In a preparatory process of a method of manufacturing a multilayer substrate, an insulating substrate is prepared, with a conductor pattern formed only on one surface of the insulating substrate. At that time, the conductor pattern is constituted of the Cu element, a Ni layer is formed on the surface of the conductor pattern that is on the side of the insulating substrate. In a first forming process, a via hole having the conductor pattern as the bottom thereof is formed in the insulating substrate. At that time, the Ni layer that is in the area of the bottom is removed. In a filling process, a conductive paste is filled in the interior of the via hole. In a second forming process, a stacked body is formed by stacking a plurality of the insulating substrates. In a third forming process, the stacked body is heated while being subjected to pressure.

An electrical connection between the backplane and the light-transmissive front electrode of an electrowetting device is provided by forming an aperture through the top front electrode coupled and a substrate coupled thereto and subsequently introducing a flowable, electrically-conductive material into the aperture. The flowable, electrically-conductive material provides an electrical contact between the light-transmissive electrically-conductive layer and the backplane.

Vias may be established in printed circuit boards or similar structures and filled with a monolithic metal body to promote heat transfer. Metal nanoparticle paste compositions, such as copper nanoparticle paste compositions, may provide a ready avenue for filling the vias and consolidating the metal nanoparticles under mild conditions to form each monolithic metal body. The monolithic metal body within each via can be placed in thermal contact with one or more heat sinks to promote heat transfer. Adherence of the monolithic metal bodies within the vias may be promoted by a coating upon the walls of the vias. A tin coating, for example, may be particularly suitable for promoting adherence of a monolithic metal body comprising copper.

A component-embedded substrate includes: insulating layers each including a wiring pattern; an embedded component including a connection terminal; a plurality of vias that electrically connect the connection terminal to the wiring patterns adjacent to each other in a lamination direction. Each of the vias is composed of a via hole in the insulating layer and a conductive material in the via hole. One of the vias is a connection via connected to the connection terminal, and another of the vias is an adjacent via adjacent to the connection via in the lamination direction. The connection via and adjacent via overlap in a plan view. S1/A1≤0.61 and S1/A2≤0.61 are satisfied, where A1 is an average cross-sectional area of the connection via, A2 is an average cross-sectional area of the adjacent via, and S1 is an overlapping area of the connection via and adjacent via in the plan view.

A wiring board and a method of manufacturing the same are provided. The method includes the following steps. A substrate is provided. The substrate is perforated to form at least one through hole. A first conductive layer is integrally formed on a surface of the substrate and an inner wall of the through hole. An etch stop layer is formed on a portion of the first conductive layer on the surface of the substrate and another portion of the first conductive layer on the inner wall of the through hole. A second conductive layer is integrally formed on the etch stop layer and the first conductive layer on the inner wall of the through hole. A plug-hole column is formed by filling with a plugged-hole material in the through hole. The second conductive layer is removed. The etch stop layer is then removed.

An electrical connection between the backplane and the light-transmissive front electrode of an electro-optic display is provided by forming an aperture through the top front electrode coupled and a substrate coupled thereto and subsequently introducing a flowable, electrically-conductive material into the aperture. The flowable, electrically-conductive material provides an electrical contact between the light-transmissive electrically-conductive layer and the backplane.

Lighting systems for use in building interiors, for example, which include a plurality of light modules each having an elongate substrate with a lower surface, and electrical circuitry including a plurality of LED units printed to the lower surface via thick film techniques. Each light module is formed as a single-component, packaged construct for easy installation, and facilitates conductive transfer of heat away from the LEDs for enhanced power efficiency. The light modules may be releasably connected to, and extend from, an elongate spine unit which provides structural support and power input to the light modules and optionally, the system may employ use of metallic components, such as the metallic substrate of a light module, for directly conducting current to power the LED units.

A wiring board manufacturing method includes: forming a first groove structure in a first principal surface of a base by scanning with laser light in a first irradiation pattern such that the first groove structure has a first width; irradiating an inside of the first groove structure with laser light in a second irradiation pattern that is different from the first irradiation pattern to form recessed portions inside the first groove structure; and forming a first wiring pattern by filling the first groove structure with a first electrically-conductive material to form a first wiring pattern whose shape matches with a shape of the first groove structure in a top view.

In an embodiment, a method of forming a stub-less via is provided. The method includes depositing a plurality of microcapsules containing a metal material in a via of a printed circuit board (PCB); rupturing the microcapsules and releasing the metal material; and sintering the metal material. In another embodiment, a method of forming a stub-less via is provided. The method includes forming a via in a printed circuit board (PCB); installing a plug in a portion of the via; depositing in the via a plurality of nanoparticles containing a metal material; and sintering the metal material.

A conductive slurry for plating comprises a carbon material, a dispersant, a binder, and a solvent. The carbon material, the dispersant and the binder are uniformly mixed in the solvent. The weight percentage of the carbon material is between 0.1% and 1%. The carbon material comprises a carbon nanotube, graphene, or a combination thereof. A plating method for a circuit board, which utilizes the conductive slurry, is also disclosed. The circuit board comprises at least a through hole. The plating method comprises a coating step, a first cleaning step, a first drying step, a first micro-etching step, a second cleaning step, an anti-oxidation step, a third cleaning step, a plating step, and a second drying step.