A battery connection module of the present disclosure includes a carrying tray, a plurality of busbars, a flexible circuit board, a connector and a connector box. The flexible circuit board is provided to the carrying tray. The connector is provided at an end of the flexible circuit board, the connector includes a connector housing and a plurality of conductive terminals which are provided in the connector housing and electrically and mechanically connected to the flexible circuit board, the connector housing has a mating portion at a front end thereof, a base at a rear end thereof and a rear supporter protruding reardwardly from the base. The connector box is constructed to one end of the carrying tray and receives the connector, the connector box includes a bottom wall, two side walls and an upper opening which allows the connector to be assembled therein.

A method for producing a camera module having a first part, preferably a housing part, and a second part, preferably a circuit board or a cover part, in which the two parts are connected in positive locking fashion. The positive lock is produced in that a connecting element connected to the first part in the form of a tongue, sleeve or a pin is guided through an opening of the second part, the first part is brought to abut on the second part and subsequently the end of the connecting element protruding beyond the second part is curled in a deforming process so that the curled end abuts on the second part in a pretensioned manner. A camera module is also described.

An optical module has an optical port and an electrical port, and includes a shell, a circuit board, a circuit adapter board, a silicon optical chip, a light source and an optical fiber socket. The circuit board is disposed in the shell. One end of the circuit board is provided with a connecting finger located in the electrical port. The circuit adapter board is disposed on and electrically connected to the circuit board. A thermal expansion coefficient of the circuit adapter board is lower than that of the circuit board. The silicon optical chip is disposed on and electrically connected to the circuit adapter board. The light source is disposed on the circuit board, is electrically connected to the circuit board, and is optically connected to the silicon optical chip. The optical fiber socket is optically connected to the silicon optical chip, and is configured to form the optical port.

A power tool that includes a motor and a printed circuit board (“PCB”). The motor includes a rotor and a stator. The stator includes a plurality of stator terminals. The PCB is electrically connected to the stator. The PCB includes a switch and an embedded busbar. A first end of the embedded busbar is electrically connected to the switch. The embedded busbar extends away from the PCB. A second end of the embedded busbar electrically connects to a stator terminal of the plurality of stator terminals for providing power to the motor using the switch. The embedded bus bar is embedded between two layers of the printed circuit board.

A display device includes a display module and a circuit board. The display module includes a base substrate, which includes a display area and a non-display area adjacent to the display area, and a first pad positioned on the base substrate and overlapping the non-display area. The circuit board includes a first board and a second pad positioned on the first board and contacting the first pad, wherein the second pad is provided with a first metal layer of a single material.

An ultrasonic bonding apparatus includes a stage on which a display panel is seated, a first ultrasonic generation unit which is connected to the stage and vibrates in a first direction and provide a first polarization, and a second ultrasonic generation unit in which an electronic component is seated and which vibrates in a second direction that is crossed with the first direction, and provides a second polarization, where a third polarization is provided on a plane on which the display panel contacts the electronic component.

A circuit module comprising at least one integrated semiconductor circuit which is enclosed or encapsulated in an isolating housing and has a plurality of electrical terminal contacts which are led out of the isolating housing, and which are connected in an electrically conductive manner to contact surfaces of a planar intermediate carrier. The integrated semiconductor circuit together with its housing lies on or against a first side of the planar intermediate carrier. The planar intermediate carrier has edge-side outer contacts on a second side opposite the first side. The outer contacts are connected to corresponding terminal contacts of a film-like line carrier in an electrically conductive manner. The planar intermediate carrier having connection lines between the contact surfaces and the outer contacts.

An adhesive member is between an electronic component and an electronic panel that are connected to each other through the adhesive member. The adhesive member has a second surface and a first surface. The adhesive member includes a first recess pattern recessed from the first surface and a second recess pattern recessed from the first surface. The second recess pattern is spaced apart in a first direction from the first recess pattern. A sum of a planar area of the first recess pattern and a planar area of the second recess pattern ranges from about 20 percent (%) to about 70% of a planar area of the first surface.

An electronic component includes a body, an inner electrode within the body, and an outer electrode outside of the body, wherein the outer electrode includes an outermost layer that includes metal particles but is not electrically connected to the inner electrode.

Provided is an improved electronic component package. The electronic component package comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination. The electronic component package also includes a structural lead frame comprising multiple leads wherein each lead is mounted to at least one first external termination and the structural lead frame comprises at least one break away feature between adjacent leads.