A flexible printed circuit board includes a base film having an insulating property and a plurality of interconnects laminated to at least one surface side of the base film. The plurality of interconnects includes a first interconnect and a second interconnect in a same plane. An average thickness of the second interconnect being greater than an average thickness of the first interconnect. A ratio of the average thickness of the second interconnect to the average thickness of the first interconnect is greater than or equal to 1.5 and less than or equal to 50. The first interconnect includes a first conductive underlayer and a first plating layer, and the second interconnect includes a second conductive underlayer, a second plating layer, and a third plating layer.

A mask for partial plating capable of performing partial electroplating selectively on a prescribed portion on a surface of an electrically isolated metal member provided on an insulated board is provided. Methods for producing an insulated circuit board and using the mask for partial plating are also provided. The mask for partial plating includes an insulated sheet member having an opening corresponding to the portion to be plated, and a structure including a partial region on one surface in the thickness direction of the insulated sheet member being coated with one or plural conductive sheet members attached to the region. The conductive sheet member is adhered to the surface of the insulated sheet member, for example, with an adhesive or an adhesive member. The conductive sheet member may be engaged in a recessed portion formed on the surface of the insulated sheet member.

A substrate plating method includes forming a first resist film exposing a first feeding layer on a first face of a substrate; forming a second resist film exposing a second feeding layer on a second face of the substrate opposite to the first face; holding the substrate with a clamp member in such a manner that the clamp member is in contact with the first feeding layer and the second feeding layer, and arranging a first electrode in opposed relation with the first face and a second electrode in opposed relation with the second face; and forming a plating layer on a plating-scheduled region of the first face under conditions in which a value of current supplied between the second face and the second electrode is larger than a value of current supplied between the first face and the first electrode.

Disclosed is a circuit pattern continuous manufacturing device capable of quickly manufacturing a circuit pattern having a sufficient thickness. The circuit pattern continuous manufacturing device may include: an unwinder configured to unwind a transfer film to be horizontally unfolded; a rotary drum-type continuous electroforming part configured to form a circuit pattern having a first metal layer on the surface of a rotating cathode drum through electroforming; a continuous transfer part configured to transfer the circuit pattern, formed on the surface of the cathode drum of the rotary drum-type continuous electroforming part, onto the transfer film; a first horizontal plating path configured to additionally plate the circuit pattern, transferred onto the transfer film, with a second metal layer made of the same metal as the rotary drum-type continuous electroforming part; and a rewinder configured to rewind the transfer film.

The present invention relates to a plating hanger device having a shock-absorbing structure and, more specifically, to a plating hanger device having a shock-absorbing structure, the device allowing a hanger to be transferred at a uniform speed and reducing noise and shock, which are generated during transferring, so as to enable a uniform plated layer to be formed on a substrate. According to the plating hanger device having the shock-absorbing structure, of the present invention, an elastic spring is pressed by the load of the plating hanger device and a jig, and sequentially, the elastic spring presses a connection shaft and the connection shaft presses a transfer housing so as to improve adhesion between the transfer housing and a driving gear, thereby enabling transferring at uniform speed, and reducing the noise and shock generated during transferring by means of the elastic spring.

A hydrogen evolution assisted electroplating nozzle includes a nozzle tip configured to interface with a portion of a substructure. The nozzle also includes an inner coaxial tube connected to a reservoir containing an electrolyte and an anode, the inner coaxial tube configured to dispense the electrolyte through the nozzle tip onto the portion of the substructure. The nozzle also includes an outer coaxial tube encompassing the inner coaxial tube, the outer coaxial tube configured to extract the electrolyte from the portion of the substructure. The nozzle also includes at least one contact pin configured to make electrical contact with a conductive track on the substrate.

A planar coil element of the present invention includes an insulating base film having a first surface and a second surface opposite to the first surface, a first conductive pattern deposited on the first surface side of the insulating base film, and a first insulating layer covering the first conductive pattern on the first surface side, in which the first conductive pattern includes a core body and a widening layer deposited by plating on the outer surface of the core body, the core body includes a thin conductive layer on the insulating base film, and the ratio of the average thickness of the first conductive pattern to the average circuit pitch of the first conductive pattern is 1/2 or more and 5 or less.

In the manufacture method of the present invention, an inner circuit structure is prepared, and a docking pad is formed on the first surface of the inner circuit structure. A release film is mounted on the first surface to cover the docking pad before mounting a build-up circuit structure upon the first surface. The release film and part of the build-up circuit structure above it are removed. The docking pad is therefore exposed and a docking opening is formed in the build-up circuit structure. The docking opening is for mounting a circuit board to be docked to form a circuit board module of the present invention.

A printed circuit board includes a first insulating layer; a pad disposed on the insulating layer and having a protrusion; and a protective layer disposed on the insulating layer and having an opening exposing at least a portion of the pad. The protrusion protrudes from one surface of the pad and is buried in at least one of the insulating layer and the protective layer.

Described herein are methods and systems for forming metal interconnect layers (MILs) on engineered templates and transferring these MILs to device substrates. This “off-device” approach of forming MILs reduces the complexity and costs of the overall process, allows using semiconductor processes, and reduces the risk of damaging the device substrates. An engineered template is specially configured to release a MIL when the MIL is transferred to a device substrate. In some examples, the engineered template does not include barrier layers and/or adhesion layers. In some examples, the engineered template comprises a conductive portion to assist with selective electroplating. Furthermore, the same engineered template may be reused to form multiple MILs, having the same design. During the transfer, the engineered template and device substrate are stacked together and then separated while the MIL is transitioned from the engineered template to the device substrate.