An electronic device includes a housing formed of a resin member having a predetermined light absorption property and having an opening, a circuit board accommodated in the housing and on which an electronic circuit is formed, at least one terminal including one end portion and the other end portion electrically connected to the circuit board, and a cover portion covering the opening of the housing, penetrating the at least one terminal, and formed of a resin member having a predetermined light transmitting property. The one end portion of the at least one terminal is located opposite to the other end portion with reference to the cover portion, and the cover portion is molded at a mold temperature of 100 degrees to 180 degrees. The at least one terminal and the circuit board are electrically connected by solder joining. The housing and the cover portion are connected by laser welding.

A circuit structure including a pad assembly, a bonding pad assembly, and a bonding assembly is provided. The pad assembly includes a first pad, a second pad, and a third pad which are separated from one another. The bonding pad assembly is located on one side of the pad assembly and includes a first bonding pad. The bonding assembly includes a first bonding wire, a second bonding wire, and a plurality of bonding members. The first bonding wire is connected to the first bonding pad and the first pad. The second bonding wire is connected to the first bonding pad and the third pad. The bonding members are connected among the first pad, the second pad, and the third pad. The circuit structure provided here may have an improved wire bonding efficiency and an increased distribution density of bonding points, and the number of bonding wires may be reduced.

An adhesive member is between an electronic component and an electronic panel that are connected to each other through the adhesive member. The adhesive member has a second surface and a first surface. The adhesive member includes a first recess pattern recessed from the first surface and a second recess pattern recessed from the first surface. The second recess pattern is spaced apart in a first direction from the first recess pattern. A sum of a planar area of the first recess pattern and a planar area of the second recess pattern ranges from about 20 percent (%) to about 70% of a planar area of the first surface.

An optoelectronic device (LV) with a reflective composite material (V) having a carrier (1) consisting of aluminium, having an interlayer (2) composed of aluminium oxide present on one side (A) of the carrier (1) and having a reflection-boosting optically active multilayer system (3) that has been applied via the interlayer (2). The interlayer (2) consisting of aluminium oxide has a thickness (D.sub.2) in the range from 5 nm to 200 nm and that, on the opposite side (B) of the carrier (1) from the reflection-boosting optically active multilayer system (3), a superficial layer (9) of a metal or metal alloy having, at 25° C., a specific electrical resistivity of not more than 1.2*10.sup.−1 Ωmm.sup.2/m has been applied. The thickness (D.sub.9) of the superficially applied layer (9) is in the range from 10 nm to 5.0 μm. For an optoelectronic device (LV), the leadframe (LF) has a metallic material with an aluminium carrier (1), on the surface (A) of which a metallic joining layer (FA) not consisting of aluminium has been applied locally at the bonding site (SP) of an electronic surface-mounted device (SMD) to a wire (D).

The present disclosure is directed to an electrochemical cell connector for electrically connecting a plurality of electrochemical cells, and to battery packs including the electrochemical cell connector. The electrochemical cell connectors of the present disclosure are fabricated from a flexible circuit. The flexible circuit includes conductors, such as nickel conductors, soldered or otherwise attached thereto via holes or openings in the flexible circuit. These conductors may be welded or otherwise attached to an electrochemical cell, and the electrochemical cell connections made on the flexible circuit. In many embodiments, the conductors may be attached to the flexible circuit using industry standard automated assembly equipment thus streamlining the manufacturing process and improving overall quality of the product.

A welding method includes overlapping a thin metal plate with a base material, and setting an annular welding schedule line on a welding schedule portion of the thin metal plate; forming a welding line such that a continuous irradiation with a laser light from a fiber laser is performed while moving the laser light along the welding schedule line, and while vibrating the laser light across the welding schedule line; and setting a length of the welding line such that an entire inside of the welding schedule line is welded.

An optical module includes a circuit board and a silicon optical chip. The circuit board includes a plurality of circuit board bonding pads. The silicon optical chip includes a plurality of chip bonding pads corresponding to the plurality of circuit board bonding pads. The plurality of chip bonding pads are electrically connected to the corresponding circuit board bonding pads, so that the silicon optical chip is electrically connected to the circuit board. A chip bonding pad is electrically connected to at least one corresponding circuit board bonding pad through a plurality of bonding wires, or a circuit board bonding pad is electrically connected to at least one corresponding chip bonding pad through a plurality of bonding wires. A connecting line of two or more of bonding positions of the plurality of bonding wires on the circuit board bonding pads is inclined with respect to a connecting line of centers of the circuit board bonding pads.

A hydrogen evolution assisted electroplating nozzle includes a nozzle tip configured to interface with a portion of a substructure. The nozzle also includes an inner coaxial tube connected to a reservoir containing an electrolyte and an anode, the inner coaxial tube configured to dispense the electrolyte through the nozzle tip onto the portion of the substructure. The nozzle also includes an outer coaxial tube encompassing the inner coaxial tube, the outer coaxial tube configured to extract the electrolyte from the portion of the substructure. The nozzle also includes at least one contact pin configured to make electrical contact with a conductive track on the substrate.

A switch device includes at least one switch module and at least one welding protective plate. The switch module includes an enclosure for receiving a plurality of control terminals and a driving member therein. The control terminals respectively have an end projected from an end or a rear side of the enclosure. The driving member is controllable to change an electrically connected or disconnected state between the control terminals. The welding protective plate is provided on the enclosure at the end from where the control terminals are projected. The projected control terminals further extend through the welding protective plate to be welded to a circuit board. The welding protective plate can withstand a high temperature and is located between the switch module and the circuit board to form a thermal insulation and protection mechanism, protecting the switch module from external deformation and inner damage by the high temperature during welding.

A method comprises inserting a press-fit element into a through hole on a substrate board. The method also comprises obtaining a target heat-application plan for the press-fit element. The method also comprises applying heat to the press-fit element. The method also comprises determining that the target heat-application plan has been completed. The method also comprises withdrawing heat from the press-fit element.