The present invention relates to a specific azole silane compound, an oligomer thereof, a mixture comprising said compound and/or said oligomer, as well as a respective storage and working solution. Furthermore, the present invention relates to a synthesis method for said specific azole silane compound, and the use of said working solution as a surface treatment solution.

A composition for forming a protective coating on an electronic device that is in the form of a non-Newtonian fluid that exhibits both viscous and elastic properties, and that forms at least one coating that is hydrophobic, oleophobic, or oleophilic is disclosed. The viscous and elastic properties associated with the non-Newtonian fluid allows the composition to redistribute after being applied as a coating an electronic device. Methods for protecting an electronic device from liquid contaminants by applying the disclosed composition and electronic devices comprising the composition are also disclosed. An electronic device, such as a printed circuit board, having a film made of the composition is also disclosed.

The present disclosure provides a protective coating composition for circuit boards, the composition capable of i) forming a protective coating for effectively protecting a circuit board and an electrical/electronic component mounted thereon, from moisture, foreign materials, and corrosive gas, ii) reducing the formation time of a protective coating, iii) forming a protective coating capable of achieving optimal protective performance with a smaller thickness, and iv) forming a protective coating that is easier to remove. According to one aspect of the present disclosure, an embodiment of the protective coating composition for circuit boards includes a polyketone, and a solvent.

The disclosure relates to a printed circuit board with a printed circuit board core which has an upper face. A metallization layer is formed on at least some sections of the upper face. The metallization layer includes at least one first region and a second region which differs from the first region. An electric module is arranged on the first region and is connected to same in an electrically conductive manner, the second region is arranged and/or formed at a distance to the first region, and the second region surrounds and/or borders the first region. The electric module is encapsulated with a sealing material, where the encapsulation is delimited by the second region.

An electro-optical device includes a plurality of digital scanning lines, a digital signal line, and a plurality of pixel circuits. Each of the pixel circuits includes a light emitting element and a digital driving circuit. The digital driving circuit performs digital driving to turn the light emitting element ON-state or OFF-state based on a grayscale value. The digital driving circuit keeps the light emitting element ON-state by supplying a drive current to the light emitting element, in a period in which an enable signal is active, of a grayscale display period having a length corresponding to the grayscale value. The control line driving circuit sets a period in which the enable signal is active. A ratio, with respect to the grayscale display period, of an ON-state period in which the light emitting element is ON-state changes in accordance with the period in which the enable signal is active.

Disclosed are a protective coating composition for an electronic board and a method for preparing the same. The protective coating composition includes urethane-modified alkyd resins that can prevent poor grounding caused by low molecular weight siloxanes generated in a conventional silicone-type coating compositions and preventing performance degradation caused by tin whisker growth while lowering emissions of volatile organic compounds (VOCs).

A die bonding method for a micro-LED. The method includes plating tin at a die bonding position of a printed circuit board (PCB) to obtain a tin-plated layer; adding a protective layer and a flux layer on the tin-plated layer in sequence to obtain a pretreated PCB; and transferring a flip-chip micro-LED to the pretreated PCB, reflowing and die bonding to complete die bonding of the micro-LED.

A system for effectively curing dry film ink throughout its thickness on circuit boards being made applies an exposure system, a circuit board, and a method for making the circuit board. The exposure system includes a plurality of mixed light sources with different wavelengths within a range of 365 nm to 440 nm, the mixed light sources can output at least three different wavelengths of light each of substantially a single wavelength and a fourth source of light able to output light of a spectrum of wavelengths, the ranges of light being between 365 nm and 440 nm.

A method includes steps of forming an inner coating on an object and forming an outer coating in contact with the inner coating. A first solution including metal oxide nanoparticles and a first solvent is applied onto the object. The first solvent is removed to form the inner coating with the metal oxide nanoparticles. A second solution having silicon dioxide nanoparticles and a second solvent is applied onto the object. The second solvent is removed to form the outer coating with the silicon dioxide nanoparticles. The interfacial binding force between the metal oxide nanoparticles and the silicon dioxide nanoparticles is then strengthened, for example, by applying a third solution such as water, ethanol or a mixture thereof to the inner coating and the outer coating.

A composition for forming a protective coating on an electronic device that is in the form of a non-Newtonian fluid that exhibits both viscous and elastic properties, and that forms at least one coating that is hydrophobic, oleophobic, or oleophilic is disclosed. The viscous and elastic properties associated with the non-Newtonian fluid allows the composition to redistribute after being applied as a coating an electronic device. Methods for protecting an electronic device from liquid contaminants by applying the disclosed composition and electronic devices comprising the composition are also disclosed. An electronic device, such as a printed circuit board, having a film made of the composition is also disclosed.