A printed circuit board (PCB) includes: a substrate; and a circuit pattern disposed on the substrate, wherein the circuit pattern includes a first seed layer disposed on the substrate and including a nitride, and a metal layer disposed on the first seed layer.

A drive backboard includes: a first conductive layer including bonding pins and first connecting lines, an insulating layer including first via holes and second via holes, a second conductive layer including connecting electrodes and second connecting lines and a conductive protective layer including first protective structures and second protective structures. The first via hole exposes the bonding pin, one end of a first connecting line electrically connects a bonding pin, and the other end reaches the second via hole. One end of a second connecting line electrically connects a connecting electrode, and the other end electrically connects the first connecting line through the second via hole. The first protective structure covers the bonding pin, and the second protective structure covers the second connecting line formed at the position of the second via hole. The pattern of the conductive protective layer is complementary to the pattern of the insulating layer.

A multilayer curable resin film comprising a first resin layer comprising a first curable resin composition including a polyphenylene ether oligomer (A1) with an end modified by an aromatic vinyl group and a curing agent (A2) and a second resin layer comprising a second curable resin composition including an alicyclic olefin polymer (B1) and a curing agent (B2), a prepreg comprised of this including a fiber substrate, and a laminate, cured product, composite, and multilayer circuit board obtained using these are provided.

Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.

There is provided an electric connection member having a substrate, an insulating adhesive layer provided on the substrate, and a conductive interconnect, wherein the electric connection member is provided with a recess that opens at a side of the insulating adhesive layer, the conductive interconnect is disposed in the recess, a metal nano-ink is disposed on the conductive interconnect, and all of the metal nano-ink is contained inside the recess.

A circuit board includes conductive traces being sandwiched by an upper insulating layer and a lower insulating layer, a first array of conductive vias extending perpendicularly to the conductive traces, the vias in the first array of conductive vias being arranged such that any two adjacent vias in a row of vias extending along any given dimension in the first array of conductive vias are equally spaced from each other, and isolation resistors embedded within the first array of conductive vias such that each isolation resistor is disposed between at least two adjacent vias in the first array of conductive vias, each isolation resistor being disposed closer to the conductive via to which the isolation resistor is coupled than all other conductive vias surrounding the isolation resistor.

A component carrier and a method of manufacturing the same are disclosed. The component carrier includes a stack having a plurality of electrically conductive layer structures and a plurality of electrically insulating layer structures and a coax structure with an electrically conductive substantially horizontally extending central trace and an electrically conductive surrounding structure at least partially surrounding the central trace with electrically insulating material in between. The coax structure is formed by material of the layer structures of the stack.

A thin film board according to the present invention has a structure in which a land, which is a connection portion with a transmission line of a printed circuit board, is used as a back wiring and extends from the end to the inside of the thin film board, and the back wiring and the front wiring are connected by a through hole. In the structure of this thin film board, the land does not become a stub and does not affect the high frequency characteristics of the circuit element. That is, there is no trade-off between the connectivity between the printed circuit board and the thin film board and the high frequency characteristics of the circuit element. Therefore, the thin film board and the circuit element in which the thin film board is mounted on the printed circuit board can support high frequency electric signals up to 60 GHz.

A conductive glass substrate, and a system and a method for manufacturing the same are provided. The conductive glass substrate includes a glass substrate structure, a conductive base structure and a conductive extending structure. The glass substrate structure includes at least one through hole connected between a bottom surface and a top surface thereof. The conductive base structure is disposed on the bottom surface of the glass substrate structure. The conductive extending structure is electrically connected to the conductive base structure, and the conductive extending structure is extended from the conductive base structure to the top surface of the glass substrate structure along an inner surface of the at least one through hole. Hence, the conductive glass substrate can provide at least one conductive via so as to electrically connect an upper circuit and a lower circuit.

The object of the invention is to provide a double-sided circuit non-oxide-based ceramic substrate excellent in radiation property and low in cost, and a method for manufacturing the same. A double-sided circuit non-oxide-based ceramic substrate related to the present invention includes a high heat-conductive non-oxide-based ceramic substrate that includes a through hole, a holding layer that is formed on a wall surface of the through hole, and an electro-conductive metal section that is held inside the through hole by the holding layer and does not include an active metal. The double-sided circuit non-oxide-based ceramic substrate related to the present invention preferably includes electrodes (thin film electrodes) that shield end surfaces of the holding layer and end surfaces of the electro-conductive metal section which are exposed to front and back surfaces of the ceramic substrate.