A wiring circuit board includes a metal supporting layer, a first metal thin film, an insulating layer including a through hole, a second metal thin film disposed on the first metal thin film in the through hole, and a conductive pattern electrically connected to the metal supporting layer through the first metal thin film and the second metal thin film in the through hole. The first metal thin film includes an oxide coating at least on a contact surface in contact with the insulating layer. In the central part of the through hole, the oxide coating has a thickness of 0 or a thickness smaller than a thickness of the oxide coating on the contact surface.