The present invention provides a conductive film that includes a substrate, a first matrix layer, a first conductive layer, a second matrix layer, a second conductive layer, a light-shielding layer, a first lead electrode and a second lead electrode. A first grid groove and a second grid groove are formed in the first matrix layer and the second matrix layer, respectively, and the first grid groove and the second grid groove are filled with conductive materials, to form the first conductive layer and the second conductive layer, respectively. Accordingly, the first matrix layer and the second matrix layer may provide protection for the first conductive layer and the second conductive layer, and thus can improve the production yield. Furthermore, the present invention also provides a method for manufacturing the conductive film and a touch screen including the conductive film.

Vias may be established in printed circuit boards or similar structures and filled with a monolithic metal body to promote heat transfer. Metal nanoparticle paste compositions, such as copper nanoparticle paste compositions, may provide a ready avenue for filling the vias and consolidating the metal nanoparticles under mild conditions to form each monolithic metal body. The monolithic metal body within each via can be placed in thermal contact with one or more heat sinks to promote heat transfer. Adherence of the monolithic metal bodies within the vias may be promoted by a coating upon the walls of the vias. A tin coating, for example, may be particularly suitable for promoting adherence of a monolithic metal body comprising copper.

Embodiments and fabrication methods for a printed circuit board are provided. The embodiments include milling a first cavity in a first sub-lam, wherein the first cavity extends partially through the first sub-lam and milling a second cavity in a prepreg layer. The first sub-lam, the prepreg layer, and a material sheet are stacked and laminated to form a composite cavity from the first cavity and the second cavity. The embodiments also include removing from the laminated stack one or more portions of the first sub-lam covering the first cavity to expose the composite cavity. Conductive paste is placed in the composite cavity of the laminated stack and sintered to form one or more thermal pathways in the laminated stack.

Vias may be established in printed circuit boards or similar structures and filled with a monolithic metal body to promote heat transfer. Metal nanoparticle paste compositions, such as copper nanoparticle paste compositions, may provide a ready avenue for filling the vias and consolidating the metal nanoparticles under mild conditions to form each monolithic metal body. The monolithic metal body within each via can be placed in thermal contact with one or more heat sinks to promote heat transfer. Adherence of the monolithic metal bodies within the vias may be promoted by a coating upon the walls of the vias. A tin coating, for example, may be particularly suitable for promoting adherence of a monolithic metal body comprising copper.

A method for operating a three-dimensional (3D) metal object manufacturing apparatus selects operational parameters for operation of the printer to form vias in substrates. The method identifies the bulk metal being melted for ejection and uses this identification data to select the operational parameters. The method identifies the via holes in the substrate and operates an actuator to position an ejector opposite the via holes to eject drops of melted bulk metal toward the via holes to fill the via holes.

A method for manufacturing a conductive via-containing substrate is provided, the method including: step a of preparing a substrate provided with a hole and providing a metal paste part containing metal particles and a volatile solvent to cover at least a surface surrounding the hole of the substrate while an inside of the hole is filled with the metal paste part; step b of heating the metal paste part to remove a part of the volatile solvent; step c of removing a part of the metal paste part after heating to expose the surface to form a conductive via precursor in the hole, the conductive via precursor containing the metal particles and a residue of the volatile solvent and having a planarized exposed surface; and step d of firing the conductive via precursor.

A method for manufacturing a substrate with conductive vias includes a step a of preparing a substrate provided with holes, and providing a metal paste portion containing metal particles and a volatile solvent so as to fill the inside of the holes and cover at least a surface of the substrate around the holes; a step b of heating the metal paste portion to remove a part of the volatile solvent; a step c of removing a part of the metal paste portion after heating so as to expose the surface, and forming conductive via precursors having a flattened exposed surface and containing a remainder of the metal particles and the volatile solvent inside the holes; and a step d of firing the conductive via precursors to form conductive vias.

A method of the subject technology includes obtaining a first electronic component comprising a first plurality of contacts and/or pins, obtaining an electronic part comprising a first plurality of circuit components corresponding to the first plurality of contacts and/or pins and forming a first layer over the first plurality of circuit components. The method further includes forming a first plurality of liquid metal (LM) interconnects in the first layer at locations corresponding to the first plurality of circuit components.

In an aspect, an electronic device is disclosed that includes a core having an upper planar surface and an interior planar surface; a cavity extending at least partially through the upper planar surface of the core to the interior planar surface of the core; an electronic component mounted in the cavity, the electronic component including an upper planar surface having one or more electronic component terminals, wherein the electronic component is supported by the interior planar surface of the core so that the upper planar surface of the electronic component is level with the upper planar surface of the core; and an upper metallization structure configured to provide one or more conductive paths from the one or more electronic component terminals to one or more upper metal terminals of the upper metallization structure.

The present invention provides a circuit board structure and manufacturing method thereof. Select a processing area for electronic components on a circuit board containing a copper foil layer, and calculate marking points without setting the electronic components. Spray water-based environmentally friendly paint on the circuit board to form a first insulating layer. Cut the circuit board outside the marking points to form through holes, and spray water-based environmentally friendly conductive paint on the first insulating layer to form a conductive layer that forms an electrical connection with the copper foil layer. Finally, spray water-based environmentally friendly paint on the conductive layer to form a second insulating layer, so that electromagnetic waves and other interference of the electronic components are guided to the internal ground plane of the circuit board through the conductive layer for elimination, and heat is dispersed on the first and second insulating layers.