A flux according to the present invention includes a phosphine oxide. It is thereby possible to provide a flux capable of improving solder wettability, a resin flux cored solder including the flux, and a solder paste including the flux.

A power module for the controllable electrical power supply of a consumer includes a plurality of housed power semiconductors each with an electrically non-insulated heat discharge surface, a printed circuit board, a heat sink, one or more insulation plates, wherein the printed circuit board is arranged on a side of the power semiconductor in an orthogonal direction opposite the heat sink, wherein the insulation plate is arranged between the housed power semiconductors and a cooling surface of the heat sink, wherein one insulation plate in each case is interlockingly connected by one side to one electrically non-insulated heat discharge surface of a housed power semiconductor and is interlockingly connected by the other side to the heat sink.

According to an embodiment, an electronic device may include a first printed circuit board (PCB), a second PCB having a shape corresponding to the first PCB, and an interposer surrounding a space between the first PCB and the second PCB and including multiple pads, wherein the interposer may include a first surface in contact with the first PCB, a second surface in contact with the second PCB, a first lateral surface facing the space, and a second lateral surface opposite to the first lateral surface, and a first point exposed through the second lateral surface, a second point exposed through one of the first lateral surface or the second lateral surface, and a heat conduction pattern disposed on the first surface in an area between the multiple pads to connect the first point and the second point.

[Problem to be Solved] Provided is a curable composition for inkjet printing, a coating film obtained from which has higher heat resistance than conventional coating films. [Solution] It is a curable composition for inkjet printing, comprising (A) a (meth)acrylate monomer having a cyclic skeleton and having a number of alkylene oxide modifications of one or more and six or less, (B1) a bifunctional (meth)acrylate monomer having no cyclic skeleton and having two or more alkylene glycol structures, (B2) a bifunctional (meth)acrylate monomer having no cyclic skeleton and having a monoalkylene glycol structure, and (C) a photopolymerization initiator. Accordingly, an obtained coating film does not crack, has excellent adhesion to a conductor, and maintains sufficient hardness even after a thermal history that corresponds to a plurality of times of soldering. The above problem to be solved is also solved by a curable composition for inkjet printing, comprising (A′) a (meth) acrylate monomer having a cyclic skeleton and having a number of alkylene oxide modifications of one or more and six or less, (B1′) a bifunctional (meth)acrylate monomer having no cyclic skeleton and having two or more alkylene glycol structures, (B2′) a bifunctional (meth)acrylate monomer having no cyclic skeleton and having a monoalkylene glycol structure, and (C′) a photopolymerization initiator.

A method of bonding a double-ended cable to a multi-tier substrate (such as a multi-tier printed circuit board) includes picking up the double-ended cable, and imaging alignment markers on a first head of the double-ended cable, a second substrate of the multi-tier substrate, a second head of the double-ended cable, and a first substrate of the multi-tier substrate. The method also includes aligning the alignment marker on the first head of the cable to the alignment marker on the second substrate of the multi-tier substrate, coupling the first head of the cable to the second substrate, and releasing the first head of the cable. The method further includes aligning the alignment marker on the second head of the cable to the alignment marker on the first substrate of the multi-tier substrate, coupling the second head of the cable to the first substrate, and releasing the second head of the cable.

The present application provides a display panel and a display device, the display panel is provided with two driving chips disposed side by side in a first border of a non-display area, and a flexible circuit board is disposed between the two driving chips. Compared with the prior art, a longitudinal distance between the driving chip and the flexible circuit board on the display panel border can be reduced, so as to reduce a length of the lower border of the display panel and increase a space of a display area.

A heat transfer member-equipped substrate includes a heat transfer member installed in a through hole of a substrate; a heat generating component; and a solder portion soldering the heat generating component to the heat transfer member, a nickel base plating formed on the heat transfer member, and the solder portion bonded to the nickel base plating where a gold plating that suppresses oxidization of the nickel base plating is blended into the solder portion. The heat transfer member includes a first and a second heat transfer portion bonded to each other, the first heat transfer portion made of a first metal, the second heat transfer portion made of a second metal formed on at least a portion of a surface of the second heat transfer portion, and the second heat transfer portion being a plate shape that protrudes from a circumference of the first heat transfer portion.

A mounting wiring board, containing a base, an electrode portion disposed on the base, and a heat generation pattern disposed on the electrode portion and to be heated by a standing wave of a microwave, in which an occupation area of the heat generation pattern is smaller than an area of an upper surface of the electrode portion; an electronic device mounting board using the mounting wiring board; a method of mounting the electronic device; a microwave heating method, which contains heating an object to be heated provided via the heat generation pattern; and a microwave heating apparatus.

An electronic component mounted body includes a substrate, a connection section provided on the substrate, an electronic component having a terminal connected to the connection section, and a solder that fixes the electronic component to the connection section. The connection section has a first region in which the terminal is fixed through the solder, and a second region lower in wettability than the first region, and the second region has an extension region extended to a peripheral edge of the connection section, and a spaced region that projects from the extension region toward the first region and that is provided to be spaced from the peripheral edge.

A high frequency filter includes: a multilayer substrate including a first substrate for which lands are provided, a second substrate for which lands are provided, and a third substrate for which lands are provided, the third substrate being sandwiched between the first substrate and the second substrate; a columnar conductor electrically connected to the lands in the multilayer substrate; and columnar conductors provided to surround the columnar conductor, electrically connected to a ground plane of the first substrate, and electrically connected to a ground plane of the second substrate. The spacing between the lands of the first substrate and the lands of the third substrate and the spacing between the lands of the second substrate and the lands of the third substrate are electrical lengths of 90 degrees or less at the cutoff frequency.