A substrate with an electronic component embedded therein includes: a core structure having a cavity; a metal layer disposed on a bottom surface of the cavity of the core structure; and an electronic component disposed on the metal layer in the cavity of the core structure. The substrate with the electronic component embedded therein has an excellent heat dissipation effect.

A conductive transfer and method of producing the conductive transfer is described. The conductive transfer comprises two non-conductive layers and a conductive layer between the two non-conductive layers and at least one electrical component in electrical communication with the conductive layer. The conductive layer includes a power trace for providing a power source to the electrical component and a data trace for providing the electrical component with an electrical signal.

In some embodiments, connecting a component to a substrate by adhesion to an oxidized solder surface includes: forming one or more conductive solder connections between the component and one or more conductive portions of the substrate; adhering the component to an oxidized surface of a solder portion applied to the substrate.

A printed structure comprises a device comprising device electrical contacts disposed on a common side of the device and a substrate non-native to the device comprising substrate electrical contacts disposed on a surface of the substrate. At least one of the substrate electrical contacts has a rounded shape. The device electrical contacts are in physical and electrical contact with corresponding substrate electrical contacts. The substrate electrical contacts can comprise a polymer core coated with a patterned contact electrical conductor on a surface of the polymer core. A method of making polymer cores comprising patterning a polymer on the substrate and reflowing the patterned polymer to form one or more rounded shapes of the polymer and coating and then patterning the one or more rounded shapes with a conductive material.

A system for a wearable circuit is described. The system includes a soft substrate. The system include a first battery assembly attached to the soft substrate. The system includes a second battery assembly attached to the soft substrate. The system includes a flexible connecting device. A flexible connecting device is configured to connect a first battery assembly to a second battery assembly and stretch along a path of a soft substrate. A flexible connecting device provides an electrical connection between a first and second battery assembly while being stretched.

Various embodiments include a circuit carrier comprising: an installation place for an electronic component; and a deposit of a joining adjuvant applied to the installation place. The installation place has at an edge, a recess forming a depression in a surface of the circuit carrier. The deposit comprises a sintered material with a protuberance at an edge of the deposit.

A strip for an electronic device senses a liquid sample. The strip includes a substrate having a first surface, a plurality of protrusions disposed on the first surface, and each having a width, and a hydrophilic layer having a layer surface disposed on the first surface and the plurality of protrusions, and having a second surface opposite to the layer surface, whereby the liquid sample and the second surface have a contact angle therebetween ranging from 2 to 85 degrees when the liquid sample is disposed on the hydrophilic layer.

An assembly method and device for a circuit structural member, and a circuit structural member. The assembly method comprises: measuring a depth and path of a channel between at least one chip and a printed circuit board (PCB), the at least one chip being arranged on the PCB; determining a thickness and path of a heat dissipation reinforcement material according to the depth and path of the channel between the at least one chip and the PCB and a predetermined heat dissipation parameter, so as to configure a dispensing parameter and a dispensing path; coating the heat dissipation reinforcement material in the channel between the at least one chip and the PCB according to the dispensing parameter and dispensing path; and heating the heat dissipation reinforcement material to a first predetermined temperature, such that the heat dissipation reinforcement material permeates into the chip and the PCB.

A method of transferring micro-devices includes selectively treating a first adhesive layer to form a treated portion and an untreated portion while micro-devices are attached the first adhesive layer. A second adhesive layer on a second surface is placed to abut the micro-devices. The first adhesive layer is exposed to illumination in a region that overlaps at least some of the treated portion and at least some of the untreated portion. Exposing the first adhesive layer to illumination neutralizes the at least some of the untreated portion to create a neutralized portion that is less adhesive than an exposed area of the treated portion. The first surface is separated from the second surface such that micro-devices in the treated portion remain attached to the first surface and micro-devices in the neutralized portion are attached to the second surface and separate from the first surface.

A method of transferring micro-devices includes attaching micro-devices to one surface of a first body with a first adhesive layer, and selectively forming a masking layer on an opposite surface of the first body. A second adhesive layer on a second body is placed to contact the plurality of micro-devices. The first adhesive layer is exposed to illumination through the first body to create a neutralized portion while the masking layer blocks the illumination from reaching some of first adhesive layer to provide a less exposed portion that is more adhesive than the neutralized portion. The first surface is separated from the second surface such micro-devices on the less exposed portion of the first adhesive layer remain attached to the first surface and micro-devices corresponding to the neutralized portion attach to the second body and separate from the first surface.