A laminate comprising a substrate; and a plating-forming layer disposed on at least one surface of both surfaces of the substrate and containing a thermoplastic resin and a plating catalyst, wherein the plating-forming layer further satisfies conditions of the following (1) and/or (2),

(1) the plating-forming layer contains a dispersing agent for dispersing the plating catalyst
(2) an abundance of the plating catalyst on a surface side of the plating-forming layer is higher than an abundance of the plating catalyst on the substrate side of the plating-forming layer.

Provided is a new board with a sufficient adhesion strength between an insulating layer and a metal layer. A board of the embodiment is a board including an insulating layer and a metal layer. The insulating layer contains a resin containing an insulating filler. The metal layer is disposed on a surface of the insulating layer. The resin is present partially between at least a part of the insulating filler present in the surface of the insulating layer and a metal constituting the metal layer. In an interface between the insulating layer and the metal layer, a depth of the metal present at a deepest portion in the insulating layer is 1.2 .Math.m or less based on the resin or the insulating filler present in an outermost surface of the insulating layer.

A multi-layer circuit board is formed multiple layers of a catalytic layer, each catalytic layer having an exclusion depth below a surface, where the cataltic particles are of sufficient density to provide electroless deposition in channels formed in the surface. A first catalytic layer has channels formed which are plated with electroless copper. Each subsequent catalytic layer is bonded or laminated to an underlying catalytic layer, a channel is formed which extends through the catalytic layer to an underlying electroless copper trace, and electroless copper is deposited into the channel to electrically connect with the underlying electroless copper trace. In this manner, traces may be formed which have a thickness greater than the thickness of a single catalytic layer.

A present invention provides a method for manufacturing a printed wiring board having excellent plating adhesion to a resin substrate having low surface roughness such as having surface roughness Ra of 0.2 μm or less, having excellent treating solution stability, and having high penetrability into the resin substrate. The method for manufacturing a resin substrate includes a step 1A or a step 1B; and a step 2 after the step 1A or the step 1B; and the steps are conducted before conducting electroless plating.

A method of manufacturing a structure having conductive lines is disclosed by forming a patterned catalyst material layer on a substrate; activating the patterned catalyst material layer to form an activated patterned catalyst material layer including activated catalysts; and growing a conductive layer on the activated catalysts of the activated patterned catalyst material layer. The patterned catalyst material layer is formed from a catalyst material including 40 wt % to 90 wt % of polymer and 10 wt % to 60 wt % of catalyzer. An uppermost portion of the activated patterned catalyst material layer includes the activated catalysts, and the activated catalysts include metal reduced from the catalyzer. The pattern of the conductive layer corresponds to that of the patterned catalyst material layer. The structure of the conductive line of the disclosure has the characteristics of high conductivity.

A protection tape for a printed circuit board (PCB) includes an insulating base plate, a conductive layer over the insulating base plate, and an adhesive layer over the conductive layer, the adhesive layer including a main part having a first thickness and a subsidiary part having a second thickness less than the first thickness, the main part corresponding to at least a center portion of the insulating base plate and the subsidiary part being arranged at an outside of the main part.

The disclosure relates to a microcircuit forming method. The microcircuit forming method according to the disclosure comprises: a seed-layer forming step for forming a high-reflectivity seed layer on a substrate material by using a conductive material; a pattern-layer forming step for forming a pattern layer on the seed layer, the pattern layer having a pattern hole arranged thereon to allow the seed layer to be selectively exposed therethrough; a plating step for filling the pattern hole with a conductive material; a pattern-layer removing step for removing the pattern layer; and a seed-layer patterning step for removing a part of the seed layer which does not overlap the conductive material in the plating step, wherein the high-reflectivity seed layer has a specular reflection property.

A protection tape for a printed circuit board (PCB) includes an insulating base plate, a conductive layer over the insulating base plate, and an adhesive layer over the conductive layer, the adhesive layer including a main part having a first thickness and a subsidiary part having a second thickness less than the first thickness, the main part corresponding to at least a center portion of the insulating base plate and the subsidiary part being arranged at an outside of the main part.

A multi-layer circuit board is formed multiple layers of a catalytic layer, each catalytic layer having an exclusion depth below a surface, where the cataltic particles are of sufficient density to provide electroless deposition in channels formed in the surface. A first catalytic layer has channels formed which are plated with electroless copper. Each subsequent catalytic layer is bonded or laminated to an underlying catalytic layer, a channel is formed which extends through the catalytic layer to an underlying electroless copper trace, and electroless copper is deposited into the channel to electrically connect with the underlying electroless copper trace. In this manner, traces may be formed which have a thickness greater than the thickness of a single catalytic layer.

A multi-layer circuit board is formed multiple layers of a catalytic layer, each catalytic layer having an exclusion depth below a surface, where the cataltic particles are of sufficient density to provide electroless deposition in channels formed in the surface. A first catalytic layer has channels formed which are plated with electroless copper. Each subsequent catalytic layer is bonded or laminated to an underlying catalytic layer, a channel is formed which extends through the catalytic layer to an underlying electroless copper trace, and electroless copper is deposited into the channel to electrically connect with the underlying electroless copper trace. In this manner, traces may be formed which have a thickness greater than the thickness of a single catalytic layer.