The invention relates to an electric contact assembly for electrically contacting a printed circuit board or the like, comprising an installation ring (3) with an opening (3a), said installation ring (3) being designed to be fixed to the printed circuit board (11), and comprising a press-in pin (2) with a first zone (21) and a second zone (22), wherein the first zone (21) has a greater degree of mechanical flexibility than the second zone (22), and the first zone (21) is designed to be connected to another electronic component. The second zone (22) is assembled in the opening (3a) of the installation ring (3) by means of a first interference fit (4).

The present application discloses a semiconductor device with an interface structure and a method for fabricating the interface structure. The interface structure includes an interface board configured to be fixed onto and electrically coupled to a chuck of a testing equipment, and a first object positioned on a first surface of the interface board and electrically coupled to the interface board. The first object is configured to be analyzed by the testing equipment.

A pin has a compliant section at a first end and a welding section at a second end opposite the first end. The compliant section is electrically connected with a via of a printed circuit board. The welding section has a welded connection with a passive component.

A lighting fixture, including a bus printed circuit board that receives power from an external source, may be configured with programmable drivers. The bus printed circuit board has mechanical features for receiving the programmable drivers to mechanically mount the programmable driver to the bus printed circuit board. Each programmable driver may have a set of spring contacts positioned to engage exposed pads of the bus printed circuit board when the programmable driver is mounted to the bus printed circuit board, to supply power to the programmable driver. The lighting fixture further includes one or more light sources driven by the programmable drivers.

Press-in machine for pressing electrical, electronic, mechanical and/or electromechanical components into a substrate, in particular into a circuit board or carrier board, including a lower tool, which for pressing-is in contact against the underside of the substrate, an upper tool, which with an upper pressing unit for pressing-in the component can be moved against the component along the z-axis toward the substrate, and a changing unit for automatically changing the lower or upper tool. The changing unit includes a magazine in which a plurality of tools can be deposited, one or more tool-holders, a tool being provided in or on each of the tool-holders, a displacement unit with which the respective tool holder can be moved along a displacement direction out of the magazine and into a pressing receptacle of a pressing unit, and a locking device, with which the respective tool-holder can be locked in the pressing receptacle.

A semiconductor storage device includes: a printed circuit board; a nonvolatile memory disposed on the printed circuit board; a memory controller disposed on the printed circuit board and configured to operatively control the nonvolatile memory; a capacitor disposed on the printed circuit board and configured to supply power to the nonvolatile memory and the memory controller; and at least one holder that holds the capacitor at an end portion of the printed circuit board. The holder includes a connecting portion connected to the end portion of the printed circuit board, and a pair of arm portions extending from the connecting portion toward an outside of the printed circuit board and configured to sandwich a body portion of the capacitor from both sides in a thickness direction of the printed circuit board.

Glucose monitoring devices and related systems and methods, the glucose monitoring devices including a sensor electronics unit having a housing and a printed circuit board disposed within the housing, a transcutaneous glucose sensor assembly, and a conductive sensor connector. The printed circuit board includes a first electrical contact, the transcutaneous glucose sensor assembly includes a distal portion having a working electrode and proximal portion having a working-electrode contact in electrical communication with the working electrode, and the conductive sensor connector electrically connects the working-electrode contact with the first electrical contact. Further, the conductive sensor connector extends through a hole in the proximal portion of the transcutaneous glucose sensor assembly and through a hole in the printed circuit board.

Embodiments disclosed herein include electronics packages and methods of forming such packages. In an embodiment, the electronics package comprises a first substrate and a plurality of first conductive pads on the first substrate. In an embodiment, the electronics package further comprises a second substrate and a plurality of second conductive pads on the second substrate. In an embodiment, the electronics package further comprises a plurality of interconnects between the first and second substrate. In an embodiment, each interconnect electrically couples one of the first conductive pads to one of the second conductive pads. In an embodiment, the interconnects comprise strands of conductive material that are woven on themselves to form a mesh-like structure.

The present disclosure provides a semiconductor module comprising a semiconductor device removably pressed-fit in a cavity formed in a printed circuit board and methods for manufacturing the same. The semiconductor device and the cavity of the printed circuit board can cooperate with each other and act as an electrical plug and an electrical socket respectively. Soldering the semiconductor device on the printed circuit board can be avoided. Therefore, the packaging process can be more flexible and reliability issues with solder joints can be eliminated. Moreover, heatsink can be mounted on top and/or bottom of the semiconductor device after being received in the cavity of the printed circuit board. Thermal dissipation efficiency can be greatly enhanced.

Analyte sensors and methods of use thereof, the analyte sensors comprising a base substrate, a first conductive layer positioned on a first side of the base substrate and a fiducial mark positioned on a portion of the analyte sensor. The fiducial mark is indicative of a location of at least the first conductive layer on the base substrate.