The disclosure relates to a power supply module. The power supply module may include a flexible substrate and a plurality of battery cells distributed in an array on one side of the flexible substrate. Adjacent battery cells of the plurality of battery cells on each line in a first direction may be connected in series by a flexible connector to form a plurality of lines of battery cells, and the plurality of lines of battery cells may be connected in parallel through a first electrode.

A module includes: a substrate having a first surface; a first component mounted on the first surface; a first protruding electrode disposed on the first surface; a first resin film covering the first component along a shape of the first component, covering at least a part of the first surface, and partially covering the first protruding electrode; and a first shield film formed to overlap with the first resin film. The first protruding electrode includes a first sharpened portion, the first protruding electrode is exposed from the first resin film in at least a part of the first sharpened portion, and the first shield film is electrically connected to the first protruding electrode by covering a portion where the first protruding electrode is exposed from the first resin film.

A module includes: a substrate having a first surface; a first component mounted on the first surface; a resin film covering the first component along a shape of the first component and covering a part of the first surface; and one or more wires disposed to extend over the first component on a side of the resin film farther from the substrate.

The present invention relates to a method for manufacturing a circuit board assembly, which includes: mounting a plurality of components on a circuit board; preparing a mold comprising a concave portion corresponding to a shape of each of the plurality of components and a convex portion corresponding to a surface of the circuit board; providing the mold at an upper side of the circuit board and preparing a protective material to be disposed on the circuit board; disposing the protective material on the circuit board and the components by using the mold; and curing the protective material to form a protective layer.

A method for manufacturing a flex inlay is provided. The method includes providing a flexible printed circuit having opposed surfaces. The method includes attaching components to a surface of the flexible printed circuit. The method includes applying a coverlay over at least one surface of the flexible printed circuit, wherein the coverlay is patterned to not cover any components attached to the surface of the flexible printed circuit. The coverlay at least in part forms an essentially planar surface of the flex inlay.

An apparatus includes a printed circuit board (PCB), a power component disposed on the PCB, the power component to generate heat, and a multilayered coating disposed over the power component and at least a portion of the PCB to dissipate heat from the power component, the multilayered including: an electrical insulation layer comprising a non-polar compound and disposed on the power component and the at least a portion of the PCB; a chromium layer disposed on the electrical insulation layer; and a copper layer disposed on the chromium layer that is at least 10 microns (μm) thick, the copper layer conformally adhered to a top of the power component and to the PCB.

A three-dimensional (3D) printed circuit board (PCB) composite structure includes a PCB and a 3D printed composite structure. The printed circuit board includes a plurality of grooves milled in a surface of the PCB, and retaining walls of the 3D printed composite structure are deposited within the plurality of grooves in the surface of the PCB, to improve adhesion of the 3D printed composite structure to the PCB.

According to at least one aspect, a lighting device is provided. The lighting device comprises a circuit board, a light emitting diode (LED) mounted to the circuit board and configured to emit light, a lens disposed over the LED having a bottom surface facing the circuit board, a top surface opposite the bottom surface, and a lateral surface between the top and bottom surfaces, and an elastomer encapsulating at least part of the circuit board. The elastomer may not be in contact with at least part of the lateral surface of the lens so as to form a gap between the elastomer and the lateral surface of the lens.

A method can include coupling a semiconductor chip and an electrode with a substrate. Bottom and top mold die can be use, where the top mold die define a first space and a second space that is separated from the first space. The method can include injecting encapsulation material to form an encapsulation member coupled to and covering at least a portion of the substrate. The encapsulation member can include a housing unit housing the electrode. The electrode can have a conductive sidewall exposed to, and not in contact with the encapsulation member, such that there is open space between the conductive sidewall of the electrode and the encapsulation member from an uppermost surface to a bottommost surface of the encapsulation member, the substrate can having a portion exposed within the open space, and the encapsulation member can have an open cross-section perpendicular to an upper surface of the substrate.

Disclosed are a circuit board and its preparation method. The circuit board includes a base layer, a transmission wire layer including multiple conductor tabs, and an insulating and thermally conductive layer including multiple thermally conductive portions. A gap is defined between each adjacent two of the multiple conductor tabs to expose at least a portion of the base layer, and the gap is filled with a corresponding thermally conductive portion. A height of the thermally conductive portion is larger than heights of each adjacent two of the multiple conductor tabs to define a connection groove. The circuit board the disclosure providing enhances heat dissipation performance of circuit boards.