact.

A wearable item comprising a conductive transfer applied to a surface of the wearable item is described. The conductive transfer comprises first and second non-conductive ink layers and an electrically conductive layer positioned between the two non-conductive ink layers. The transfer also has an adhesive layer which adheres the conductive transfer to the surface of the wearable item. The conductive transfer is configured to withstand elongation such that the resistance of the electrically conductive layer provides a resistance within a pre-specified range.

A wiring body includes an adhesive layer and a conductor pattern bonded to the adhesive layer. A surface roughness of an adhesive surface in the conductor pattern bonded to the adhesive layer is rougher than a surface roughness of another surface, which is a surface of the conductor pattern except for the adhesive surface in the conductor pattern.

A system is disclosed for transferring a substance pattern to a substrate. The system comprises a web carrying the substance pattern, a web drive mechanism for driving the web through a nip between a roller and an opposing surface, and a transport mechanism for advancing a substrate having parallel side edges towards the nip, for the substrate to be gripped in the nip and frictionally driven through the nip at the same time as, and with the same speed as, the web, the web being pressed against a surface of the substrate during passage through the nip to cause the substance pattern to transfer from the web to the substrate. The lateral abutments located on opposite sides of the substrate are movable towards and away one another and resiliently biased to grip it, the abutments serving to align the substrate with the web and to advance it towards the nip.

A wiring body includes an adhesive layer, a first conductor layer disposed on the adhesive layer that includes a first terminal portion, a resin layer covering the first conductor layer except for at least the first terminal portion, and a second conductor layer disposed on the resin layer that includes a second terminal portion. The first terminal portion and the second terminal portion are shifted from each other along a thickness direction of the adhesive layer. The first terminal portion protrudes towards a side separated from the adhesive layer in the thickness direction. In a case where the first terminal portion is projected in a direction orthogonal to the thickness direction, at least a part of a projection portion of the first terminal portion overlaps with the resin layer.