A position detection sensor includes a plurality of position detection loop coils formed on a board made of resin through a thermal process by forming a wiring path pattern made of copper paste that includes copper powder and a binder. Each of the position detection loop coils includes a plurality of first portions that extend on a first surface of the board in a first direction and a plurality of second portions that extend on a second surface of the board in a second direction that is orthogonal to the first direction. The wiring path pattern is disposed on the first surface and the second surface in a connector section that connects the position detection loop coils to external circuitry. The position detection sensor is capable of maintaining accuracy even though the loop coils are formed on the board by the thermal treatment using copper paste.

A terminal module includes a number of conductive terminals. The conductive terminals include a first signal terminal and a second signal terminal. A contact portion of the first signal terminal includes a first contact arm, a second contact arm and a first clamping space. The first contact arm includes a first contact end portion and a first contact arm body portion connected with the first contact end portion. The first contact arm body portion includes a first end connected to the first contact end portion and a second end opposite to the first end. From the first end to the second end, a width of the first contact arm body portion gradually increases. As a result, it is beneficial to improve the contact impedance when it is mated with a mating backplane connector. The present disclosure also discloses a backplane connector having the terminal module.

A terminal module includes a number of conductive terminals. The conductive terminal includes a contact portion, a transition portion connected with the contact portion and a connection portion electrically connected with the transition portion. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. The differential signal terminals include a first signal terminal and a second signal terminal. The terminal module further includes a fixing block fixed on the transfer portions of the first signal terminal and the second signal terminal. As a result, a distance between the first signal terminal and the second signal terminal can be controlled by the fixing block for improving the quality of data transmission. The present disclosure also discloses a backplane connector having the terminal module.

A shield case, joined to a circuit board on which electronic components are mounted and covering the electronic components, has a top plate portion covering the electronic components, and a plurality of terminal leg portions formed in a way of projecting in a direction intersecting with the top plate portion from a peripheral edge portion of the top plate portion. Each of the plurality of terminal leg portions has: a leg portion stretching from the top plate portion; a terminal portion which extends in a direction intersecting with the leg portion from a front-end of the leg portion and is joined to the circuit board; and an expansion terminal portion which is formed by bending a front-end portion of each of the terminal portions along an end surface of the circuit board and has a length exceeding a thickness of the circuit board.

A shield case, joined to a circuit board on which electronic components are mounted and covering the electronic components, has a top plate portion covering the electronic components, and a plurality of terminal leg portions formed in a way of projecting in a direction intersecting with the top plate portion from a peripheral edge portion of the top plate portion. Each of the plurality of terminal leg portions has: a leg portion stretching from the top plate portion; a terminal portion which extends in a direction intersecting with the leg portion from a front-end of the leg portion and is joined to the circuit board; and an expansion terminal portion which is formed by bending a front-end portion of each of the terminal portions along an end surface of the circuit board and has a length exceeding a thickness of the circuit board.

A backplane connector includes a housing and a number of terminal modules assembled to the housing. The housing includes a base, a first side wall and a second side wall. The base, the first side wall and the second side wall jointly form a receiving space. The terminal module includes a first signal terminal and a second signal terminal. The housing includes a number of insulating protrusions integrally extending from the base. The insulating protrusions extend into the receiving space. The terminal modules are assembled in the insulating protrusions. Compared with the prior art, the insulating protrusions of the present disclosure is integrally formed with the base, thereby improving the structural strength of the housing and improving the durability of the backplane connector.

An electronic device having at least one circuit board. The circuit board has a predetermined pattern of solder bumps facilitating a ground connection with a first enclosure member and/or a second enclosure member. The at least one circuit board is sandwiched between the first and second enclosure members, each of the first and second enclosure members has a surface facing the circuit board and the surface facing the circuit board has a bead extending therefrom contacting the predetermined pattern of solder bumps to complete the ground connection.

A first microchip includes holes or sockets along or in a top face or surface of the first microchip and a second microchip includes nodules extending from a edge of the second microchip. The nodules of the second microchip are received in the holes or sockets along or in the top face or surface of the first microchip, whereupon the first and second microchips are positioned transverse or perpendicular to each other.

An assembling method for a multi-core cable having a plurality of electrical insulated wires is designed to connect one-end-portions of the electrical insulated wires to electrode patterns, respectively, of one circuit board, correspondingly connect other-end-portions of the electrical insulated wires to electrode patterns, respectively, of the other circuit board, compute intersection coefficients on one end side and the other of the cable, and iterate interchanging connecting destinations for the one-end-portions of the electrical insulated wires, correspondingly interchanging connecting destinations for the other-end-portions of the electrical insulated wires, and computing the intersection coefficients on the one end side and the other of the cable. The connecting destinations for the electrical insulated wires to the electrode patterns are determined in such a manner that a maximum intersection coefficient denoting either larger one of the respective intersection coefficients of the one end side and the other of the cable is made small.

An assembling method for a multi-core cable having a plurality of electrical insulated wires is designed to connect one-end-portions of the electrical insulated wires to electrode patterns, respectively, of one circuit board, correspondingly connect other-end-portions of the electrical insulated wires to electrode patterns, respectively, of the other circuit board, compute intersection coefficients on one end side and the other of the cable, and iterate interchanging connecting destinations for the one-end-portions of the electrical insulated wires, correspondingly interchanging connecting destinations for the other-end-portions of the electrical insulated wires, and computing the intersection coefficients on the one end side and the other of the cable. The connecting destinations for the electrical insulated wires to the electrode patterns are determined in such a manner that a maximum intersection coefficient denoting either larger one of the respective intersection coefficients of the one end side and the other of the cable is made small.