The present invention comprises: a base film on which a first element mounting part and a second element mounting part are defined; wiring patterns formed by extending from each of the first element mounting part and the second element mounting part on the base film, wherein the wiring patterns include a first terminal part in the first element mounting part and a second terminal part in the second element mounting part; and a first plating layer formed on the second terminal part, wherein the first plating layer includes a pure metal plating layer, and the first plating layer is not formed on the first terminal part.

The disclosure relates to a microcircuit forming method. The microcircuit forming method according to the disclosure comprises: a seed-layer forming step for forming a high-reflectivity seed layer on a substrate material by using a conductive material; a pattern-layer forming step for forming a pattern layer on the seed layer, the pattern layer having a pattern hole arranged thereon to allow the seed layer to be selectively exposed therethrough; a plating step for filling the pattern hole with a conductive material; a pattern-layer removing step for removing the pattern layer; and a seed-layer patterning step for removing a part of the seed layer which does not overlap the conductive material in the plating step, wherein the high-reflectivity seed layer has a specular reflection property.

A lamination circuit board structure lamination circuit board structure includes a printed circuit board substrate including conductive wiring traces on at least a first wiring face, a prepreg layer formed over the first wiring face, and a patch having an area smaller than 1,000 mm.sup.2. The patch includes conductive wiring traces formed on a wiring face and is laminated to the printed circuit board substrate over the prepreg layer, oriented with the wiring face in contact with and pressed into the prepreg layer. Portions of the prepreg layer fill interstices between the conductive wiring traces

Electrical connector includes a housing, signal contacts, and ground shields. The signal contacts are coupled to the housing and positioned for mating with mating signal contacts of a mating connector. The ground shields are coupled to the housing and at least partially surround the signal contacts to shield the signal contacts. The ground shields are plated with a ground-material composition along one or more contact segments of the ground shields that come into compression engagement with one or more other conductive members. The ground-material composition includes a tin-nickel (Sn/Ni) alloy plating layer. The signal contacts are plated with a signal-material composition that is different than the ground-material composition.

A circuit board is disposed on a substrate and includes a dielectric layer and a circuit layer. The dielectric layer is disposed on the substrate. The circuit layer is embedded in the dielectric layer and has plural traces. Each of the traces has a first top surface and a first bottom surface which are opposite to each other, and the first bottom surface faces toward the substrate. The first top surface is exposed from the dielectric layer, and an area of a vertical projection of the first top surface on the substrate is smaller than an area of a vertical projection of the first bottom surface on the substrate.

A circuit board includes a first wiring layer and a build-up structure. The build-up structure includes at least one dielectric layer and at least one second wiring layer. Each dielectric layer and each second wiring layer are alternately arranged. The at least one dielectric layer comprises an outermost dielectric layer. The at least one second wiring layer is formed on a side of the outermost dielectric layer, and comprises an outermost second wiring layer. A portion of the first wiring layer is embedded in a side of the outermost dielectric layer facing away the outermost second wiring layer, a remaining portion of the first wiring layer protrudes from the outermost dielectric layer. A method for manufacturing a circuit board is provided.

A method for manufacturing a printed-wiring assembly is provided. The method includes a first step of forming a first pattern of printed wiring extending to an end face of a substrate by copper or silver on the substrate. The method includes a second step of cutting the first pattern into a first portion on the end face side from a predetermined position and a second portion on the inner side of the predetermined position, and the cut surface in the second portion is inclined by a predetermined angle with respect to a surface perpendicular to the substrate. The method further includes a third step of forming a protective layer of the second portion so as to cover the cut surface.

The wired circuit board includes a metal supporting board, an insulating layer and a conductor layer disposed at one side in the thickness direction of the metal supporting board, a gold plate layer disposed at the other side in the thickness direction of the metal supporting board, and an adherence layer disposed between the metal supporting board and the gold plate layer. The material of the metal supporting board is a corrosion resistant alloy. In the adherence layer, gold and the metal contained in the corrosion resistant alloy are mixedly present.

A circuit board is disposed on a substrate and includes a dielectric layer and a circuit layer. The dielectric layer is disposed on the substrate. The circuit layer is embedded in the dielectric layer and has plural traces. Each of the traces has a first top surface and a first bottom surface which are opposite to each other, and the first bottom surface faces toward the substrate. The first top surface is exposed from the dielectric layer, and an area of a vertical projection of the first top surface on the substrate is smaller than an area of a vertical projection of the first bottom surface on the substrate.

A method of manufacturing a bonded substrate includes: preparing one or plurality of products to be bonded, each including a brazing material layer and a copper plate laminated on both main surfaces of a ceramic substrate, laminating, one or a plurality of products bonded and a pair of clamping members that clamp them while providing a mold releasing layer between each thereof, heating the one or the plurality of products while pressing the one or the plurality of products in the pair of clamping members to obtain the one or the plurality of bonded substrates in which the ceramic substrate and the copper plate are bonded with a bonding layer, and removing the mold releasing layer from the bonded substrate by dissolving a portion in contact with the mold releasing layer of the copper plate included in the bonded substrate by wet etching.