A method comprises inserting a press-fit element into a through hole on a substrate board. The method also comprises obtaining a target heat-application plan for the press-fit element. The method also comprises applying heat to the press-fit element. The method also comprises determining that the target heat-application plan has been completed. The method also comprises withdrawing heat from the press-fit element.

A method is described for solderless electrical press-in contacting of conductive press-in pins in circuit boards, the method comprising the following steps: Providing a circuit board having at least one contacting opening for press-in contacting; providing at least one press-in component having at least one conductive press-in pin; providing a sonotrode for exerting a force and for applying ultrasonic energy. In order to electrically and mechanically contact press-in pins to a circuit board by means of ultrasonic press-in technology, it is provided that the press-in component together with its press-in pin, is fixated during a press-in step, in particular held firmly in place, and that a force and ultrasonic energy are directly applied to the circuit board by means of the sonotrode such that the circuit board is pressed at the location of its contacting opening onto the press-in pin, not directly acted upon by the sonotrode, of the press-in component.

A bonding structure of an electrical contact, a bonding method of the electrical contact and a battery module are provided. The bonding structure of the electrical contact includes an electroconductive part and an electrode sheet welded to the electroconductive part. The electrode sheet is a first metal material, and the electroconductive part is a second metal material. A welding track is formed on an interface formed by combining the electrode sheet with the electroconductive part. The welding track is a mixture of the first metal material and the second metal material. The welding track substantially has no overlap. In addition, the welding track includes a moving path, and a lateral path of performing a wobble movement or an oscillation movement on lateral sides of the moving path.

A method of manufacturing a flexible circuit comprises providing a laminated substrate that includes a conductive layer, an adhesive layer, and a support layer. The method comprises forming conductive traces by removing selected portions of the conductive layer and the adhesive layer by dry milling the laminated substrate. The method comprises applying a protective coating to the conductive traces. The method comprises dispensing a solder material on the protective coating at a first connection point and arranging a first component at the first connection point. The method comprises heating the solder material to remove the protective coating from the first connection point and to connect the first component to one of the conductive traces at the first connection point. The method comprises attaching a second component to the conductive layer at a second connection point that is free of the protective coating by a process other than soldering.

A component for a vehicle electric drive is described, which includes at least one connecting lug pair projecting from the component for electrically connecting the component. Here, a first connecting lug and a second connecting lug of the connecting lug pair each have a joining zone for electrically connecting the component. Furthermore, an assembly for a vehicle electric drive is presented, which has at least two such components. Further presented is a method of electrically conductively connecting two components.

An AP device includes a lower housing, a PCB assembly, and an upper cover. The PCB assembly is located in a cavity between the upper cover and the lower housing. The PCB assembly includes a PCB, an antenna, a first device, and a second device. The antenna is fastened to an upper surface of the PCB. The first device is located on the upper surface, and a height of the first device is less than a first height threshold or a conductor structure proportion is less than a proportion threshold. The second device is located on a lower surface of the PCB, and a height of the second device is greater than the first height threshold and a conductor structure proportion is greater than the proportion threshold

An ultrasonic welding system is provided. The ultrasonic welding system includes a support structure for supporting a workpiece. The ultrasonic welding system also includes a weld head assembly including an ultrasonic converter carrying a sonotrode. The ultrasonic welding system also includes a conductive pin supply configured to provide a plurality of conductive pins for welding using the sonotrode.

Apparatus and method for tool mark free stich bonding. In some embodiments, a method for wire bonding can include feeding a wire through a capillary tip and attaching a first end of the wire to a first location, thereby forming a ball bond. The method can further include moving the capillary tip towards a second location while the wire feeds out of the capillary tip. The method can further include attaching a second end of the wire to the second location while preventing contact between the capillary tip and the second location, thereby forming a stitch bond without a tool mark at the second location.

Provided is a high-density multi-component package comprising a first module interconnect pad and a second module interconnect pad. At least two electronic components are mounted to and between the first module interconnect pad and the second module interconnect pad wherein a first electronic component is vertically oriented relative to the first module interconnect pad. A second electronic component is vertically oriented relative to the second module interconnect pad.

A component for a vehicle electric drive is described, which includes at least one connecting lug pair projecting from the component for electrically connecting the component. Here, a first connecting lug and a second connecting lug of the connecting lug pair each have a joining zone for electrically connecting the component. Furthermore, an assembly for a vehicle electric drive is presented, which has at least two such components. Further presented is a method of electrically conductively connecting two components.