The printed board includes a slit portion and a first conductive member that is provided straddling the slit portion. In a state in which the printed board is attached to an apparatus to which one end of a second conductive member having an elastic force is connected, another end of the second conductive member contacts the first conductive member, and the another end of the second conductive member passes through the slit portion.

Provided are a circuit assembly in which it is possible to eliminate or reduce a level difference between a mounting surface of a substrate and portions to which terminals that are electrically connected to a conductive member are connected, and that can be easily produced, and a method for manufacturing the same. A circuit assembly includes a substrate provided with openings and an electronic component mounted on one side of the substrate, a conductive member that is a plate-shaped member fixed to another side of the substrate, the conductive member constituting a conductive path, and a relay member that is fixed to a surface on the substrate side of the conductive member and made of an electrically conductive material, the relay member being accommodated in the openings formed in the substrate, at least one terminal of the electronic component being connected to the relay member.

Readily modifiable and customizable, low-area overhead interconnect structures for forming connections between a system-in-a-package module and other components in an electronic device. One example may provide an interposer for providing an interconnection between a system-in-a-package module and other components in an electronic device. Another may provide a plurality of conductive pins or contacts to form interconnect paths between a module and other components.

A method, in some embodiments, comprises: providing a direct bonded copper (DBC) substrate including a plurality of copper traces; providing a guide plate having protrusions on a surface of the guide plate; mounting hollow bush rings onto the protrusions; mounting the bush rings onto the copper traces by aligning the protrusions of the guide plate with solder units on said copper traces; attaching the bush rings and one or more dies to the copper traces by simultaneously reflowing said solder units and other solder units positioned between the dies and the copper traces; and after said simultaneous reflow, removing the protrusions from the bush rings.

A filtered connector is mounted on a casing and includes a connection port and a filter board. An electrode plate mounted on one end of the connection port and electrically isolated from the casing is securely mounted through a through hole of the casing. The filter board has a circuit board assembly, multiple grounding spring plates and multiple filtering capacitors. The circuit board assembly has a slot to be mounted through by the electrode plate. The grounding spring plates are mounted on a surface of the circuit board assembly and electrically contact the casing. The filtering capacitors are electrically connected between the electrode plate and the grounding spring plates. As the filter board is not mounted inside the connection port, only the filter board is to be mounted without replacing the connection port, thereby lowering users' expense in installation of the filter board.

A method for inserting preformed solder members into connector pins for use with electrical connectors. The method generally includes a connector pin having an open cavity at one end, into which a preformed solder member can be first inserted and then pressed, rather than melted, in place, such that voids and air spaces within the cavity are substantially eliminated. The method allows for inserting solder members in high quantities, where the preformed solder members are placed in a fixture and the fixture is placed on a shaker table, so that solder members can be inserted into large numbers of connector pins that are pre-installed in connector grommets, largely simultaneously.

A flexible substrate has an insulating base member and a conductive layer that is formed on the base member and includes an electrical connecting portion fixed to a component and electrically connected to the component, and the flexible substrate includes: a main portion on which the electrical connecting portion is formed; and a protruding portion provided so as to protrude from a portion of the main portion in which the electrical connecting portion is formed, wherein the main portion is bent along a first bending line extending in a first direction, and wherein the protruding portion can be bent along a second bending line extending in a second direction intersecting the first direction and is adapted to reduce stress occurring at the electrical connecting portion by the protruding portion being bent along the second bending line.

One embodiment provides a circuit board having a substrate and an electrode portion which is provided on the substrate. The electrode portion includes: a quadrangular land which is provided on a front surface of the substrate; a solder layer which is laminated on the whole of a front surface of the land; and a pad which is joined to a front surface of the solder layer. When the electrode portion is seen from thereabove, an outer circumferential line of the pad touches each of four sides of the land. Exposed portions where the solder layer is exposed are formed individually at four corners of a front surface of the electrode portion. And, the exposed portions are formed to have the same shape.

This document describes an interactive object with multiple electronics modules. An interactive object (e.g., a garment) includes a grid or array of conductive thread woven into the interactive object, and an internal electronics module coupled to the grid of conductive thread. The internal electronics module includes a first subset of electronic components, such as sensing circuitry configured to detect touch-input to the grid of conductive thread. An external electronics module that includes a second subset of electronic components (e.g., a microprocessor, power source, or network interface) is removably coupled to the interactive object via a communication interface. The communication interface enables communication between the internal electronics module and the external electronics module when the external electronics module is coupled to the interactive object.

A multilayer ceramic substrate according to the present invention includes a first insulating portion including a body of a ceramic material, a first via conductor penetrating through the body, and a first internal wiring layer and a first connection pad connected to the first via conductor; and a second insulating portion including a body of an anodized oxide material, a second via conductor penetrating through the body, and a second internal wiring layer and a second connection pad connected to the second via conductor.