A crimp terminal-equipped flexible printed circuit board includes: a first flexible printed circuit board having a base film and a circuit provided on a surface of the base film and made of metal foil; multiple crimp terminals including crimp pieces crimped to penetrate the first flexible printed circuit board and bent to bite into part of the circuit; and an insulating reinforcing film partially integrally provided on an area of the base film where the multiple crimp pieces penetrate.

An insulation displacement terminal comprises a first portion, a second portion, and a press-fit pin. The first portion may comprise a first beam and a second beam. A slot is generally formed by a first central edge of the first beam and a second central edge of the second beam. The second portion may comprise a third beam, a fourth beam, and a fifth beam. The fourth beam is configured as a cantilever beam with an attached lower end and a distal end that is able to move between the third beam and the fifth beam. The press-fit pin is generally attached to an edge of the distal end of the fourth beam.

A method of interconnecting first and second printed circuit boards using a float connector with a contact assembly that includes installing a first guide member onto the first printed circuit board with the float connector in an open non-compressed position, after installing the first guide member onto the first printed circuit board, installing a second guide member onto the second printed circuit board with the float connector in the open non-compressed position, and compressing the first and second printed circuit boards toward one another to move the float connector from the open non-compressed position to a compressed position until contact ends of the contact assembly of the float connector are exposed outside of the first and second guide members, respectively, thereby electrically connecting the contact ends to the first and second printed circuit boards, respectively, for electrical connection between the first and second printed circuit boards through the float connector.

A method of fabricating a multilayer circuit board is provided which includes forming a layer of a the multilayer circuit board with an internal clearance region having a modified voltage-to-ground clearance of conductive material adjacent to an aperture of the multilayer circuit board. The modified voltage-to-ground clearance of conductive material is based on a configuration of a connector pin to be press-fit connected within the aperture of the multilayer circuit board, and the internal clearance region is enlarged in a direction of greatest normal force outward from the aperture with insertion of the connector pin into the aperture.

A method provides a circuit carrier arrangement that includes: a cooling plate (1) which has spacer and fastening elements (3) for connection to a printed circuit board (2) in a spaced-apart manner; a printed circuit board (2) which has bores (4) for receiving spring element sleeves (9); at least one power semiconductor component (10) which is connected by a soldered connection to the printed circuit board (2) and fastening elements (3) in the state in which it is fitted with the cooling plate (1) by means of plug-in connections (11) of spring-action configuration; and at least one spring element (5) having at least two spring element sleeves (9) between which a web (6) that is connected to the spring element sleeves (9) extends, and supporting elements (7) arranged on either side of said web and at least one spring plate (8) being arranged on said web.

A work machine including a flow device for flowing molten solder from under a circuit board, and a backup pin for supporting the circuit board from below while a lead of a leaded component is being inserted into a through-hole, which are moved separately under the circuit board. Thus, when the circuit board needs to be supported, the backup pin can be moved to any position, and when solder needs to be applied, the backup pin can be moved to a position that does not obstruct operation of the flow device. Accordingly, as well as guaranteeing operation of the flow device, it is possible to support the circuit board with the backup pin as required, thus improving practicality of the work machine.

A press-fit terminal includes a bar part and a deformation part provided at an end portion of the bar part. The deformation part includes a recess, a front boundary portion and a rear boundary portion. The recess is provided between a front end portion of the deformation part and the end portion of the bar part. The front boundary portion defines a boundary between the recess and a surface of the deformation part adjacent to the front end portion of the deformation part. The rear boundary portion defines a boundary between the recess and the surface of the deformation part adjacent to the end portion of the bar part.

An electrical contact includes a compliant tail defining a pair of opposite first main face and second main face, and a pair of opposite first side face and second side face linked between the first main face and the second main face. The opposite first side face and second side face are bulged for engagement with an interior surface of the corresponding through hole. A pair of first through holes and a pair of second through holes extend through both the first main face and the second main face. The first through holes are configured with an elongated configuration while the second though holes are located around two opposite upper and lower ends of the first through holes

A semiconductor module includes: a circuit board on which a first semiconductor chip and a second semiconductor chip are mounted and includes a first through hole formed with a conductor foil therein; a press-fit terminal that is electrically connected to the conductor foil in the first through hole of the circuit board; and a second resin that is disposed on a surface side and a back surface side of the circuit board. Further, the press-fit terminal is provided with a pressure contact portion which is press-fitted into the first through hole and is electrically connected to the conductor foil in the first through hole, and the second resin on the surface side of the circuit board and the second resin on the back surface side of the circuit board are integrally formed via a second resin that is filled in the first through hole.

Power electronics arrangement including a printed circuit board and at least one power module fastened on the printed circuit board, which has one or more electronic components potted by a potting compound. At least one module connecting point of the power module is electrically contacted with at least one board connecting point of the printed circuit board by an electrically conductive pin. A base section of the pin is fastened on the module connecting point or on the board connecting point, and the end of the pin opposite to the base section is pressed in the installation position into a contacting opening assigned or assignable to the respective other connecting point.