Provided is a method for manufacturing a copper-clad laminate in which a copper foil and a resin are joined together with high heat-resistant adhesion force though a fluororesin, which is a low dielectric constant thermoplastic resin, is used. This method includes providing a surface-treated copper foil including a copper foil and a zinc-containing layer on at least one surface of the copper foil, and affixing a sheet-shaped fluororesin to the zinc-containing layer side of the surface-treated copper foil. The zinc-containing layer is composed of Zn and a transition element M having a melting point of 1200 C. or more. When the interface between the copper foil and the zinc-containing layer is subjected to elemental analysis by XPS, the content of Zn is 10 wt % or less, and the Zn/M weight ratio, the ratio of the content of Zn to the content of the transition element M, is 0.2 to 0.6.

Provided is a micro-roughened electrodeposited copper foil, which comprises a micro-rough surface and multiple copper nodules. The micro-roughened electrodeposited copper foil has an Sdr of 0.01 to 0.08. With the surface characteristics, the electron path distance can be shortened, such that the micro-roughened electrodeposited copper foil can reduce the insertion loss of the copper clad laminate at high frequencies and have the desired peel strength.

A method for manufacturing a wiring board that includes preparing a substrate including an insulating resin and a metal member having an anti-rust layer formed on a surface thereof that is arranged so as to face a second surface of the insulating resin. The method includes forming a bottomed hole by irradiating a first laser beam from a first surface side of the insulating resin. The bottomed hole penetrates the insulating resin and has an inner bottom surface that is the surface of the metal member. The method also includes removing the anti-rust layer formed on the surface of the metal member in the inner bottom surface of the bottomed hole, injecting a conductive paste into the bottomed hole and applying the conductive paste to the first surface of the insulating resin so as to have a wiring continuous with the injected conductive paste, and curing the conductive paste.