A wiring body includes an adhesive layer, a first conductor layer disposed on the adhesive layer that includes a first terminal portion, a resin layer covering the first conductor layer except for at least the first terminal portion, and a second conductor layer disposed on the resin layer that includes a second terminal portion. The first terminal portion and the second terminal portion are shifted from each other along a thickness direction of the adhesive layer. The first terminal portion protrudes towards a side separated from the adhesive layer in the thickness direction. In a case where the first terminal portion is projected in a direction orthogonal to the thickness direction, at least a part of a projection portion of the first terminal portion overlaps with the resin layer.

An electronic package is provided, which includes: a substrate, an electronic element disposed on the substrate, and an antenna structure disposed on the substrate. The antenna structure has a base portion and at least a support portion, the base portion including a plurality of openings and a frame separating the openings from one another, and the support portion supporting the base portion over the substrate. Therefore, no additional area is required to be defined on a surface of the substrate, and the miniaturization requirement of the electronic package is thus met.

A process for preparing an electrically conductive, adhesive tape that includes: (a) providing an article comprising a substrate and a network of electrically conductive metal traces defining cells that are transparent to visible light on the substrate; (b) embedding the network of electrically conductive traces in a polymer matrix having a surface on which a pressure sensitive adhesive is deposited; and (c) removing the substrate to form the electrically conductive, adhesive tape.

An ink layer of an electrically conductive ink is formed on a sheet-like base and then the base is bent-deformed before the ink layer is cured, followed by curing the ink layer, thereby forming wiring. The ink layer is pliable during the bending deformation of the base, preventing breakage of the ink layer associated with the bending deformation of the base, and preventing damage to the wiring even when the wiring is finely formed.

A method for depositing a functional material on a substrate is disclosed. An optically transparent plate having a first surface and a second surface with one or more wells is provided. After coating the second surface with a thin layer of light-absorbing material, the wells are filled with a functional material. The plate is then irradiated with a pulsed light to heat the layer of light-absorbing material in order to generate gas at an interface between the layer of light-absorbing material and the functional material to release the functional material from the wells onto a receiving substrate located adjacent to the plate.

In a method and an apparatus for forming on a substrate (214) a pattern of a material, a material layer is provided on an intermediate carrier (204) and an adhesive layer is provided on the material layer, wherein at least one of the material layer or the adhesive layer comprises a pattern corresponding to the pattern to be formed on the substrate (214). The material is transferred to the substrate (214) with the adhesive fixing the material to a surface (216) of the substrate (214).

A modulated inductance module includes an inductor including one or more electrical conductors disposed around a ferromagnetic ceramic element formed on a semiconductor die, wherein the inductor further has two or more metal oxides having fluctuations in metal-oxide compositional uniformity less than or equal to 1.50 mol % throughout said ceramic element, the ceramic element has crystalline grain structure having a diameter that is less than or equal to 1.5× a mean grain diameter, and the semiconductor die contains active semiconductor switches or rectifying components that are in electrical communication with the one or more electrical conductors of the inductor.

A conductive transfer for application to an article comprises first and second non-conductive layers and a conductive layer positioned between the two non-conductive layers. The conductive transfer further comprises an adhesive layer for adhering the conductive transfer to an article, such as a wearable item. The conductive layer comprises a plurality of tessellated cells defined by a printed conductive ink. The conductive layer comprises a main element and an input track with the plurality of tessellated cells being comprised over the input track of said conductive layer.

The purpose of the present invention is to provide a garment-type electronic device capable of reducing discomfort during the wearing in the garment-type electronic device comprising an electrical wiring using stretchable conductor composition. In a part in contact with a body surface of a garment-type electronic device, a level difference at the boundary between the electrode portion where the conductor is exposed and the wiring portion covered with the insulating cover layer is substantially eliminated, whereby a garment type electronic device with a natural wearing feeling in which discomfort during wearing has been reduced is obtained. Furthermore, by providing the projections and the depressions in the fabric texture on its surface, a more natural wearing feeling is obtained. Such a garment-type electronic device can be produced by a printing transfer method.

A patterned conductive article 200 includes a substrate 210 including a unitary layer 210-1 and includes a micropattern of conductive traces 220 embedded at least partially in the unitary layer. Each conductive trace extends along a longitudinal direction (y-direction) of the conductive trace and includes a conductive seed layer 230 having a top major surface 232 and an opposite bottom major surface 234 in direct contact with the unitary layer; and a unitary conductive body 240 disposed on the top major surface of the conductive seed layer. The unitary conductive body and the conductive seed layer differ in at least one of composition or crystal morphology. The unitary conductive body has lateral sidewalls 242, 244 and at least a majority of a total area of the lateral sidewalls is in direct contact with the unitary layer.