A capacitive level-sensor device, for detecting the level of a medium contained in a container, is configured for being installed on the outside of the container, in a position substantially resting against a wall of the container that is made at least in part of an electrically insulating material. The circuit support has, in a sensing region thereof, at least one first plurality of first capacitive elements, which comprise at least one first array of first electrodes, preferably set at a distance apart from one another along a level-detection axis, the first electrodes being made of an electrically conductive material and being arranged at least in part in a position corresponding to at least one first side of a supporting structure of the circuit support. The first electrodes are covered with at least one insulation or protection layer made of an electrically insulating and sealing material, which is selected from materials that include silicon, or its derivatives or compounds, and materials that include fluorine derivatives or compounds.

The disclosure provides a local stretch packaging structure, including a substrate, a flexible electronic element, a plurality of light-emitting display elements, and a packaging layer. The flexible electronic element is disposed on the substrate. These light-emitting display elements are disposed on the flexible electronic element. The packaging layer includes a packaging area and a non-packaging area. The packaging area covers the upper surface and sidewalls of these light-emitting display elements. The non-packaging area is directly covered the flexible electronic element that is not disposed with these light-emitting display elements.

A display screen and an electronic device are provided. The display screen includes an FPC, where the FPC includes a flexible substrate, a first pin, and a second pin, and the first pin and the second pin are disposed on the flexible substrate at an interval; and the flexible substrate is provided with a charge-isolating portion that is disposed between the first pin and the second pin; or the FPC further includes a packaging portion and a moisture-isolating layer, where the packaging portion covers part of the first pin and part of the second pin, and the moisture-isolating layer is disposed between the first pin and the packaging portion and between the second pin and the packaging portion.

Embodiments herein are directed to an assembly that includes a circuit board, a plurality of terminal pins, a first material layer, a second material layer, and a third material layer. The plurality of terminal pins extend from the circuit board. The first material layer encases a portion of the circuit board. The second material layer encapsulates a portion of the plurality of terminal pins and encases the first material layer. The second material layer defines a connector interface. A material of the second material layer is different from a material of the first material layer. The third material layer encases the first material layer and at least a portion of the second material layer. The third material layer defines a housing that is formed from a material different then the material of the first material layer and different from the material of the second material.

A barrier layer is disposed on a copper surface, the barrier layer including an organic molecule. The organic molecule may be a nitrogen-containing molecule. The nitrogen-containing organic molecule includes 1 to 6 carbon atoms. The barrier layer may be deposited on an exposed copper surface before deposition of a surface finish.

The present disclosure provides a substrate, a maintenance method thereof and a display device. The substrate includes a base substrate, the base substrate is provided with at least one conductive pattern, and at least one of the at least one conductive pattern is interrupted and divided into a first conductive sub-pattern and a second conductive sub-pattern. The maintenance method includes: coating a conductive material in an interruption region in such a manner as to cover both the first conductive sub-pattern and the second conductive sub-pattern; and coating an organic insulation material at a side of the conductive material away from the base substrate, and curing the organic insulation material to form an organic protection film covering the conductive material.

Provided are a surface-treated glass cloth that enables the reliability of a printed wiring board to be improved, a prepreg, and a printed wiring board. In the surface-treated glass cloth, a surface-treated layer contains a silane coupling agent, the amount of carbon attached of an adhering component of the surface-treated layer is in the range of 0.030 to 0.060% by mass, the arithmetic average height of the surface of the adhering component of the surface-treated layer is in the range of 1.0 to 3.0 nm, and the product of the amount of carbon attached of the adhering component and the arithmetic average height of the surface of the adhering component is in the range of 0.060 to 0.100.

A circuit board includes a protective film of such a type that a mating contact slides on the protective film and rides over a pad, and is prevented from deteriorating due to attachment and detachment. A circuit board 10 includes a plate-shaped base body 40, a pad 20 formed on a surface of the base body 40 and responsible for electrical contact with a mating contact, and a protective film 30 that spreads on the surface of the base body 40 in contact with an edge of the pad 20. The edge of the pad 20 and a portion, which contacts the edge of the pad 20, of the protective film 30 respectively have heights consecutive to each other. The pad 20 contacts, by causing the mating contact that has slid in a sliding direction in contact with the protective film 30 to ride over the pad 20, the mating contact that has ridden over the pad 20.

The present disclosure provides a protective coating composition for circuit boards, the composition capable of i) forming a protective coating for effectively protecting a circuit board and an electrical/electronic component mounted thereon, from moisture, foreign materials, and corrosive gas, ii) reducing the formation time of a protective coating, iii) forming a protective coating capable of achieving optimal protective performance with a smaller thickness, and iv) forming a protective coating that is easier to remove. According to one aspect of the present disclosure, an embodiment of the protective coating composition for circuit boards includes a polyketone, and a solvent.

Disclosed are a protective coating composition for an electronic board and a method for preparing the same. The protective coating composition includes urethane-modified alkyd resins that can prevent poor grounding caused by low molecular weight siloxanes generated in a conventional silicone-type coating compositions and preventing performance degradation caused by tin whisker growth while lowering emissions of volatile organic compounds (VOCs).