An electronic device is disclosed. An electronic device according to an embodiment may include: a first Printed Circuit Board (PCB), a second PCB, a Radio Frequency (RF) transceiver disposed on the first PCB, a Flexible Printed Circuit Board (FPCB) coupled with the first PCB and the second PCB and electrically coupled with the RF transceiver, the FPCB including a transmission line of a wireless communication signal, an amplifier disposed on the second PCB and electrically coupled with the RF transceiver by the FPCB, a first antenna electrically coupled with the amplifier through the second PCB and configured to receive a wireless communication signal corresponding to a first frequency, and a second antenna electrically coupled with the amplifier through the second PCB and configured to receive a wireless communication signal corresponding to a second frequency. The first antenna and the second antenna may be disposed closer to the second PCB than the first PCB in the electronic device. The amplifier may amplify a wireless communication signal received from the first antenna and second antenna.

An implantable electrical connecting device includes a first elastic multi-ply layer and a second elastic multi-ply layer. The first elastic multi-ply layer has a first electrically conductive layer and a plurality of first electrical contacts electrically conductively connected to the first electrically conductive layer of the first elastic multi-ply layer. The second elastic multi-ply layer has a first electrically conductive layer and a plurality of second electrical contacts electrically conductively connected to the first electrically conductive layer of the second elastic multi-ply layer. The second electrical contacts make contact with the first electrical contacts.

A display device includes a first substrate including a plurality of gate lines extending in a first direction, a plurality of data lines extending in a second direction crossing the first direction, and a plurality of pixels connected to the gate lines to the data lines, a second substrate disposed on the first substrate, an image display layer disposed between the first substrate and the second substrate, a plurality of first pads which electrically connected to the gate lines, respectively, where the first pads further protrude outward than a first side surface of the first substrate, a gate driver facing the first pads, and a first adhesive disposed between the gate driver and the first pads. The first adhesive includes a first conductive film and a plurality of first conductive patterns disposed between the first conductive film and the first pads to respectively overlap the first pads.

A soft neural interface connector apparatus includes a PCB having a two-dimensional array of solder balls, a transparent top board, a cushioning layer on one side of the transparent top board, and a soft neural interface including a flexible and/or stretchable microelectrode array (MEA) through which neural signals are obtained or delivered. The MEA includes a two-dimensional array of contact pads corresponding to the array of solder balls. The PCB, the transparent top board, the cushioning layer, and the MEA are stacked together such that the MEA is between the cushioning layer and the PCB, and the contact pads are aligned with and in electrical contact with associated solder balls. A magnetic connector system having at least one magnetic connector component on the transparent top board is magnetically connected with at least one magnetic connector component on the PCB to press the contact pads and associated solder balls together.

Analyte sensors and methods of use thereof, the analyte sensors comprising a base substrate, a first conductive layer positioned on a first side of the base substrate and a fiducial mark positioned on a portion of the analyte sensor. The fiducial mark is indicative of a location of at least the first conductive layer on the base substrate.

Disclosed is an electronic device. An electronic device according to an embodiment may include: a housing including a first plate oriented in a first direction, a second plate oriented in a second direction opposite the first direction, and a side face surrounding a space between the first plate and the second plate; a first PCB disposed in the space and including a first face oriented in the first direction, a second face oriented in the second direction, and a first electrical connector disposed on the first face; a second PCB disposed in the space closer to the second plate than the first PCB, and including a second electrical connector; a third electrical connector detachably coupled to the first electrical connector; a fourth electrical connector detachably coupled to the second electrical connector; an FPCB electrically connected between the third connector and the fourth electrical connector, and including a first portion facing the second face; and a flexible conductive member comprising a conductor disposed between the second face and the first portion.

An FPC connection structure including: several strands of FPC conductor patterns coated with an insulating film; and FPC terminals each extending from one end portion of each of the FPC conductor patterns and provided in a flat type to enable spot welding on a substrate terminal unit provided on the printed circuit board.

An electric device which includes a first component carrier structure with a first magnet structure and a first connection structure, and a second component carrier structure with a second magnet structure and a second connection structure. The first magnet structure and the second magnet structure are configured such that upon attaching the first component carrier structure and the second component carrier structure to one another the first connection structure is connected to the second connection structure, holding the first component carrier structure and the second component carrier structure together by an attracting magnetic force between the first magnet structure and the second magnet structure.

Methods and apparatus for an assembly having first and second circuit cards mated together with a ball stack on the first circuit card extending into a through hole in the second circuit card. A wirebond connects the first ball stack to a bond pad on the first surface of the second circuit card forming a low profile connector-less interconnect. The ball stack comprises at least two balls stacked on top of each other and bonded to each other, wherein the balls are generated from wire.

The present invention discloses an improved RF interface board and a laminated assembly having a RF interface board having an inner and an outer part. The laminated assembly includes a dielectric support having a first and a second surfaces and at least a first and a second RF transmission strips disposed on the dielectric support. The first and the second RF transmission strips are electrically isolated from each other, are configured to be connected to a connector at the outer part, and are each configured to be connected to a different conductive element at the inner part. The first RF transmission strip is on the first surface of the dielectric support.