A wiring board (10) includes a substrate (11) that is transparent and a wiring pattern region (20) that is disposed on the substrate (11) and that includes a plurality of wiring lines (21, 22). The wiring pattern region (20) has a sheet resistance of less than or equal to 5 Ω/sq, and each wiring line (21, 22) has a maximum width of less than or equal to 3 μm when viewed at a viewing angle of 120°.

The present invention is directed to a composition comprising a thermoplastic polymer and a thermally conductive filler package comprising thermally conductive, electrically insulative filler particles having a thermal conductivity of at least 5 W/m K (measured according to ASTM D7984) and a volume resistivity of at least 10 Ωm (measured according to ASTM D257, C611, or B 193) and being present in an amount of at least 50% by volume based on total volume of the filler package. The present invention also is directed to coatings comprising a thermal conductivity of at least 0.5 W/m.Math.K (measured according to ASTM D7984) and to substrates, at least a portion of which is coated with such a coating.

A PCB includes a base layer, a wiring pattern formed on a surface of the base layer, and a protecting layer formed on the wiring pattern. The protecting layer is formed by printing and solidifying an ink on the wiring pattern. The ink includes a cycloaliphatic epoxy resin, a phenoxyl resin solution, a solvent, a hardener, and an antifoaming agent.

A transaction card having an opening in a metal card body, a booster antenna in the opening, and a molding material about the booster antenna. A process for manufacturing the transaction card includes forming an opening in a card body, inserting a booster antenna into the opening, and molding a molding material about the booster antenna.

A laminated structure for use as a thy film photoresist, which includes a supporting layer, a photosensitive resin layer and a protective layer. The protective layer is a polyester film that has a maximum surface roughness between 1,500 nm and 2,500 nm, and a sheet resistance between 1×10.sup.8Ω/□ and 1×10.sup.12Ω/□. The laminated structure is particularly applicable to the manufacture of a photosensitive device and a circuit of a printed circuit board or a lead frame.

A solder resist composition includes: a carboxyl group-containing resin; a photopolymerizable compound; a photopolymerization initiator containing a bisacylphosphine oxide-based photopolymerization initiator and an α-hydroxy alkylphenone-based photopolymerization initiator; and a phosphorescent dye. The bisacylphosphine oxide-based photopolymerization initiator contains bis-(2,4,6-trimethylbenzoyl)-phenylphosphine oxide. The α-hydroxy alkylphenone-based photopolymerization initiator contains 2-hydroxy-2-methyl-1-phenyl-propane-1-one. A mass ratio of the bis-(2,4,6-trimethylbenzoyl)-phenylphosphine oxide to the 2-hydroxy-2-methyl-1-phenyl-propane-1-one is 2:1 to 1:10.

One-component, solvent-free organosiloxane composition comprising a) a linear or branched polyorganosiloxane containing at least two alkenyl or alkynyl groups, as component A; b) a linear or branched polyorganosiloxane containing at least 3 Si—H groups, as component B; c) a hydrosilylation catalyst as component C; d) an alkynol of the general formula (I) ##STR00001## wherein R.sup.1, R.sup.2, R.sup.3 are selected independently of one another from H, C.sub.1-C.sub.6-alkyl and substituted or unsubstituted C.sub.3-C.sub.6-alkyl; or R.sup.1 is selected from H, C.sub.1-C.sub.6-alkyl and substituted or unsubstituted C.sub.3-C.sub.6-cycloalkyl, and R.sup.2, R.sup.3 are bonded together and form a 3- to 8-membered ring which can be substituted by one or more C.sub.1-C.sub.3-alkyl groups, as component D; and e) a fumed silica as component E.

The present invention is to provide a coating agent that can form a coated layer having uniform heat insulating properties and suppress the electronic component from being damaged due to partial re-melting of solder or thermal expansion of the resin. The coating agent according to the present invention comprises (A) a thermoplastic resin, (B) an organic solvent, (C) a thixotropic agent, and (D) hollow particles.

There is provided a film-forming composition for forming a film that covers a substrate and exhibits good electrical insulation properties, heat resistance, and solvent resistance after heating at a low temperature. A film-forming composition including a polymer (A) containing a unit structure of Formula (1):

##STR00001##

(wherein T.sup.1 is an arylene group or a combination of an arylene group with T.sup.0, T.sup.0 is an alkylene group, a fluorinated alkylene group, a carbonyl group, a sulfonyl group, or a combination thereof, R.sup.1 is a carboxyl group, an amino group, or an imino group, and n1 is an integer of 1 to 6), and a compound (B) having at least two isocyanate groups or blocked isocyanate groups. The polymer (A) is a polymer containing a unit structure of Formula (1) or a structure (A-1) having a combination of the unit structure of Formula (1) with a unit structure of Formula (2):

##STR00002##

A polysiloxane film comprises Si—O bonds and has a thickness of 0.3 to 1.5 microns. Adjacent electrodes coated with the polysiloxane film have a leakage current of at most 0.01 mA at 10 V after contact with water. An electrode coated with the polysiloxane film has a contact resistance of at least 0.01 ohms at 1.0 mm of pogo pin compression under a 1.0 N load. The polysiloxane film provides IPx7 protection from ingress of water.