Provided is a novel printing process for fabricating metallic, conductive and transparent ultra-thin nanowires and patterns including same on a substrate. The process includes two different controllable steps, each designed to achieving a useful and efficient pattern.

A manufacturing method of a circuit substrate includes the following steps. A core layer having a core dielectric layer, a first patterned circuit layer and a second patterned circuit layer is provided. An electroless plating nickel layer is formed on the first patterned circuit layer and the second patterned circuit layer. The electroless plating nickel layer has a first thickness, and the first thickness is between 1 micrometer and 10 micrometers. A reducing process is performed on the electroless plating nickel layer so that the electroless plating nickel layer is thinned from the first thickness to a second thickness to form a thinned electroless plating nickel layer. The second thickness is between 0.01 micrometers and 0.9 micrometers. An electroless plating palladium layer is formed on the thinned electroless plating nickel layer. A surface metal passivation layer is formed on the electroless plating palladium layer.

According to one aspect, an apparatus includes a substrate, a conductor, and a contact pad. The substrate has a first edge, and the conductor is formed on the substrate. The contact pad has a first end and a second end, and is formed on the substrate and connected to the conductor at the first end. The contact pad has a non-uniform configuration, the non-uniform configuration including a first width and a second width, the first width and the second width being measured with respect to a common axis, the first width being wider than a second width, the second width being a width of the contact pad at the second end, the second end being coincident with the first edge.

A wiring board is provided with: an insulating layer; a base electrode layer layered on one primary surface of the insulating layer in predetermined regions; an insulating covering layer layered on one primary surface of the insulating layer in a state covering parts of edges of the base electrode layer; and a surface electrode layer plated on exposed portions of the base electrode layer not covered by the insulating covering layer, the thickness of covered portions of the base electrode layer covered by the insulating covering layer being less than the thickness of the exposed portions. The surface electrode layer is formed only on the exposed portions of the base electrode layer.

A printed circuit board includes a substrate, and a wiring provided on the substrate. The wiring includes a copper-based metal wire provided on the substrate and a surface-treated layer provided on the copper-based metal wire. The copper-based metal wire includes mainly a copper. The surface-treated layer includes an amorphous layer including oxygen and a metal with a higher oxygen affinity than the copper.

A double-sided printed circuit board and method for manufacturing requires a ceramic substrate, two circuit layers, and conductive paste. The ceramic substrate includes two opposite surfaces, and at least one through hole passing through the two opposite surfaces. The two circuit layers can be plated on the two opposite surfaces. The conductive paste is infilled into the full extent of the through hole and thermo-cured, the ingress of electroplating materials into the hole is thus prevented. The method has low process requirement and high reliability in use.

A semi-finished product for the production of a printed circuit board having a plurality of alternately arranged insulating layers and conductive layers and at least one hard gold-plated edge connector is characterized by the hard gold-plated edge connector being arranged on an inner conductive layer of the semi-finished product and being fully covered by at least one group of an insulating layer and a conductive layer. The inventive Method for producing a printed circuit board having a plurality of alternately arranged insulating layers and conductive layers and at least one hard gold-plated edge connector, where an outer conductive layer is surface treated, is characterized by the steps of providing a hard gold-plated edge connector on a group of an insulating layer and a conductive layer, covering the conductive layer and the hard gold-plated edge connector with at least one group of an insulating layer and a conductive layer, surface-treating an outer conductive layer to form connector pads for wire bonding of electronic components, cutting the insulating layers and the conductive layers down to the conductive layer forming the hard gold-plated edge connector, removing the insulating layers and conductive layers from the hard gold-plated edge connector. The inventive printed circuit board comprised of a plurality of alternately arranged insulating layers and conductive layers and at least one hard gold-plated edge connector is characterized by the hard gold-plated edge connector being arranged on an inner conductive layer of the printed circuit board, and the inner conductive layer forming the hard gold-plated edge connector protruding from the plurality of insulating layers and conductive layers.

A second wiring layer is connected to a first wiring layer via an insulating layer. The second wiring layer comprises pad structures. Each pad structure includes a first metal layer formed on the insulating layer, a second metal layer formed on the first metal layer, and a third metal layer formed on the second metal layer. The pad structures comprises a first pad structure and a second pad structure. A via-wiring diameter of the first pad structure is different from a via-wiring diameter of the second pad structure. A distance from an upper surface of the insulating layer to an upper surface of the second metal layer of the first pad structure is the same as a distance from the upper surface of the insulating layer to an upper surface of the second metal layer of the second pad structure.

A wiring board and a method for manufacturing the wiring board in which an initial Cu plated layer is formed by plating so as to cover the surface of a metallized layer and then the initial Cu plated layer is heated to be softened or melted. Copper in the softened or melted initial Cu plated layer enters into open pore portions of the metallized layer. In addition, during the heating, components of the metallized layer and components of the initial Cu plated layer are mutually thermally diffused. Consequently, when solidified later (that is, when the initial Cu plated layer becomes a lower Cu plated layer), the adhesiveness between the metallized layer and the lower Cu plated layer is improved due to, for example, an anchoring effect and a mutual thermal diffusion effect.

A printed wiring board according to as aspect of the present invention includes a base film having insulation properties and a conductive pattern including multiple wiring portions laminated, the conductive pattern running on at least one surface of the base film, wherein each wiring portion includes a first conductive portion and a second conductive portion coating an outer surface of the first conductive portion, wherein an average width of each wiring portion is 10 μm or greater to 50 μm or smaller, and an average thickness of the second conductive portion is 1 μm or greater to smaller than 8.5 μm.