Intraluminal ultrasound imaging device, systems and methods (e.g., method of fabricating the device) are provided. In some embodiments, the intraluminal ultrasound imaging device includes a flexible elongate member configured to be positioned within a body lumen of a patient, and an ultrasound scanner assembly disposed at a distal portion of the flexible elongate member and configured to obtain imaging data of the body lumen. The ultrasound scanner assembly includes a flexible substrate, a first under-bump metallization (UBM) layer over the flexible substrate, a first solder feature over the first UBM layer, and a first electronic component electrically connected to the first solder feature.

A resin composition contains one or more 2-methylene-1,3-dicarbonyl compounds. At least one of the one or more 2-methylene-1,3-dicarbonyl compounds has a molecular weight of 220 to 10,000, and the amount by weight of those of the 2-methylene-1,3-dicarbonyl compounds having a molecular weight of less than 220 relative the entire resin composition of 1 is 0.00 to 0.05. The 2-methylene-1,3-dicarbonyl compounds contain a structural unit represented by formula (I) below. ##STR00001##

A method of manufacturing an electronic module includes supplying paste to an electronic component and/or a wiring board. The paste includes solder powder and first resin. The method includes supplying second resin to the electronic component and/or the wiring board. The method includes placing one of the electronic component and the wiring board on another. The method includes curing the second resin to form a second resin portion. The method includes heating the paste to a temperature equal to or higher than a solder melting point after the second resin portion is formed. The method includes solidifying molten solder at a temperature lower than the solder melting point to form a solder portion that bonds the electronic component and the wiring board. The method includes curing the first resin after the solder portion is formed, to form a first resin portion.

A method for manufacturing a circuit board with nickel resistor embedded therein provides a copper substrate, the copper substrate includes a copper foil. A nickel resistance layer is formed on the copper foil. A first dielectric layer and a first copper layer are formed on the nickel resistance layer. The copper foil and the first copper layer are etched to form a first conductive wiring layer and a second conductive wiring layer respectively, the nickel layer not being subjected to an etching process, to obtain the finished circuit board.

The invention relates to a method for soldering an SMD component (1) to a circuit carrier (2) in a positionally stable manner, having the following steps: a) providing a circuit carrier (2) comprising at least one printed circuit board contact surface (2a), which is coated with a soldering paste (3) and which is designed to electrically, thermally and/or mechanically contact the SMD component (1) to be connected, wherein a number of filled vias (6), which cannot be coated with molten solder, pass through the circuit carrier (2) at least in the region of the printed circuit board contact surface (2a), b) applying at least one adhesive point (4a, 4b, 4c, 4d, 4e) onto the circuit carrier (2) such that the adhesive point (4a, 4b, 4c, 4d, 4e) delimits the printed circuit board contact surface (2a) coated with soldering paste (3) on at least one side of an edge point (R.sub.a, R.sub.b) paired with the soldering paste (3), c) placing an SMD component (1), which comprises at least one component contact surface (1a), on the printed circuit board contact surface (2a) coated with soldering paste (3) such that the at least one component contact surface (1a) electrically, thermally and/or mechanically contacts the printed circuit board contact surface (2a) via the soldering paste (3) lying therebetween, said placement being carried out and the position of said at least one adhesive point (4a, 4b, 4c, 4d, 4e) being selected in step b) such that the SMD component (1) rests on the soldering paste (3) without contacting the at least one adhesive point (4a, 4b, 4c, 4d, 4e), d) waiting for a specifiable duration t until a curing process of the at least one adhesive point (4a, 4b, 4c, 4d, 4e) is complete, and e) heating, melting and subsequently cooling the soldering paste (3) in order to produce an electric, thermal and/or a mechanical connection between the at least one component contact surface (1a) of the SMD component (1) and the at least one printed circuit board contact surface (2a) of the circuit carrier (2), wherein a barrier (5) is formed using the at least one adhesiv

The present disclosure is related to an electronic module assembly structure including a system board, an electronic module and an adhesive material. The system board includes a first upper surface and a first lower surface opposite to each other. The electronic module spatially corresponds to the first upper surface and includes plurality leading pins and a carrier. Each leading pin has a soldering surface and is connected to the first upper surface through a first reflow soldering process. When the plurality leading pins are connected to the first upper surface, a height difference is formed between the carrying surface of the carrier and the soldering surfaces. The adhesive material is disposed on the carrying surface or the first upper surface. The carrier is connected with the first upper surface through the adhesive material, so that the electronic module is fixed to the first upper surface through the adhesive material.

Disclosed is an electronic device for determining the angular position of a shaft of a motor vehicle, the device including a printed circuit board and a magnetic guide including at least two fastening tabs for fastening to the printed circuit board, the printed circuit board including a base substrate and at least two fastening areas for fastening the magnetic guide, each designed to receive a fastening tab of the magnetic guide, the fastening tab defining a fastening orifice. Each fastening area is defined on the base substrate of the printed circuit board and includes a pad fastened to the base substrate. Each fastening tab is joined to the pad of the corresponding fastening area by way of an adhesive that is applied in its fastening orifice.

An electronic device includes a substrate, an electronic component, a first interposing layer and a second interposing layer. The substrate is non-planar and the substrate includes a first substrate pad and a second substrate pad. The electronic component includes a first component pad and a second component pad corresponding to the first substrate pad and the second substrate pad respectively. When the first component pad contacts the first substrate pad, a height difference exists between the second component pad and the second substrate pad. The first interposing layer connects between the first component pad and the first substrate pad. The second interposing layer connects between the second component pad and the second substrate pad. A thickness difference between the first interposing layer and the second interposing layer is 0.5 to 1 time the height difference.

A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

An LED array assembly may include a hybridized device and a flexible PCB. The hybridized device may include a micro-LED array mounted on a driver IC. The driver IC may include driver IC contact pads on a top surface of the driver IC. The flexible PCB may have a bottom surface, first contact pads on the bottom surface, second contact pads on the bottom surface, and contact bridges. Each of the contact bridges extends from one of the first contact pads to one of the second contact pads. Each of the driver IC contact pads is bonded to a corresponding one of the first contact pads of the flexible PCB.