A patterned conductive article 200 includes a substrate 210 including a unitary layer 210-1 and includes a micropattern of conductive traces 220 embedded at least partially in the unitary layer. Each conductive trace extends along a longitudinal direction (y-direction) of the conductive trace and includes a conductive seed layer 230 having a top major surface 232 and an opposite bottom major surface 234 in direct contact with the unitary layer; and a unitary conductive body 240 disposed on the top major surface of the conductive seed layer. The unitary conductive body and the conductive seed layer differ in at least one of composition or crystal morphology. The unitary conductive body has lateral sidewalls 242, 244 and at least a majority of a total area of the lateral sidewalls is in direct contact with the unitary layer.

The present invention generally provides a novel method for manufacturing an electronic module with crossed conducting lines and a novel electronic module with crossed conducting lines. In particular, an aspect of the present invention is to provide a thin, single layer electronic module. It is also an object of the present invention to provide an electronic module with an embedded jumper element having reliable high quality connections and contacts. To achieve at least some of the aspects of the present invention, an embedded pre-fabricated jumper module is placed inside a printed circuit board which allows the crossing of conducting lines within the module without manufacturing additional layers over the whole PCB board. The resultant PCB will have improved contacts and will not have surface deformation.

A wiring board includes recesses recessed to an inside of the wiring board, in a plan view, in portions connecting a far end surface to side surfaces, and an outer peripheral electroconductive layer disposed over a surface extending from the far end surface to the recesses. To electrically connect an electroconductive member to the outer peripheral electroconductive layer of the wiring board by, for example, joining such as soldering, the electroconductive member can be disposed in the recesses to be connected to the outer peripheral electroconductive layer. This structure prevents the electroconductive member from excessively protruding outward from the surface of the wiring board. Thus, a device having the wiring board installed therein can be made compact.

Methods of transferring an electrically conductive material to a substrate are disclosed. The methods include: a) contacting at least a portion of the substrate with an electrically conductive material disposed on a carrier film; and b) applying heat and pressure to the substrate and carrier film for a period of time ranging from 1 to 40 seconds, at a temperature ranging from 200? F. to 450? F., and at a pressure ranging from 30 to 150 psi, such that the electrically conductive material adheres to the substrate. Methods of forming a layered structure are also disclosed.

An ink layer of an electrically conductive ink is formed on a sheet-like base and then the base is bent-deformed before the ink layer is cured, followed by curing the ink layer, thereby forming wiring. The ink layer is pliable during the bending deformation of the base, preventing breakage of the ink layer associated with the bending deformation of the base, and preventing damage to the wiring even when the wiring is finely formed.

The purpose of the present invention is to provide a garment-type electronic device capable of reducing discomfort during the wearing in the garment-type electronic device comprising an electrical wiring using stretchable conductor composition. In a part in contact with a body surface of a garment-type electronic device, a level difference at the boundary between the electrode portion where the conductor is exposed and the wiring portion covered with the insulating cover layer is substantially eliminated, whereby a garment type electronic device with a natural wearing feeling in which discomfort during wearing has been reduced is obtained. Furthermore, by providing the projections and the depressions in the fabric texture on its surface, a more natural wearing feeling is obtained. Such a garment-type electronic device can be produced by a printing transfer method.

A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.

A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.

A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.

The present invention relates to a method for forming three-dimensional (3D) patterns and products obtained thereby, especially to a method for forming three-dimensional patterns and products obtained thereby in which ink is coated on surface of a transparent substrate by an inkjet printer to form at least one layer of inkjet-printed pattern on the surface of the transparent substrate. Moreover, the transparent substrate is also sprayed with a reflective bottom layer covered over the inkjet-printed pattern. Thereby the inkjet-printed pattern is formed on the transparent substrate by the inkjet printer quickly and easily. A shiny and beautiful 3D effect is generated by the inkjet-printed pattern with a certain thickness and reflection of the reflective bottom layer. Thereby consumers are attracted to purchase related products and the industry's competitiveness is enhanced.