A substrate of an electronic device includes a first set of contact pads and a first set of contact pillars having a height greater than the first set of contact pads. Components are coupled to the first set of contact pads and the first set of contact pillars in traversing directions. The components coupled to the contact pillars are positioned above the components coupled to the first set of contact pads such that at least a first portion of a first side of the component coupled to the contact traces faces a first side of the components coupled to the contact pillars. Stacking passive components in this manner can allow for increased component density without increasing package size.

A passive component includes a body including a dummy portion and a device portion. The dummy portion and the device portion extend in a first direction and are arranged such that a longitudinal axis of the device portion is offset from a longitudinal axis of the body in a second direction perpendicular to the first direction. The passive component further includes first and second electrical contacts on at least one surface of the body.

The present disclosure provides an electronic device and method of manufacturing the same. The electronic device includes a first region, a second region, an electronic component, and a first sensing element. The second region is adjacent to the first region. The first region has a first pliability. The second region has a second pliability. The second pliability is greater than the first pliability. The electronic component is disposed at the first region. The first sensing element is disposed at the second region and electrically connected to the electronic component.

A mouth guard senses impact forces and determines if the forces exceed an impact threshold. If so, the mouth guard notifies the user of the risk for injury by haptic feedback, vibratory feedback, and/or audible feedback. The mouth guard system may also remotely communicate the status of risk and the potential injury. The mouth guard uses a local memory device to store impact thresholds based on personal biometric information obtained from the user and compares the sensed forces relative to those threshold values. The mouth guard and its electrical components on the printed circuit board are custom manufactured for the user such that the mouth guard provides a comfortable and reliable fit, while ensuring exceptional performance.

An electronic device includes a carrier substrate with an electronic IC chip mounted on top of the carrier substrate. An encapsulation block on top of the front face of the carrier substrate embeds the IC chip. The encapsulation block has a through-void for positioning and confinement that extends through the encapsulation block to the top of the carrier substrate. At least one electronic component is positioned within the through-void and mounted to the top of the carrier substrate. Solder bumps or pads are located within the through-void to electrically connect the at least one electronic component to the carrier substrate.

System-in-package modules that can provide a high level of functionality, are space efficient, and are readily manufactured. In an example, a high-functionality system-in-package module can include both a wireless circuit and an antenna. In an example, a space-efficient system-in-package module can include different vertical interconnect paths that can be used to connect the wireless circuit to the antenna. In an example, instead of being shaped as a traditional rectangular cuboid, a space-efficient system-in-package module can have a shape that more closely matches contours of an enclosure for an electronic device.

An electronic device includes a system board, a power module and a conductive part. The system board includes a first surface and a second surface opposite to each other. The power module is disposed on the second surface and provides power to the semiconductor device through the system board. The conductive part is disposed on a first side of the power module adjacent to the second surface, wherein the conductive part is electrically connected with the and the system board, wherein the power is transmitted between the and the semiconductor device through the conductive part. The power module includes at least one switch circuit and a magnetic core assembly. The at least one switch circuit disposed on a second side of the power module away from the conductive part. The magnetic core assembly is arranged between the switch circuit and the conductive part.

Prepregs having a UV curable resin layer located adjacent to a first thermally curable resin layer or sandwiched between first and second thermally curable resin layers wherein the UV curable resin layer is uncured or partially cured as well as methods for preparing laminates using the prepregs wherein the laminate includes at least one UV curable resin encapsulated electrical component.

A ruggedized direct-view LED display system (100) includes a bonding matrix (215) that helps secure an array of LED chips (205) to a printed circuit board (PCB) (210). The bonding matrix may consist of an epoxy or other resin deposited on the surface (310) of the PCB after soldering the LED chips to the PCB. The bonding matrix has a thickness that is less than the thickness of the LED chips so that light-emitting outer portions (415) of the LED chips are not covered by the bonding matrix material. A method of forming the bonding matrix is also disclosed, including depositing bonding matrix material onto the PCB between the LED chips using nozzles or needles, optionally wicking excess bonding matrix material, and optionally degassing the bonding matrix material before curing it to form the bonding matrix.

A camera module and its molded circuit board assembly and manufacturing method are disclosed, wherein the molded circuit board assembly includes a circuit board and a molded base integrally formed with the circuit board through a molding process. The molded base forms a light window disposed corresponding to a photosensitive element of the camera module, wherein the light window is configured to have a trapezoidal or to multi-stair trapezoidal shape cross section which has diameters increasing from bottom to top to facilitate demoulding, so as to prevent damage to the molded base, and to avoid stray light.