A plating-pattern plate is configured to transfer, to a substrate, a transfer pattern formed by plating. The plating-pattern plate includes a base body and transfer parts disposed on the base body. Each of the transfer parts has a transfer surface configured to have the transfer pattern to be formed on the transfer surface by plating. The transfer parts are disposed electrically independent of one another on the base body. The plating-pattern plate provides a fine conductive pattern with stable quality.

Provided is a method for manufacturing a wiring board that forms a wiring layer having favorable adhesion without a resin resist pattern. A method prepares a substrate with seed-layer including: a underlayer on the surface of an insulating substrate; and a seed layer on the surface of the underlayer, the seed layer having a predetermined pattern and containing metal; presses a solid electrolyte membrane against the seed layer and the underlayer, and applies voltage between an anode and the underlayer to reduce metal ions in the membrane and form a metal layer on the surface of the seed layer; and removes an exposed region without the seed layer and the metal layer of the underlayer to form a wiring layer including the underlayer, the seed layer and the metal layer on the surface of the substrate.

A flexible printed circuit board includes: a base film having a hole for forming a through hole; and a coil-shaped wiring layer layered on at least one surface side of the base film, wherein the wiring layer includes a land portion arranged at an inner peripheral surface of the hole and at a peripheral portion of the hole of the base film, and a winding portion arranged in a spiral shape with the land portion as an inside end portion or an outside end portion, wherein the winding portion includes a first winding portion that is an outermost circumference and a second winding portion that is inside relative to the outermost circumference, and wherein a ratio of an average thickness of the land portion to an average thickness of the second winding portion is 1.1 or more and 5 or less.

A component carrier and a method for manufacturing the same are disclosed. The component carrier includes an electrically conductive layer structure and an overhanging end. A first surface finish is formed on a first surface portion of the electrically conductive layer structure. Furthermore, the component carrier further includes a second surface finish on a second surface portion of the electrically conductive layer structure connected to the first surface finish and extending under the overhanging end.

Encapsulated electronic modules having complex contact structures may be formed by encapsulating panels containing a substrate comprising pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within terminal holes and other holes drilled in the panel within the boundaries of the cut lines. Slots may be cut in the panel along the cut lines. The interior of the holes, as well as surfaces within the slots and on the surfaces of the panel may be metallized, e.g. by a series of processes including plating. Terminals may be inserted into the terminal holes and connected to conductive features or plating within the holes. A conductive element may be provided on the substrate to connect to a terminal. Alternatively solder may be dispensed into the holes for surface mounting.

A die can be applied to a front conductive layer. Openings can be formed in the conductive layer over contact points on the die. The openings can be filled with a conductive material to electrically couple the conductive layer to the contact points on the die. The front conductive layer can be etched to form a first conductive pattern. Conductive standoffs can be formed on portions of the front conductive layer. An additional front conductive layer can be laminated onto the front side. Openings can be formed in the additional front conductive layer over the standoffs. The openings can be filled with a conductive material to electrically couple the additional conductive layer to the underlying standoffs. The additional conductive layer can be etched to form a second conductive pattern.

A process for manufacturing an electronic component having attaches includes providing a first component having a first attach, forming trenches on a portion of the first attach with a laser to form a solder stop, and providing a second component comprising a second attach. The process further includes providing solder between the first attach and the second attach to form a connection between the first component and the second component, where the trenches contain the solder to a usable area. A device produced by the process is disclosed as well.

Electrical connector includes a housing, signal contacts, and ground shields. The signal contacts are coupled to the housing and positioned for mating with mating signal contacts of a mating connector. The ground shields are coupled to the housing and at least partially surround the signal contacts to shield the signal contacts. The ground shields are plated with a ground-material composition along one or more contact segments of the ground shields that come into compression engagement with one or more other conductive members. The ground-material composition includes a tin-nickel (Sn/Ni) alloy plating layer. The signal contacts are plated with a signal-material composition that is different than the ground-material composition.

The disclosure relates to a microcircuit forming method. The microcircuit forming method according to the disclosure comprises: a seed-layer forming step for forming a high-reflectivity seed layer on a substrate material by using a conductive material; a pattern-layer forming step for forming a pattern layer on the seed layer, the pattern layer having a pattern hole arranged thereon to allow the seed layer to be selectively exposed therethrough; a plating step for filling the pattern hole with a conductive material; a pattern-layer removing step for removing the pattern layer; and a seed-layer patterning step for removing a part of the seed layer which does not overlap the conductive material in the plating step, wherein the high-reflectivity seed layer has a specular reflection property.

A method for producing a wired circuit board including a stainless steel supporting layer having a stainless steel terminal includes a first step of preparing the stainless steel supporting layer having a passive film formed on the surface thereof and a second step of forming a first gold plating layer on the surface of the stainless steel terminal. In the second step, the stainless steel supporting layer is immersed in a first gold plating solution containing a weak acid and a gold compound without containing a strong acid, and electricity is supplied to the stainless steel supporting layer so that the passive film is removed and the first gold plating layer is formed on the surface of the stainless steel terminal.