A tubular solid state lighting device is disclosed having a light transmissive tube. A flexible carrier strip having a first portion attached to an inner wall section of the tube, and comprises an elongate major surface and a further elongate major surface opposite the elongate major surface. The elongate major surface carries a plurality of solid state lighting elements on the first portion and a plurality of electrically conductive contacts on adjacent terminal regions separated by a recess at one end. The flexible carrier strip is soldered to a rigid printed circuit board comprising a first major surface onto which a driver circuit for the solid state lighting elements is mounted facing the flexible carrier strip and a second major surface opposite the first major surface carrying a plurality of spatially separated soldering pads along an edge of the second major surface. The further elongate major surface contacts the second major surface such that each electrically conductive contact is aligned with one of the spatially separated soldering pads and is soldered to said soldering pad by a solder portion extending over the terminal region carrying said electrically conductive contact. A method of forming such an assembly and an assembly method for a tubular lighting device are also disclosed.

An optical module includes: an optical sub-assembly; and a flexible substrate including an insulating film, an interconnection pattern, and a spacer layer, the flexible substrate being connected to the optical sub-assembly. The insulating film has some projections, the projections protruding from a basic area in a first direction, the projections being arranged in a second direction perpendicular to the first direction, the insulating film having a flat shape with a recess between an adjacent pair of the projections. The interconnection pattern includes some pads in the basic area on a first surface of the insulating film, the pads being arranged in the second direction. The pads include some first pads adjacent to the respective projections, the pads including at least one second pad adjacent to the recess. The spacer layer is on the first surface and at each of the protrusions.

A display device includes a display panel, a first circuit board, a second circuit board, a first adhesive element, and a conductive element. The display panel includes a non-bending region and a bending region that is bent from the non-bending region. The bending region includes a curvature region having a specific curvature and a facing region facing the non-bending region in a thickness direction of the display module. The first adhesive element is disposed to combine the first circuit board with the second circuit board, and the conductive element is disposed to electrically connect the first circuit board to the second circuit board.

A light-emitting diode (LED) tube lamp with overcurrent and/or overvoltage protection capabilities includes a lamp tube, a first rectifying circuit, a filtering circuit, an LED lighting module, and a protection circuit. The lamp tube has pins for receiving an external driving signal. The first rectifying circuit is for rectifying the external driving signal to produce a rectified signal. The filtering circuit is for filtering the rectified signal to produce a filtered signal. The LED lighting module includes an LED module, wherein the LED lighting module is configured to receive the filtered signal to produce a driving signal, and the LED module is for receiving the driving signal for emitting light. The protection circuit is configured to determine whether to enter a protection state, wherein upon entering the protection state, the protection circuit works to limit or restrain the level of the filtered signal.

A metal wiring bonding structure 100 comprises contacts 753 of connection FPC 75 and heater lands 46 of a sheet heater 30 to be bonded by a solder bonding member 766. A connection FPC 75 includes contact opposed lands 754 famed of metal and disposed at positions respectively opposed to the plurality of contacts 753 on a surface of a support layer 751 opposite from a surface on which metal wires 750 are provided, and through holes 755 penetrating the contact opposed lands 754, the support layer 751, and contacts 753. Solder bonding members 756 cover surfaces of contact opposed lands 754 and are filled inside through holes 755 and in a bonding space C.

Three-dimensional (3-D) volumetric board architectural design provides technical solutions to technical problems facing miniaturization of circuit boards. The 3-D volumetric architecture includes using more of the unused volume in the vertical dimension (e.g., Z-dimension) to increase the utilization of the total circuit board volume. The 3-D volumetric architecture is realized by mounting components on a first PCB and on a second PCB, and inverting and suspending the second PCB above the first PCB. The use of 3-D volumetric board architectural design further enables formation of a shielded FEMIE, providing shielding and improved volumetric use with little or no reduction in system performance or increase in system Z-height.

A connecting structure for printed circuit boards has two printed circuit boards. At least one of the two printed circuit boards is a flexible printed circuit board, and each one of the two printed circuit boards has at least one connecting portion. The at least one connecting portion protrudes from an end of the printed circuit board, and is soldered on a top surface of the other printed circuit board. Each of the printed circuit boards is attached to the other printed circuit board only by a part (connecting portion), such that the solders on the connecting portion can extend forward and in two transverse directions beyond the connecting portion, thereby increasing the contact area between the solder and the top surface of the other printed circuit board. Therefore, the connecting structure can firmly connect two printed circuit boards and can enhance the resistance to pull.

A transmission line device includes a first multilayer substrate with a transmission line including laminated insulating base materials and a conductor pattern on the insulating base materials, and a second multilayer substrate defining a connected member to which the transmission line of the first multilayer substrate is connected. The conductor pattern includes a signal conductor pattern and a signal electrode pad electrically connected to the signal conductor pattern. The first multilayer substrate includes a resist film provided on a surface of a laminate of the insulating base materials, and the resist film includes an opening that is separated from an outer edge of the signal electrode pad in a surface direction of the laminate of the insulating base material and exposes the signal electrode pad.

A coherent optical transceiver is disclosed. The coherent optical transceiver installs an integrated coherent receiver (ICR), an optical modulator, an intelligent wavelength tunable laser diode (i-TLD), a digital signal processor (DSP), a driver to drive the optical modulator, and so on within a compact housing. The ICR is connected to the printed circuit board (PCB) through flexible printed circuit (FPC) boards and mounted thereon through a holder. The holder forms a gap against the PCB, where the FPC boards pass through the gap and connected on the pads formed on the surface of the PCB beneath the holder.

Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately. In an embodiment the invention includes a circuit board clamp for holding flexible circuit boards together, the clamp including a u-shaped fastener; a spring tension arm connected to the u-shaped fastener; and an attachment mechanism connected to the spring tension arm. Other embodiments are also included herein.