An electrical connection method of a printed circuit includes overlapping a base material and a thin member in which a thin conductor is mounted, forming a through hole which passes through the base material overlapped with the thin member in the overlapping and reaches the thin conductor of the thin member, and forming a printed circuit on the base material by a screen printing method using conductive paste. The through hole formed in the forming of the through hole is filled with the conductive paste in the forming of the printed circuit.

A method of printing solder paste in a component board and a stencil set for doing the same are disclosed. In one embodiment, the method includes using a first stencil having a first thickness to print solder paste into at least one through hole in the component board. The method further includes using a second stencil having a second thickness to print solder paste for at least one surface mounted part on the component board, subsequent to using the first stencil.

The subject matter presented herein relates to a method for producing a backplane for electro-optic displays. The method may include providing a substrate coated with a first conductive material on a first side and a second conductive material on a second side, the second side being positioned opposite from the first side, patterning the first conductive material by cutting through the first conductive material, wherein the patterning of the first conductive material creates electrical isolated conductive segments to be controlled by a driver circuit and creating a plurality of vias on the substrate, the plurality of vias extending through the substrate and providing electrical conductivity between the first and second sides. The method may further include creating a plurality of conductive traces on the second side of the substrate by patterning the second conductive material by locally align the vias to the driver circuit.

The invention relates to a layered structure (10) comprising the following layers: a) a first substrate layer (2), wherein the first substrate layer (2) has a first surface (4) and a second surface (6) and is configured as a dielectric; b) a first electrically conductive layer (8) which overlaps at least in part the first substrate layer (2) at least on the first surface (4) of the first substrate layer (2), wherein the first electrically conductive layer (8) comprises an electrically conductive polymer, wherein the first electrically conductive layer (8) has at least one first part region (18) and at least one further part region (20), wherein the at least one first part region (18) has a higher bonding strength to the substrate layer (2) than to the at least one further part region (20).

A manufacturing method of a circuit board includes: performing a first printing process to form a first insulating layer having a first circuit depressed pattern; performing a second printing process to form a first circuit layer in the first circuit depressed pattern; checking whether a real position of the first circuit layer is diverged from a predetermined position; determining whether the shift level of the position of the first circuit layer is more than a predetermined level; performing the first printing process to form the second insulating layer, wherein when the shift level is more than the predetermined level and the thickness of a second insulating layer to be formed on the first insulating layer is not greater than a tolerance thickness, the second insulating layer has a hole at least partially overlapping the real position; and performing the second printing process to form a conductive plug in the hole.

An electronic device is provided. The electronic device includes a substrate, a first contacting element, a second contacting element and a connecting element. The substrate has a first surface and a second surface. The substrate has a through hole located between the first surface and the second surface. At least a part of the connecting element is disposed in the through hole. The first contacting element is disposed on the first surface. The second contacting element is disposed on the second surface. The first contacting element electrically connects the second contacting element through the connecting element.

A method of forming a device associated with a via includes forming an opening or via, and forming at least a pair of conducting paths within the via. Also disclosed is a via having at pair of conducting paths therein.

A method for forming a functional part in a minute space includes the steps of: filling a minute space with a dispersion functional material in which a thermally-meltable functional powder is dispersed in a liquid dispersion medium; evaporating the liquid dispersion medium present in the minute space; and heating the functional powder and hardening it under pressure.

In an aspect, an electronic device is disclosed that includes a core having an upper planar surface and an interior planar surface; a cavity extending at least partially through the upper planar surface of the core to the interior planar surface of the core; an electronic component mounted in the cavity, the electronic component including an upper planar surface having one or more electronic component terminals, wherein the electronic component is supported by the interior planar surface of the core so that the upper planar surface of the electronic component is level with the upper planar surface of the core; and an upper metallization structure configured to provide one or more conductive paths from the one or more electronic component terminals to one or more upper metal terminals of the upper metallization structure.

The steps of forming a multi-layer flexible printed circuit cable (flex circuit) with an electrical interconnection between independent conductive layers. In accordance with various embodiments, a partial aperture is formed in the flex circuit that extends through a first conductive layer and an intervening insulative layer to an underlying surface of a second conductive layer that spans the partial aperture. A solder material is reflowed within the partial aperture to electrically interconnect the first and second conductive layers.