The disclosure describes a soft-matter electronic device having micron-scale features, and methods to fabricate the electronic device. In some embodiments, the device comprises an elastomer mold having microchannels, which are filled with an eutectic alloy to create an electrically conductive element. The microchannels are sealed with a polymer to prevent the alloy from escaping the microchannels. In some embodiments, the alloy is drawn into the microchannels using a micro-transfer printing technique. Additionally, the molds can be created using soft-lithography or other fabrication techniques. The method described herein allows creation of micron-scale circuit features with a line width and spacing that is an order-of-magnitude smaller than those previously demonstrated.

It is an object of the present invention to provide an electromagnetic shielding film having excellent high frequency signal transmission characteristics and excellent shielding characteristics against electromagnetic waves in a high frequency region and a shielded printed wiring board including the same. An electromagnetic shielding film 1 includes a shielding layer that is formed by a first metal layer mainly comprised of nickel and a second metal layer mainly comprised of copper, an adhesive layer formed on the second metal layer side of the shielding layer, and a protective layer formed on the first metal layer side of the shielding layer which is the opposite side of the shielding layer from the second metal layer side. The first metal layer has a thickness T.sub.1 of 2 m or more and 10 m or less, and the second metal layer has a thickness T.sub.2 of 2 m or more and 10 m or less.

An adhesive composition having a low dielectric constant and dielectric loss tangent and an excellent folding endurance includes: with respect to the total of 100 parts by mass of the adhesive composition, 75 to 90 parts by mass of a styrene elastomer; 3 to 25 parts by mass of a modified polyphenyleneether resin having a polymerizable group at an end; and totally 10 parts by mass or less of an epoxy resin and an epoxy resin curing agent.

A first embodiment of the present invention provides a flexible printed circuit board (FPCB) comprising a hot melt adhesive layer and a metal foil layer sequentially stacked on an insulating layer made of a PCT film; a flexible copper clad laminate (FCCL) having a circuit pattern on the metal foil layer; a coverlay adhered to the hot melt adhesive layer formed on the insulating layer made of the PCT film while covering the metal foil layer and also provides a method of manufacturing the FPCB. A second embodiment of the present invention provides an FPCB having a pressure-sensitive adhesive layer instead of the hot-melt adhesive layer, and a method for manufacturing the FPCB having the same, and the third embodiment of the present invention provides an FPCB having a UV cured layer instead of a hot melt adhesive layer, and a method for manufacturing the FPCB having the same.

A mechanical subtractive method of manufacturing a flexible circuitry layer may include mechanically removing at least a portion of a conductive mesh, wherein, following the mechanical removal, a remaining portion of the conductive mesh forms at least a portion of a circuitry trace comprising an electrode; forming an electrical connection between the electrode and a terminal of an interfacing component, wherein the interfacing component comprises a connector; and encasing at least a portion of the circuit trace with an insulative layer.

A method of manufacturing a flexible laminate electronic device and the flexible laminate electronic device itself is disclosed. The method includes placing electronic components over a flexible substrate layer that includes electrical connections between ones of the electronic components. A first flexible additive layer that includes apertures is positioned to align ones of the electronic components in respective ones of the apertures. A subsequent flexible additive layer is arranged over the first flexible additive layer and the apertures are aligned around respective portions of ones of the electronic components protruding above the first flexible additive layer. A flexible cover layer is emplaced over the subsequent flexible additive layer.

A flexible wiring substrate includes a main substrate having flexibility, a main wiring disposed over the main substrate, a second protective sheet covering the main wiring, and an insulating member partially covering the main wiring exposed from the second protective sheet and being thinner in thickness than the second protective sheet.

A magnetic wiring circuit board includes an insulating layer, a plurality of wiring portions spaced from each other, a magnetic layer disposed so as to embed the plurality of wiring portions on the, and a suppressing portion for suppressing magnetic coupling of at least the two wiring portions.

According to an embodiment, a structure is provided. The structure comprises a silicone formed product, water, and a protective member. The silicone formed product contains hydroxyl groups in at least a portion of a surface. The water is in contact with at least the portion of the surface containing the hydroxyl groups. The protective member retains the water.

The present disclosure provides a method for preparing an electromagnetic shielding film. The method comprises the following steps: providing a carrier film layer, and preparing an insulating layer on the carrier film layer; performing conductive treatment on the insulating layer by means of vacuum plating; placing an insulating layer matrix having undergone conductive treatment in an alkaline electrolyte, and performing electroplating sedimentation on the surface of the matrix at least three times using an alkaline solution precipitation method so as to prepare a metal shielding layer; placing the metal shielding layer in a micro-etching solution, and performing surface micro-etching to obtain a micro-etched layer; and performing acid solution sedimentation treatment at least once to prepare a foamed metal layer, and sequentially preparing a conductive adhesive layer and a protective film layer on the surface of the foamed metal layer, thereby obtaining an electromagnetic shielding film.