A multilayer printed circuit as well as printed passive and active electronic components using additive printing technology is provided. The fabrication process includes a substrate and a first conductive layer that is printed with conductive ink on the substrate. An insulation layer that has uniform thickness is printed on the first conductive layer and the substrate, less via cavities, test point cavities, and a surface mount component contact point and mounting cavities. The insulation layer is replaceable with resistive layer or semi-conductive layer to fabricate electronic components. The vias are printed with conductive ink inside of the via cavities. Additionally, a second conductive layer is printed on the vias and over the insulation layer. The insulation, resistive, or semi-conducting layer, the vias, and the conductive layers are repeatedly printed in sequence to thus form the multilayer printed circuit.

A stretchable cable 1 includes a sheet-shaped stretchable base material 2 exhibiting elasticity and elongated in one direction, and a stretchable wiring 3 formed on one surface of the stretchable substrate 2 and exhibiting elasticity. The stretchable base material 2 is made of a material exhibiting elasticity. The stretchable wiring 3 is made of a conductive composition including elastomer and a conductive filler filling the elastomer.

Apparatus and methods are provided for flexible and stretchable circuits. In an example, a method can include forming a first flexible conductor on a substrate, the first flexible conductor including a first conductive trace surrounded on three sides by a first dielectric, and forming a second flexible conductor on top of the first flexible conductor, the first flexible conductor located between the second flexible conductor and the substrate, the second flexible conductor including a second conductive trace surrounded by a second dielectric.

A fabrication method of a circuit includes drilling holes in a substrate, so as to form a plurality of first opening holes and second opening holes in the substrate. A cover film is attached onto the substrate, so as to cover the first opening holes and the second opening holes. A portion of the cover film covering the first opening holes is removed, so as to expose the first opening holes. The first opening holes are filled.

The manufacturing method of the flexible printed wiring board relating to an embodiment includes a step of preparing a metal foil clad laminate 1 including an insulating substrate 2 and metal foil 3 and metal foil 4 provided on main surfaces of the substrate 2, a step of forming a circuit pattern 5 by patterning the metal foil 3, a step of forming a peelable printing plate layer 6 on the substrate 2 so as to embed the pattern 5, a step of forming blind holes 7a and 7b where the pattern 5 is exposed inside by partially removing the printing plate layer 6, a step of printing conductive paste with the printing plate layer 6 as a printing mask, and filling the conductive paste 8 inside the blind holes, and a step of peeling off the printing plate layer 6 from the metal foil clad laminate 1.

The present invention provides a method for manufacturing a flexible array substrate. The method includes, first, successively forming an adhesive layer, a passivation layer, a back-side drive circuit, a planarization layer, a flexible backing plate, and a front-side drive circuit and a display circuit, in a stacked arrangement, on a rigid support plate and then peeling off the rigid support plate and the adhesive layer to form a flexible array substrate having a double-sided circuit structure. The entirey process requires no steps of peeling, reversing, and then re-attaching of the flexible backing plate so that it is possible to avoid the issues of poor flatness and low yield resulting from improper or wrongful re-attachment of the flexible backing plate and thus, fabrication difficulty of a flexible array substrate having a double-sided circuit structure may be lowered down to thereby improve fabrication yield of the flexible array substrate.

An electrical connection method of a printed circuit includes overlapping a base material and a thin member in which a thin conductor is mounted, forming a through hole which passes through the base material overlapped with the thin member in the overlapping and reaches the thin conductor of the thin member, and forming a printed circuit on the base material by a screen printing method using conductive paste. The through hole formed in the forming of the through hole is filled with the conductive paste in the forming of the printed circuit.

A batch made of refractory mineral materials for lining of assemblies used for nonferrous metal melts, contains over 90% by weight of a mixture of the following constituents:from 3 to 74% by weight of at least one coarse-grain raw olivine material with at least 70% by weight forsterite content and having grain sizes of 50% by weight over 0.1 mmfrom 25 to 49% by weight of at least one ground magnesia with grain sizes of 50% by weight?1 mmfrom 0.9 to 14% by weight of at least one ground silicon carbide (SiC) with grain sizes of 50% by weight?1 mmfrom 0.1 to 10% by weight of at least one fine-particle dry pulverulent silica with particle sizes?500 ?mfrom 0 to 4% by weight of at least one antioxidant known per se for refractory productsfrom 0 to 4% by weight of at least one additional granulated refractory raw material known per se, more particularly having grain sizes of 50% by weight, in particular of 80% by weight, preferably of 100% by weight over 0.1 mmfrom 0 to 2% by weight of at least one additive known per se for the production of refractory products from batchesfrom 0 to 4% by weight of at least one additional substance known per se made of ground refractory materials and/or in the form of what is known as medium-grain-size material and/or of what is known as coarse-grain-size materialfrom 0 to 10% by weight of at least one binder known per se for refractory materials, e.g. in dry form or in ancillary packaging in liquid form.

According to one embodiment, a display device includes an organic insulating layer located between an first basement and an second basement, a first hole penetrating the second basement and the organic insulating layer, a connecting material provided via the first hole to electrically connects a first terminal and a second terminal to each other and a filling member covering the connecting material and filled in the first hole, and the protective member includes an exposure area in which the filling member is disposed, and a thickness from the second basement to an upper surface of the filling member is substantially equal to a thickness from the second basement to an upper surface of the protective member.

A module includes a substrate, a first wiring, a second wiring, and an interlayer connection section. The substrate includes a first surface facing a first direction, a second surface facing a second direction opposite to the first direction, and an inner surface of a hole extending between the first surface and the second surface. The first wiring is provided on the first surface. The second wiring is provided on the second surface. The interlayer connection section includes a first conductor provided on the inner edge, connected to the first wiring and the second wiring, thinner than the first wiring, and thinner than the second wiring, and a second conductor disposed in the hole and electrically connected to the first conductor.