H05K3/363

LED tube lamp and a power supply module thereof

A light-emitting diode (LED) tube lamp comprising a tube, end caps with contact pins and located on both ends of the tube, a first rectifying circuit and a second rectifying circuit and a filtering circuit that are coupled with the contact pins on the two end caps respectively, and a switch circuitry that is located between the rectifying circuits and the filtering circuit characterized in that the switch circuitry is capable of detecting whether the LED tube lamp is correctly installed on a lamp socket so as to reduce the risk of electric shock.

ELECTRONIC APPARATUS AND PROXIMITY SENSOR

An electronic apparatus includes: a hard substrate having a first surface with a first wiring layer terminal, a second surface positioned on a back side of the first surface, and an end surface having a second wiring layer terminal and being continuous with the first surface and the second surface; and a flexible substrate having a third surface with a third wiring layer terminal and opposing the first surface of the hard substrate, and a fourth surface having a fourth wiring layer terminal and positioned on a back side of the third surface. The first wiring layer terminal and the fourth wiring layer terminal are electrically connected by solder. The second wiring layer terminal and the third wiring layer terminal are electrically connected by solder.

DISPLAY ASSEMBLY AND DISPLAY APPARATUS

A display assembly and a display apparatus. The display assembly comprises a display panel, a first flexible circuit board and a fingerprint sensor, wherein the first flexible circuit board is connected to the display panel in a binding manner and is positioned on the side of the display panel that faces away from a display surface; a display signal line coupled to the display panel is arranged on the first flexible circuit board; the fingerprint sensor is fixed on the side of the first flexible circuit board that is close to the display panel, and a light-sensitive surface of the fingerprint sensor is close to the display panel; and at least some sections of at least some fingerprint identification signal lines in fingerprint identification signal lines connected to the fingerprint sensor are arranged on the first flexible circuit board.

Transmission line device comprising a plurality of substrates each having signal and ground conductor patterns thereon that are joined to each other
11489242 · 2022-11-01 · ·

A transmission line device includes first and second transmission lines. The first transmission line includes a first electrode pad that is electrically connected to a first signal conductor pattern, and a second electrode pad and a third electrode pad that are portions of a first ground conductor pattern. The second transmission line includes a fourth electrode pad that is electrically connected to a second signal conductor pattern, and a fifth electrode pad and a sixth electrode pad that are portions of a second ground conductor pattern. The first electrode pad is between the second electrode pad and the third electrode pad, and the fourth electrode pad is between the fifth electrode pad and the sixth electrode pad. The second electrode pad and the third electrode pad are larger than the first electrode pad, and the fifth electrode pad and the sixth electrode pad are larger than the fourth electrode pad.

Electronic device

A width of each of a first signal terminal and a reference potential terminal formed in a first connection region of a core insulating layer constituting a flexible substrate is larger than a width of each of a first backside signal terminal and a backside reference potential terminal formed in a second connection region of the core insulating layer. In addition, a first separation distance between the first signal terminal and the reference potential terminal arranged adjacent to the first signal terminal is smaller than a second separation distance between the first backside signal terminal and the backside reference potential terminal arranged adjacent to the first backside signal terminal. An insulating film formed on a first surface of the core insulating layer at a position overlapping each of the first connection region and the second connection region covers the first connection region such that the second connection region is exposed.

DISPLAY APPARATUS

The present disclosure provides a display apparatus, a display panel of which includes a panel chip; a second bonding region of a main circuit board is provided with second display terminals coupled with first display terminals and second touch control terminals coupled with first touch control terminals; each of segment touch control lines includes a first segment coupled between one second touch control terminal and one main connector in a first region, and a segment coupled between a touch control chip and one main connector in a second region; a third region and a fourth region of a jumper connection circuit board are bonded with the first region and the second region respectively; the segment touch control lines are in one-to-one correspondence with jumper connection lines, each jumper connection line is coupled between one jumper connector in the third region and one jumper connector in the fourth region.

LED Tube lamp and a power supply module thereof
20230090839 · 2023-03-23 ·

A light-emitting diode (LED) tube lamp and an electric leakage protection circuit are provided. The LED tube lamp. The LED tube lamp includes a leakage detecting module and a driving module comprising a Type A+B driving circuit. The leakage detecting module is connected with a power supply. The driving module is electrically connected with the leakage detecting module. The leakage detecting module detects a signal related to the output current of the power supply, and when the signal related to the output current of the power supply exceeds a reference signal, the leakage detecting module limits the current on a power loop connected to the power supply by periodically turning off a switch electrically connected to the power loop in series.

Method for connecting stacked circuit boards

A method for connecting stacked circuit boards includes: a connecting structure is provided, the connecting structure is a bendable and flexible circuit board; a first circuit board and a plurality of supporting posts are provided, each of the supporting posts is dispersedly fixed to a side surface of the first circuit board; a second circuit board is provided, and two peripheral portions of the connecting structure are respectively fixed to the first circuit board and the second circuit board, the peripheral portions of the connecting structure are respectively near two opposite ends of the connecting structure; the connecting structure is bent to flip the second circuit board super-positioned above the first circuit board, and the second circuit board is connected to a free end of each of the supporting posts.

Electronic device package and display device including the same

An electronic device package includes: a substrate including a central region, and a first side region and a second side region at opposite sides of the central region; a first component in the first side region or the second side region, the first component having a first height above a surface of the substrate; a second component in the central region, the second component having a second height above the surface of the substrate that is lower than the first height; a reinforcement member in the central region and overlapping the second component, the reinforcement member having a third height above the surface of the substrate that is lower than the first height and higher than the second height; and an encapsulation member covering the first component and the second component.

CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR

A connection structure including: a first circuit member having a plurality of first electrodes; a second circuit member having a plurality of second electrodes; and an intermediate layer having a plurality of bonding portions electrically connecting the first electrodes and the second electrodes, in which at least one of the first electrode and the second electrode that are connected by the bonding portion is a gold electrode, and 90% or more of the plurality of bonding portions include a first region containing a tin-gold alloy and connecting the first electrode and the second electrode and a second region containing bismuth and being in contact with the first region.