This substrate includes an insulating substrate having a first surface and a second surface, and a metal layer of a metal plate bonded to the first surface. The insulating substrate has a through hole. The metal layer includes: a bent section that is inserted through the through hole and bulges from the first surface toward the second surface; and outer periphery sections that are positioned around the bent section and are bonded to the first surface. The bent section has a first end and a second end positioned on opposite sides, and is bent with respect to the outer periphery sections at the first end and the second ends. The outer periphery sections are divided into a first outer periphery section and a second outer periphery section, which are respectively continuous with the first end and the second end of the bent section.

In a method of producing a device in which an element structure is provided on a substrate including a through wiring, a through hole is formed so as to extend from a first surface of the substrate to a second surface of the substrate disposed on an opposite side of the substrate to the first surface, the through wiring is formed by filling the through hole with an electrically conductive material, and the element structure is formed on a first surface side. In the step of forming the through hole, a degree of surface irregularities of an inner wall of the through hole is larger on the first surface side than on a second surface side.

Discussed generally herein are methods and devices for altering an effective series resistance (ESR) of a component. A device can include a substrate including electrical connection circuitry therein, a first via hole through a first surface of the substrate and contiguous with the electrical connection circuitry, a first conductive polymer with a resistance greater than a resistance of the electrical connection circuitry filling the first via hole, and a component electrically coupled to the first conductive polymer.

An object of the present invention is to provide a printed wiring board in which conductive layers formed on two surfaces of a base layer that contains a fluororesin as a main component are reliably connected to each other through a via-hole. A printed wiring board according to an embodiment of the present invention includes a base layer containing a fluororesin as a main component, a first conductive layer stacked on one surface of the base layer, a second conductive layer stacked on the other surface of the base layer, and a via-hole that is formed along a connection hole penetrating the base layer and at least one of the first conductive layer and the second conductive layer in a thickness direction and that electrically connects the first conductive layer and the second conductive layer to each other. At least a part of an inner circumferential surface of the base layer in the connection hole has a pre-treated surface having a content ratio of oxygen atoms or nitrogen atoms of 0.2 atomic percent or more.

The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a studbump connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

The printed circuit board with at least one substrate layer having signal lines on a corresponding upper surface and on a corresponding lower surface has a sleeve-sized conductive layer on a circumference of at least one via hole between the upper and lower surface for a conductive connection between at least one signal line on the upper surface and at least one signal line on the lower surface. An axial enlargement of the sleeve-sized conductive layer is radially bent above a base layer of copper on the upper surface and below a base layer of copper on the lower surface.

Provided is a printed circuit board including a first conductive layer including a first conductive layer including a recessed portion, a protruding portion disposed at a higher level than that of the recessed portion, and a connecting portion connecting the recessed portion with the protruding portion. A second conductive layer is disposed above the recessed portion of the first conductive layer. A core layer is disposed between the first conductive layer and the second conductive layer. An upper solder resist layer is disposed on the second conductive layer. The upper solder resist layer exposes at least a portion of the protruding portion. A lower solder resist layer is disposed below the first conductive layer.

The printed circuit board with at least one substrate layer having signal lines on a corresponding upper surface and on a corresponding lower surface has a sleeve-sized conductive layer on a circumference of at least one via hole between the upper and lower surface for a conductive connection between at least one signal line on the upper surface and at least one signal line on the lower surface. to An axial enlargement of the sleeve-sized conductive layer is radially bent above a base layer of copper on the upper surface and below a base layer of copper on the lower surface.