The present disclosure relates to an electronic device. The electronic device can include a device body, a control main board, and at least one function module mounted in the device body. The control main board of the electronic device is provided with a pad group and a flexible printed circuit board, such that each pad group is electrically connected to the corresponding function module by the flexible printed circuit board. The first connecting terminal of the flexible printed circuit board is electrically connected to the function module, and the pins of the second connecting terminal of the flexible printed circuit board correspond to and electrically cooperate with the pads of the pad group.

A manufacturing method of a membrane circuit board includes the following steps. Firstly, a screen plate, a first substrate body and a second substrate body are provided. Then, a conductive paste and a first circuit pattern are formed on the screen plate. Then, the conductive paste and the first circuit pattern are simultaneously printed on the first substrate body by a screen printing process. The first substrate body, the first circuit pattern and the conductive paste are collaboratively formed as a first membrane substrate. Then, a second circuit pattern is formed on the screen plate. Then, the second circuit pattern is printed on the second substrate body by the screen printing process. The second substrate body and the second circuit pattern are collaboratively formed as a second membrane substrate. Then, the second membrane substrate is aligned with the first membrane substrate.

A photosensitive conductive paste includes a quaternary ammonium salt compound (A), a carboxyl group-containing resin (B), a photopolymerization initiator (C), a reactive monomer having an unsaturated double bond (D) and conductive particles (E). The photosensitive conductive paste exhibits conductivity at low temperature within a short time and is capable of forming fine wiring with excellent adhesion to ITO and bending resistance after being exposed to high-temperature and high-humidity environments by a photolithography method; and a film forms a conductive pattern.

A method is disclosed for applying an electrical conductor to an electrically insulating substrate, which comprises providing a flexible membrane with a pattern of groove formed on a first surface thereof, and loading the grooves with a composition comprising conductive particles. The composition is, or may be made, electrically conductive. Once the membrane is loaded, the grooved first surface of the membrane is brought into contact with a front or/and back of the substrate. A pressure is then applied between the substrate and the membrane(s) so that the composition loaded to the grooves adheres to the substrate. The membrane(s) and the substrate are separated and the composition in the groove is left on the surface of the electrically insulating substrate. The electrically conductive particles in the composition are then sintered to form a pattern of electrical conductors on the substrate, the pattern corresponding to the pattern formed in the membrane(s).

A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a film, wherein the conductive circuit is made of a conductive metal layer, the conductive metal layer is a metal foil and the conductive metal layer is patterned to form the conductive circuit. Then, an electronic element is disposed on the conductive circuit of the film, and the electronic element is electrically connected to the conductive circuit. Then, the film and a supporting structure are combined by an out-mold forming technology or an in-mold forming technology, such that the electronic element is wrapped between the film and the supporting structure.

A method for depositing a functional material on a substrate is disclosed. A plate having a first surface and a second surface is provided. A layer of light scattering material is applied onto the first surface of the plate, and a layer of reflective material is applied onto the second surface of the plate. After a group of wells has been formed on the second surface of the plate, a layer of light-absorbing material is applied on the second surface of the plate. Next, the wells are partially filled with a functional material. The plate is then irradiated with a pulse of light to heat the light-absorbing material between the bottom of the well and the functional material. This heats the gas in the ullage between the light absorbing material and the functional material to increase the pressure in gas to expel the functional material from the wells onto a receiving substrate.

In a method and an apparatus for forming on a substrate (214) a pattern of a material, a material layer is provided on an intermediate carrier (204) and an adhesive layer is provided on the material layer, wherein at least one of the material layer or the adhesive layer comprises a pattern corresponding to the pattern to be formed on the substrate (214). The material is transferred to the substrate (214) with the adhesive fixing the material to a surface (216) of the substrate (214).

A method is disclosed for applying an electrical conductor to a solar cell, which comprises providing a flexible membrane with a pattern of groove formed on a first surface thereof, and loading the grooves with a composition comprising conductive particles. The composition is, or may be made, electrically conductive. Once the membrane is loaded, the grooved first surface of the membrane is brought into contact with a front or/and back of a solar cell. A pressure is then applied between the solar cell and the membrane(s) so that the composition loaded to the grooves adheres to the solar cell. The membrane(s) and the solar cell are separated and the composition in the groove is left on the solar cell surface. The electrically conductive particles in the composition are then sintered or otherwise fused to form a pattern of electrical conductor on the solar cell, the pattern corresponding to the pattern formed in the membrane(s).

Various embodiments include a solder preform for diffusion soldering comprising a sandwich structure having a multiplicity of first layers and a multiplicity of second layers alternating with one another in the sandwich structure. The first layers each comprise a metal foil. The second layers each comprise metal particles and a binder forming a paste.

A method is disclosed for applying an electrical conductor to an electrically insulating substrate, which comprises providing a flexible membrane with a pattern of groove formed on a first surface thereof, and loading the grooves with a composition comprising conductive particles. The composition is, or may be made, electrically conductive. Once the membrane is loaded, the grooved first surface of the membrane is brought into contact with a front or/and back of the substrate. A pressure is then applied between the substrate and the membrane(s) so that the composition loaded to the grooves adheres to the substrate. The membrane(s) and the substrate are separated and the composition in the groove is left on the surface of the electrically insulating substrate. The electrically conductive particles in the composition are then sintered to form a pattern of electrical conductors on the substrate, the pattern corresponding to the pattern formed in the membrane(s).