Apparatus for cleaning an electronic circuit board is disclosed. The electronic circuit board is provided with a substrate layer and a copper layer. A solder mask is applied to the electronic circuit board and a channel is formed in the solder mask. The channel includes an inlet and an outlet. A component is affixed to the electronic circuit board over the channel and cleaning fluid is passed through the channel to remove residual solder flux from between the component and the electronic circuit board.

An approach to refurbishing or remanufacturing an electronic device may involve exposing electrical components that are situated within an interior of the electronic device. The approach may also involve replacing one or more defective electronic components of the electronic device with one or more replacement components and applying a protective coating to at least a portion of the interior of the electronic device. The protective coating may cover the circuit board and the electronic components it carries. The protective coating may also cover at least some of the electrical connections of the electronic device. The protective coating may also be applied to the replacement component prior to reassembly. The resulting refurbished or remanufactured electronic device may thus be provided with moisture resistance to help protect the electronic device from damage caused by exposure to moisture.

The invention is related to an electrical circuitry assembly as well as a method for manufacturing such an electrical circuitry assembly, wherein the assembly basically but not exclusively comprising of an electrically conductive metal plate and a circuit including a conductive layer and wherein both the metal plate and the circuit shall be electrically connected to each other.

In an electronic device having a compact form factor, such as a head mounted display device, flexible printed circuits may be utilized to provide interconnects between EMI-generating peripheral components and other components in the device such as those populated on main circuit boards. Coverlays utilized to protect circuit traces and ground planes in the flexible printed circuits are configured with openings that can expose ground planes at various locations throughout the electronic device. Electrical pathways are formed by conductive foam, conductive adhesives, and/or other conductive materials between the exposed ground planes and a device ground to establish multiple ground loops throughout the device that shunt EMI energy that is generated by electronic components and circuits during device operation. The coverlay openings can be positioned on the flexible printed circuits so that the lengths of the ground loops are minimized to enhance overall EMI emission management performance.

Disclosed are apparatus and methods related to ground paths implemented with surface mount devices to facilitate shielding of radio-frequency (RF) modules. In some embodiments, a module can include a packaging substrate configured to receive a plurality of components. The module can further include an RF component mounted on the packaging substrate and configured to facilitate processing of an RF signal. The module can further include an RF shield disposed relative to the RF component, with the RF shield being configured to provide shielding for the RF component. The RF shield can include at least one shielding-component configured to provide one or more electrical paths between a conductive layer on an upper surface of the module and a ground plane of the packaging substrate. The shielding-component can include a surface-mount device such as an RF filter implemented as a chip size surface acoustic wave (SAW) device (CSSD).

A dynamic random access memory includes a main body which has a substrate portion and a light-emitting portion and a transmission port, the substrate portion includes a board and a first coating layer, the board has a light-transmittable portion and a first face, the first coating layer is coated on the first face and has an emergent light-transmittable portion corresponding to the light-transmittable portion, and the substrate portion has a memory module. The transmission port is disposed on the substrate portion and electrically connected with the memory module. The electronic device includes the dynamic random access memory and further includes a shell portion. The shell portion is covered on two opposite lateral faces of the dynamic random access memory and at least shields the light-emitting portion, and the shell portion further has a second light-transmittable portion corresponding to the emergent light-transmittable portion.

The invention provides transient devices, including active and passive devices that physically, chemically and/or electrically transform upon application of at least one internal and/or external stimulus. Incorporation of degradable device components, degradable substrates and/or degradable encapsulating materials each having a programmable, controllable and/or selectable degradation rate provides a means of transforming the device. In some embodiments, for example, transient devices of the invention combine degradable high performance single crystalline inorganic materials with selectively removable substrates and/or encapsulants.

In an example, a process for reversibly bonding a conformal coating to a dry film solder mask (DFSM) material is disclosed. The process includes applying a first conformal coating material to a DFSM material. The first conformal coating material includes a first functional group, and the DFSM material includes a second functional group that is different from the first functional group. The process also includes reversibly bonding the first conformal coating material to the DFSM material via a chemical reaction of the first functional group and the second functional group.

In an example, a process for reversibly bonding a conformal coating to a dry film solder mask (DFSM) material is disclosed. The process includes applying a first conformal coating material to a DFSM material. The first conformal coating material includes a first functional group, and the DFSM material includes a second functional group that is different from the first functional group. The process also includes reversibly bonding the first conformal coating material to the DFSM material via a chemical reaction of the first functional group and the second functional group.

A method for selectively removing portions of a protective coating from a substrate, such as an electronic device, includes removing portions of the protective coating from the substrate. The removal process may include cutting the protective coating at specific locations, then removing desired portions of the protective coating from the substrate, or it may include ablating the portions of the protective coating that are to be removed. Coating and removal systems are also disclosed.